Suitable for 2-12inch Wafers and Small Pieces, various materials Wafer Bonding processes.
For different processes and capacity requirements , wafer bonding systems can be equipped with spin coating (with EBR & BSR), hot and cold plates (optional vacuum hot plate), different numbers of bonding chambers, and inspection modules.
Suitable for different types and temperatures of bonding waxes and glues (various models with temperature resistance of 160-290℃).
Compatible with bonding of different materials such as SiC, Si, InP, GaAs, sapphire, glass.
Support air bridge, copper pillar and other processes.
Support same diameter wafer bonding.
High alignment accuracy (<100um @3sigma)
TTV Added <3um