Wushi Microelectronics (Suzhou) Co., Ltd

Suitable for 2-12inch Wafers and Small Pieces, various materials Wafer DeBonding processes.

For different processes and capacity requirements , wafer debonding system can be equipped with different numbers of debonding chambers, including thermal slip debonding / mechanical debonding / laser debonding, wafer separation, and wafer cleaning modules.

Suitable for different types and temperatures of bonding waxes and glues (various models with temperature resistance of 160-290℃)

The new debonding method can make the wafer thinning thickness more extreme (3-inch InP 45μm, 4-inch Si 30μm).

Unique loading and debonding chuck design, which can realize multi-mode debonding such as negative pressure, positive pressure, and no pressure; prevent adhensive overflow and scratches on the wafer backside.

Suitable for 2-12inch Wafers and Small Pieces, various materials Wafer Bonding processes.

For different processes and capacity requirements , wafer bonding systems can be equipped with spin coating (with EBR & BSR), hot and cold plates (optional vacuum hot plate), different numbers of bonding chambers, and inspection modules. 

Suitable for different types and temperatures of bonding waxes and glues (various models with temperature resistance of 160-290℃).

Compatible with bonding of different materials such as SiC, Si, InP, GaAs, sapphire, glass.

Support air bridge, copper pillar and other processes.

Support same diameter wafer bonding.

High alignment accuracy  (＜100um @3sigma)

TTV Added ＜3um