NSW Automation Sdn Bhd

Penang,  Simpang Ampat 
Malaysia
https://nswautomation.com/NSW/
  • Booth: 1328

Supporting world smallest component assembly #A1328 Level 1

Overview

NSW Automation, a leading force in precision fluid dispensing solutions for the microelectronics and semiconductor industries.

Breakthrough on Micro Dispensing 

NSW’s latest automated micro-volume solder paste dispensing systems are breakthrough techs. Our state-of-the-art micro dispensing technology can execute challenging tasks such as 008004 (0.008” x 0.004) or smaller SMD soldering flawlessly.

Our liquid dispenser processes EMC phosphor casting and epoxy damming. Besides these, We also support advanced materials such as gallium and other materials such as die coating, adhesives, epoxy, and many more.

Similarly, some manufacturing materials that our equipment able to support such as solder paste, phosphor, and adhesives. Moreover, we also support UV glue, TiO2, silver epoxy, silicone gel, high/low viscosity epoxies, and many more listed below.

Unlocking the Power of Specialized Materials in Micro-Dam Solutions.

Micro-DAM unfolds a new horizon of microelectronics heterogeneous integration and packaging. It prints a microscopic “wall” to contain the underfilled material within a narrow components footprint to prevent undesirable production defects, such as components failure due to CTE (coefficient of thermal expansion) effects. The width of printed “wall” can be achieved as thin as 100um with a height of 10X aspect ratio at one go. NSW's Micro-DAM technology can be employed in as 3D printer to “Print” high-resolution microscopic objects when conventional 3D printers cannot achieve fine details using regular filaments. Similarly, Micro-DAMs in small-scale 3D printing, are utilized to control the flow of printing materials, such as polymers or resins, which improves the accuracy and resolution of the printed structures.

Aside from these two solutions, NSW’s micro-dispensing solution is also applicable for various materials such as conductive silver epoxies, UV adhesives, silicone gel, epoxies, etc. With over 20 years of experience in the advanced dispensing industry, the company remains committed on delivering precision liquid dispensing solutions to support the customers’ automated dispensing needs, serving industries such as EVs, semiconductor miniaturization, MEMS, SiP/PoP Pacakges green energy, aerospace, consumer and wearable devices as well as 5G photonics.


  Products

  • Additive Micro-DAM Solutions
    Micro-damming as know as “Micro-DAM”, “Additive Structural Printing” or Micro Dam and Fill, is an adaptive microfluidic barrier printing technology....

  • Micro-DAM unlocks a NEW realm for today’s microelectronic heterogeneous manufacturing, it’s a transformative solution that create limitless possibilities for devices miniaturization and advancement of product uniqueness.

    Micro-DAM printing technology build high-aspect ratio microscopic structure onto a confined space of miniaturized devices via industrial grade material such as Ultraviolet-sensitive (UV) polymer. Printable surface includes micro-gaps between components, different height cavities, flat, curvy, protruded surface and etc. It created significant advantages for the revolutionary product design and manufacturing that amplifies market value.

    It is a next-level liquid dispensing application for “printing” microscopic barriers – also known as “Micro Dam and Fill”. High viscosity liquid are stacked layers by layers to create a microstructure similar to a dam barries, these barriers confine and control the spread of liquids, underfill or fluids of a product.

  • Conductive Micro Dispensing Solutions
    Embark on a New realm of miniaturization revolutions with NSW Micro dispensing technology!...

  • NSW microdispensing technology focuses on nanoscopic dispensing. This is an exceptional technology amongst the precision fluid dispensing market. Are you looking for dispenser solutions to dispense various types of controlled release materials? What if it can dispense the diminutive wafer-level size a hundred times smaller than the human hair? 

    Manufacturing Processes with NSW Applications:

    • Micro-Damming (Micro-DAM)
    • Metaverse, Wearable Tech Assembly
    • 5G Module and Device Manufacturing
    • FPCB or PCB Dispensing
    • Micro Soldering (Solder paste Dispensing)
    • Flip-chip Packaging
    • Micro 3D SiP, SiP Packaging
    • 008004, 01005, 0201 SMD Soldering
    • Underfill Process
    • MEMs Dispensing
    • VCSEL Manufacturing
    • Chip on Board (COB) Process
    • CMOS Assembly
    • Glasses/Lens Edge Coating
    • EMC
    • Dam and Fill
    • Hot Melting
    • LED Encapsulation
    • EVs ECU & Module Assembly
    • Surface Mount Adhesive
    • Solder Paste Micro Bumping
    • Lid Attach Dispensing
    • Trench or Cavity Filling
    • Wafer Level Dispensing and Process
    • Die Coating
    • Coating or Sealing Process
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