ACCRETE + TECHNOLOGY = Welcome to ACCRETECH!
Overview
As one of the leading machine makers in Semiconductor Production Equipment, Tokyo Seimitsu Co., Ltd. (Accretech) is no stranger in the market providing high quality and cutting-edge technology solutions to semiconductor market.
Accretech provides diversification in material processing, notably wafer dicing which includes conventional blade dicing & laser dicing for high requirement. As for grinding process, our PG3000RMX offers comprehensive solution with various applications in one system, and our hot hatch HRG grinder excels in high throughput & accuracy, both focusing in sophisticated wafer thinning and damage-less removal.
For wafer probing, AP3000 & AP3000e has proven their stability in front end wafer fabrication process.
Visit us at Level 1 Hall 2 booth A1604 to understand more!