Besi (BE Semiconductor Industries N.V.)

Duiven, 
Netherlands
  • Booth: N562
  • - 4th Floor

Besi - Leading assembly equipment.

BE Semiconductor Industries N.V. (Besi) with its members Datacon, Esec, Fico, and Meco, is a leading manufacturer of flip chip and multi-chip die bonding, die attach (epoxy and soft solder), die sorting, wire bonding, packaging and plating equipment. Besi offers the most complete advanced packaging solution from die sorting to singulation – all from one source.

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