Extreme Temperature Test has been required in the Memory Test Envoironment.
TSE has developed our own specialized Interface Board System for Extreme Temperature Pacakge Test.
Extreme Temperature TIB(Test Interface Board)
- Extreme temperature Connector developed
- Docking Epoxy Frame Material developed
- Direct Cooling Interface Board developed
- Coolant, Direct Active IC Cooling
- Component Antioxidants
- Temp. Reduced stabilization time