Dressing board is used to get a better cutting quality and throughput of dicing blade in IC Assembly front end-Wafer saw process. Dicing blade can be newly pre-shaped and re-sharpened via dressing board to stabilize processing, and to minimize the chipping of as-cut die edge.
Features:
- Dressing board, with flatness to firmly suction on chuck table larger than 80Kpa, can efficiently remove clogging and glazing of dicing blade with less consumption.
Application:
- Dressing board is used to pre-shape a new dicing blade by trimming its uneven edge and to expose diamond grits on its edge for cutting.
- Dressing board is used to re-sharpen a dicing blade by interval dressing to restore and maintain the stable cutting ability during processing.
Specification:
Dressing Board | Dimension (mm) | Grit of Dicing blade |
DB F30 | 75x75x1 | D1800~D3000 |
75x37.5x1 |
DB F40 | 75x75x1 | D3500~D4500 |
75x37.5x1 |
DB F50 | 75x75x1 | Over D4500 |
75x37.5x1 |