Electrovert cleaning equipment plays a critical role in semiconductor fabrication and are utilized in multiple steps, including degreasing, cleaning prior to electroplating and underfill, cleaning after bumping and wire bonding, and carrier debonding of fan-out packages.
Cleaning helps to remove flux residue, excess adhesive, grease and oils to ensure proper bonding and material distribution and avoid defects and increase yields. Electrovert cleaners are designed to deal with small, lightweight semiconductor products such as lead frames, BGAs, wafers and 3D stacked packages.
The Aquastorm™ delivers a small spray-jet mist that is less than 40 PSI. It delivers a dynamic combination of chemistry, thermal, and mechanical forms of energy at the surface to effectively clean under low stand-off and difficult to clean components. Integrated into the machine cabinet, the Torrid Zone™ delivers a controlled dynamic process that effectively removes moisture. Typical performance includes drying complex assemblies to within 0.1 gram of prewashed dry weight. The technology reduces exhaust requirements by 44% and uses 15% less power than conventional drying systems
The MicroCel™ cleaner uses centrifugal energy for unparalleled penetration, solubilization and containment removal for advanced packages including flip chips, MCMs, SIPs, BGAs, CSPs, and hybrid electronics.
Electrovert 清洗設備在半導體製造中起著至關重要的作用,並且用於多個步驟,包括脫脂,電鍍和底部填充之前的清洗,倒裝焊和引線鍵合以及扇出封裝的載體剝離之後的清洗。
清洗有助於去除殘留助焊劑、多餘的粘合劑、油脂和油,以確保適當的結合和材料分佈,避免缺陷並提高良率。 Electrovert 清洗機旨在處理小型,輕巧的半導體產品,例如導線架,BGA,晶圓和 3D 堆疊封裝。
Aquastorm™ 提供的噴射霧小於 40 PSI。它在清洗表面提供了化學,熱和機械形式能量的動態組合,可以在較低的支撐距離和難以清潔的組件下進行有效清洗。
灼熱烘乾區整合在機櫃中,提供受控的動態過程,有效去除水分。典型性能包括將複雜組件乾燥至清洗前乾重量的 0.1 克之內。與傳統的干燥系統相比,該技術將排風需求減少了 44% 並且耗電量減少 15%。
MicroCel™ 清洗機利用離心能,具有無與倫比的滲透,溶解和密封消除,適用高級封裝,包括覆晶,MCM,SIP,BGA,CSP 和混合電子產品。