辛耘企業股份有限公司

東區,  新竹市 
Taiwan
http://www.scientech.com.tw
  • Booth: M0246
  • - 4th Floor

辛耘企業成立於1979年10月，為台灣半導體產業中最具歷史與經驗的供應商之一，初期以半導體設備代理為主，往後所代理產品線再延申至第二代半導體、第三代半導體、LED、Flat  Panel 、太陽能與生物化學分析儀器等領域；2003年設立新竹湖口工廠後，辛耘從設備代理商跨足到半導體濕式製程設備及暫時性貼合製程設備的研發製造，並已成功出貨到國內外晶圓代工、晶圓級先進封裝及 LED客戶。
2006年，辛耘企業投入12吋晶圓再生服務，公司位於新竹湖口工廠的再生晶圓廠，月產能達十四萬片。2014年，辛耘正式完成全球第一條碳化矽（SiC）再生晶圓之產能建置，目前月產能已可達到一千片，展現出辛耘企業在專精服務領域與研發技術能力上不斷精進與升級的企圖心。
公司發展至今，憑藉著多元且完整的軟、硬體產品線，以及專業快速的售後服務，已在台灣、大陸、亞洲與歐洲等地建立了優良口碑，並於2013年三月掛牌上市。辛耘為提供客戶最優質的產品與服務，公司現有自製設備製造、晶圓再生服務與代理產品三大事業群，都已獲得ISO9001 、ISO27000 、ISO22301 以及TIPS-AA認證。
除致力於研發製造自有品牌產品，辛耘企業同時非常重視對客戶的服務，公司強調團隊合作、專業技術、客戶滿意、永續經營的經營理念，並秉持「客戶在哪，辛耘隨即在側 」的精神。目前辛耘在台灣設有六個營運據點，在中國大陸，則於北京、天津、上海、無錫、重慶、武漢、深圳、昆明等地設立辦服務據點，並在美國加州矽谷，歐洲及新加坡也設有辦事處，公司未來並將持續擴張版圖，以強化服務客戶的品質與速度。

 Press Releases

    • 12吋半導體先進封裝濕製程設備（包括單晶圓與批次晶圓）及暫時性貼合製程設備已正式出貨全球半導體代工龍頭及先進封裝一線大廠。
    • 辛耘正式完成碳化矽（SiC）再生晶圓產能建置。
    • 辛耘提供客戶最優質的產品與服務，以滿足顧客需求，成為世界級的先進科技供應商，公司現有自製機台製造、晶圓再生服務與代理產品三大事業群，都已獲得ISO9001認證。並於2013年三月掛牌上市.
    • 辛耘致力於發展自有產品政策，2004年起即開始投入研發經費及設立生產工廠，至今已陸續發展出許多應用於半導體、LED、太陽能及砷化鉀前段、後段濕製程設備，包括清洗、蝕刻、黃光顯影、光阻去除、去蠟、電鍍化鍍、乾燥機台； 並已開發出高階封裝及 IGBT用暫時性貼合製程設備；且以自有品牌「SCIENTECH」製程設備產品成功打入海內、外市場。
    • 2006年，辛耘企業再投入12吋矽晶圓再生服務，公司位於新竹湖口工廠的再生晶圓廠，月產能達十四萬片。
    • 除致力於研發製造自有品牌產品，辛耘企業同時非常重視對客戶的服務，公司強調團隊合作、專業技術、客戶滿意、永續經營的經營理念，並秉持「客戶在哪，辛耘隨即在側 」的精神。目前辛耘在台灣設有六個營運據點，在中國大陸，則於北京、天津、上海、無錫、重慶、武漢、深圳、昆明等地設立辦服務據點，並在美國加州矽谷，歐洲及新加坡也設有辦事處，公司未來並將持續擴張版圖，以強化服務客戶的品質與速度。

 Products

  • 4” & 6” SiC Wafer Reclaim
    Scientech is not only a leading supplier of 300mm wafer reclaim service, but also 4” & 6” SiC wafer reclaim....

    • Scientech provides 4” & 6” SiC wafer reclaim service by professional reclaim technique, new equipment/ utility and advanced process technology for high quality SiC substrates.

    Process Capability

    • Grinding

    - Surface roughness, Ra: ~1nm

    - TTV: < 3um

    •  Polishing

    - Surface roughness, Ra: ~1A

    •  Cleaning

    - Surface cleanness, LPD <0.3um

    - Surface Metal < 1E10 Atoms/cm2 (By ICP-MS)

    •  Inspection(Geometry/ Defect)

    - FRT/ Candela

  • 12” Wafer Reclaim & 12” Test Wafer
    Scientech is a leading supplier of 300mm wafer reclaim service and 300 mm test wafer. Our output capacity is 160k/M for completely separated Cu and Non-Cu wafer reclaim process. For more detail, please refer to http://www.scientech.com.tw....

    • Scientech provides 12” wafer reclaim service and 12” test wafer.  Our team is formed by professional reclaim technique, new equipment/ utility and advanced process technology for 7/5 nm IC design rules.  Our customers are covered in major Logic, DRAM Fab, equipment, and research lab worldwide. 

    Our Mission：

    •  Minimum Removal Rate
    •  Maximum Return Rate
    •  Minimum Return Time
    •  Robust Quality System
    •  Accurate Tracing System
    •  Quick Respond System
  • Soaking & Spray Equipment - Sirius
    “Sirius” equipment is latest developed soak and spray technology by using single wafer process platform. Please refer to http://www.scientech.com.tw for the products we represent and we design/manufacture.<br /><br />...

    • 辛耘企業於2002年開始投入批次式及單晶片式濕式製程設備研發製造，已經獲得國內外客戶採用與肯定。目前辛耘擁有 5,000 m2生產製造廠房，同時擁有 Class 10 等級無塵室服務客戶製程需求驗證平台。產品包含手動 / 半自動 / 全自動的批次式及單晶片製程設備提供客戶2”~ 12”製程應用需求。特有的 cassette type / boat type / cassette-less type 技術提供半導體晶圓、藍寶石、玻璃、LED、太陽能晶圓、薄化晶圓等應用。另外，辛耘企業擁有的專利產品”Advantech Dry”提供客戶各種關鍵旋乾的製程應用。

    辛耘新開發Sirius系列設備，結合批次式及單晶片式濕製程優點並擁有特殊垂直高壓噴洗技術提供製程彈性。應用領域含括:

    Sirius Series濕製程設備:

    • Applications :
    • Advanced Packaging / Bumping
    • Compound Semiconductor
    • LED / Mini LED / Micro LED

    Process :

    • MLO (Metal Lift-off)
    • Dry Film PR Strip

    辛耘企業的特色：

    • 客製化軟硬體設計服務
    • 專業與快速的售後服務
    • 安全設計兼具簡易操作
    • 主動協助客戶快速量產
  • Wet Process Equipment
    Scientech is a leading supplier for Wet Process Equipment which include Wet Bench and Single Wafer Wet Process Tools.<br />Please refer to http://www.scientech.com.tw for the products we represent and we design/manufacture.<br />...

    • 辛耘企業於2002年開始投入批次式及單晶片式濕式製程設備研發製造，已經獲得國內外客戶採用與肯定。目前辛耘擁有 5,000 m2生產製造廠房，同時擁有 Class 10 等級無塵室服務客戶製程需求驗證平台。產品包含手動 / 半自動 / 全自動的批次式及單晶片製程設備提供客戶2”~12”製程應用需求。特有的 cassette type / boat type /e cassette-lett type 技術提供半導體晶圓、藍寶石、玻璃、LED、太陽能晶圓、薄化晶圓等應用。另外，辛耘企業擁有的專利產品”Advantech Dry”提供客戶各種關鍵旋乾的製程應用，應用領域包括:

    Single Wafer單晶片式濕製程設備 ( Polar Series ):

    Applications :

    Advanced Packaging / Bumping

    Semiconductor : BEOL, GaAs

    Process:

    UBM / Metal Etch

    Si Etch / Oxide Etch

    Flux Clean

    PR Strip

    Mask Clean

    Frame type Clean

    Final Clean

    Wafer Clean (APC, Soft Spray)

    Wet Bench批次式濕製程設備 ( WSE Series):

    Applications :

    Advanced Packaging / Bumping

    Semiconductor : FEOL, BEOL, GaAs

    LED / Solar cell

    Process :

    Etch: Metal, UBM, Oxide removed, Si3N4 removed

    Stripper: PR/PI strip, Polymer remove,

    Clean: Pre-clean, Post clean, Flux clean

    Plating: Electro-less plate (Zn/Ni/Au), Electric plating (Cu/Ni/SnAg)

    辛耘企業的特色：

    客製化軟硬體設計服務

    專業與快速的售後服務

    安全設計兼具簡易操作

    主動協助客戶快速量產

  • Temporary Bonding De-bonding System
    “Sirius” equipment is latest developed soak and spray technology by using single wafer process platform. Please refer to http://www.scientech.com.tw for the products we represent and we design/manufacture....

    • 辛耘企業於2015年開始投入暫時性貼合設備研發製造，已經獲得國內外重要客戶採用與肯定。目前辛耘擁有 5,000 m2生產製造廠房，同時擁有 Class 10 等級無塵室服務客戶製程驗證平台。產品包含手動/半自動/全自動的暫時性貼合、剝離、解離層成型及載具清洗回收系統，提供客戶6”~12”製程應用需求。

    TBDB暫時性貼合/剝離設備 (Pyxis series):

    • Applications :
      • Power Device: IGBT, MOSFET
      • Advanced Packaging: Fan-out, 3DIC, TSV, 2.5D Interposer
    • Process:
      • Temporary Bonding System
      • Temporary De-bonding System
        • Frame De-bonding System
        • Taiko De-bonding System
      • Release Layer Formation System
      • Carrier (Glass) Recycling System

    我們的特色：

    • 客製化軟硬體設計服務
    • 專業與快速的售後服務
    • 安全設計兼具簡易操作
    • 主動協助客戶快速量產
  • Representative Business of Scientech Corporation
    Representative Business of Scientech covers the following industries: Semiconductor, Compound Semiconductor, LED, Flat Panel Display, Solar Cell, Battery, Biotech, Chemistry Analysis and Scientific Instrument....

    • Mask / Reticle
    Mask Dry Etcher, CD / Overlay Metrology, E-beam Writer, Reticle Cassette

    Lithography Process
    Stepper, Coater / Developer, Curing Furnace, Mercury Lamp

    Etch Process
    Dry Etch, Plasma Cleaning / Descum, End Point Detection

    Thin Film & Thermal Process
    High Pressure Gas Anneal and Oxidation Furnace, Electro-Plating System, PECVD, CVD, Pulsed Laser Deposition, RTP

    Metrology & Inspection
    Optical / Stylus Profiler, Standards, AFM, 3D X-Ray Microscopy, Laser Marker, Isolation Systems, Stress Meter, Nanoindenter

    Sub-Systems & Others
    Power Supply, RF Generator, Robot, EFEM, Pressure Sensor, Valves, Metal Cassette, Magazine, KVM

    Flat Panel Display
    Dry Etch, PECVD, Annealing Furnace, PI Curing Furnace, PVD, Mask / Cassette Cleaner, Optical / Stylus Profiler, AP Plasma Clean

    Battery
    Cell Stacking, Degas, X-ray inspection, Secondary Battery Cell Automation Production Tools

    Analytical Inst.
    Particle Sizer, Pre-Treatment, Element Analyzer

Categories

200 Equipment, Assembly
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Marking; Imprinting; Labeling Equipment
  • Plating; Electro Chemical Plating for device assembly
  • Solder Reflow; Soldering & Brazing Equipment
  • Wafer Level Bonders
    • 202 Equipment, General Use
  • Heating; Annealing; Curing Equipment - Furnaces; Conveyors; Ovens; Test Chambers; Heat Treating
  • Vibration Isolation Systems
    • 203 Equipment, Inspection & Measurement
  • Defect; Particle; Bump; Contamination Detection, Review or Inspection
  • Film Thickness; Thickness; Uniformity Measurement; Ellipsometer
  • Line Width; Critical Dimension (CD) Measurement
  • Microscopes: Atomic Force Microscopes (AFM)
  • Overlay Measurement
  • Resistivity Measurement; 4 point probe; Sheet resistance
  • Stress; Refractive Index; Reflectivity & Conductivity Measurement
  • Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation
  • X-ray; XRF; 3-D X-Ray; LEXES Systems
    • 204 Equipment, Mems
  • Deep RIE etching; Dry Etching
    • 207 Equipment, Process
  • Cleaning; Washing; Drying Equipment for Substrate, Fab Processing
  • Coat; Develop; Resist Processing; Track Equipment
  • Deposition; Chemical Vapor (CVD); MOCVD; PECVD; LPCVD; ALD; REALD; MVD
  • Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment
  • Etching; Stripping; Ashing - Dry and Wet Equipment
  • Lithography; Exposure; Aligners; Direct Write Systems; Steppers; Scanners; Nanoimprint
  • Plating; Electro Chemical Plating; Deposition Systems
  • SOI Bonders; Temporary Bonders; De-Bonders
  • Thermal Processing - Diffusion; Oxidation; Annealing; RTA; RTP Equipment
  • Transfer Systems for Wafer; Reticles or FPD's
  • Wafer Identification; Marking Equipment
    • 300 Materials, Assembly
  • Thermal Interface Materials; Heat Sinks
    • 301 Materials, Chemicals & Solids
  • Acids; Etchants
    • 308 Materials, Substrate
  • Test; Monitor Wafers; Reclaim or Virgin
    • 400 Components, Parts & Accessories
  • Lamps (non Lithography), all type UV; LED and other
  • Lamps for Lithography
  • Vacuum Systems Components & Accessories (optical monitors; Sputtering target fixtures; lubricants; p
    • 401 Sub-systems
  • Computer ; Control ; Communication ; Data Acquisition Systems
  • Handling; Transfer; Loading Systems; Lifting devices
  • Power Supplies; RF Generators; Converters; Electrical Conditioning
  • Pumps, Vacuum
  • Temperature Sensing; Control; Recirculators; Chillers; Heat Exchangers
    • 502 Material Handling Systems
  • Robotics; Transfer Systems
    • 900 Support Products
  • Analytical Standards; Calibrators
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