Features
1 Flux Printing
①Reduced flux bleeding by gap printing.
②Stable transfer position by one-direction printing mechanism.
③Minimized cleaning frequency.
2 Ball Mounting
①New Infinity Head (Triple Type Rotary and Closed Type Squeegee)
②Higher Throughput
③Minimized sweeping frequency(1/3 compared with the conveintional type)
④Increased solder ball use efficiency(1/2 compared with the conventional type)
3 Inspection and Repair
①Enable to systematize ball mounting system with inspection and repair equipment.
Specifications
No. | Items | Specifications |
ABM-04G-WFS | ABM-04S-WFS |
1 | Wafer Size | Φ300mm Φ200mm | Φ300mm Φ200mm |
2 | Handling System | Load port (FOUP or FOSB) | Load port (FOUP or FOSB) |
3 | Applicable Ball Size | 40um~300um | 80um~300um |
4 | Alignment Accuracy | <±10um | <±15um |
5 | Flux Printing | Gap Printing (Single Direction) | Gap Printing (Single Direction) |
6 | Ball Mounting | Adopted New Infinity Head (Triple Type Rotary & Closed Type Squeegee) | Adopted New Infinity Head (Triple Type Rotary & Closed Type Squeegee) |
7 | Ball Missing Rate | <20ppm (as per AIM’s test conditions) | <30ppm (as per AIM’s test conditions) |
8 | Throughput | 65UPH (as per AIM’s test conditions) | 40UPH (as per AIM’s test conditions) |
9 | Equipment Size | 3995(W)x2150(D)x2020(H)mm | 3555(W)x2150(D)x2020(H)mm |
10 | Equipment Weight | Approx. 3,500kg | Approx. 3,300kg |
Application
Wafer such as WLCSP,FOWLP,etc.