Bringing efficiency and high productivity to advanced packaging assembly
The High-Speed Wafer Feeder is the world’s fastest rapid-exchange multi-die feeder. Combined with Universal’s FuzionSC™ Platform, it is the ultimate multi-die solution delivering highest utilization and efficiency for heterogeneous integration and EV power module assembly.
• 14 high-precision (sub-micron X,Y,Z) servo-driven pick heads
• High-precision (sub-micron X,Y,Z) servo-driven ejector
• 100% pre-pick vision and die alignment
• One-step “wafer-to-placement” handoff
• Synchronous wafer stretch and storage
• 16K cph dual wafer tables
• Up to 52 unique wafers types at once; 100mm,
150mm, 200mm, 300mm
Performance and Value
• Maximum die size range with thinnest die
• 4X throughput improvement vs current generation
• Maximum panel size processing up to 635mm x 610mm
The High-Speed Wafer Feeder delivers value with the precision, performance, and flexibility to handle today’s most advanced applications while also enabling you for those to come