Wafer Level Solder Ball Mounter
ABM-04G-WFS
Enabled High Quality & Stable Production by Special Flux Printing Technology and Infinity Squeegee Head.
Main Features:
* Ensure and deliver mass-production by 40um solder ball.
Flux Printing
・Reduced Flux Bleeding by Gap Printing.
・Stabled Transfer Position by One-direction Printing Mechanism.
・Minimized Cleaning Frequency.
Ball Mounting
・New Infinity Head (Triple Type Rotary & Closed Type Squeegee)
・Higher Throughput.
・Minimized Sweeping Frequency (1/3 compared with the conventional type)
・Increased Solder Ball Use Efficiency (1/2 compared with the conventional type)
Other Options:
• Inline Integration to Inspection & Repair System.
• Customized to run Film Frame Carrier.
New concept product, Plasma Laser Repair
ALR-04G-P4
Plasma Laser Repair Equipment for Semiconductor Packages enabling Yield Improvement.
Main Features:
・Enabled Inspection and Repair for Solder Ball Drop Defects during Reflow and De-Flux Cleaning Process after Ball Mounting.
・Realized Spot Reflow soldering (local soldering for only repairing points) by integrating Plasma and Laser Technologies.
・Minimized Reflow Process impacting qualities of Semiconductor Packages.
・Realized Inspection & Repair for Ball Drop Defects during Reflow and Cleaning Process.
・High Speed Overall Surface Inspection for Works.
・Flux dipping & High Precision Solder Ball Mounting.
・Soldering by Plasma & Laser technologies.
・Proposal for Off-Line or In-Line System.