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ITW EAE

Singapore,  Singapore
http://www.itweae.com
  • Booth: L0416

Welcome to ITW EAE.

Overview

ITW EAE, a division of Illinois Tool Works, Inc., is the global leader in process knowledge, services and manufacture of capital equipment used in the printed circuit board assembly and semiconductor industries. The group brings together the world’s leading brands of electronics assembly equipment: MPM Printers, Camalot Dispensers, Electrovert Cleaners and Soldering Solutions, Vitronics Soltec Soldering Solutions and Despatch Thermal Processing Technology. 

ITW EAE plays a major role in semiconductor packaging, including stencil printing solder bumps, dispensing underfills and encapsulant liquids, thermal processing die attach adhesives, cleaning before and after wire bonding, solder ball reflow and cleaning and more. ITW EAE works with the world’s leading semiconductor manufacturers in developing equipment that addresses evolving technical challenges while also meeting the need for higher throughput, yield, and performance. For more information visit www.itweae.com.


  Press Releases

  • Lakeville, Minnesota, September 4, 2023 – ITW EAE will be showcasing its latest developments at Semicon Taiwan, September 6-8 at Taipei Nangang Exhibition Center in Taiwan. The ITW EAE booth L0416 will have MPM, Camalot, Electrovert and Vitronics Soltec Applications Experts on hand as well as Sales and Management to answer questions and offer solutions.

    Camalot will be presenting live demonstrations of its Advanced Tilt and Rotate dispensing system. This innovative and new Camalot design reduces wet out areas and improves capillary flow for underfill by accurately dispensing on the side walls of packages. State-of-the-art rotary actuators provide a fast, high precision, zero backlash mechanism that allows proprietary motion and controls allow articulation of the dispense pump in sub-degree increments for both axes as many times as you need, in other words total flexibility.

    MPM will present the Edison stencil printer.  Edison has the industry leading accuracy and repeatability performance and is designed for SEMI printing challenges with proven ≥2CPK on 0201M spec supported by patented technologies. MPM will also display the EnclosedFlow print head patented technology with proven history in SEMI applications, delivering superb performance for super fine aperture and spacing printing jobs.

    ITW EAE plays a major role in semiconductor packaging, including stencil printing solder and flux, dispensing underfills and encapsulant liquids, thermal processing die attach adhesives, cleaning flux residue and remains, solder reflow and more. ITW EAE works with the world’s leading semiconductor manufacturers in developing equipment that addresses evolving technical challenges while also meeting the need for higher throughput, yield, and performance.

    For more information visit https://www.itweae.com.


  Products

  • Electrovert® Aquastorm®
    Electrovert cleaning equipment is designed to provide complete cleaning process flexibility, superior cleaning and drying performance, process monitoring, and reliability....

  • Electrovert cleaning equipment plays a critical role in semiconductor fabrication and are utilized in multiple steps, including degreasing, cleaning prior to electroplating and underfill, cleaning after bumping and wire bonding, and carrier debonding of fan-out packages.  .

    Cleaning helps to remove flux residue, excess adhesive, grease and oils to ensure proper bonding and material distribution and avoid defects and increase yields. Electrovert cleaners are designed to deal with small, lightweight semiconductor products such as lead frames, BGAs, wafers and 3D stacked packages. 

    The Aquastorm® delivers a small spray-jet mist that is less than 40 PSI. It delivers a dynamic combination of chemistry, thermal, and mechanical forms of energy at the surface to effectively clean under low stand-off and difficult to clean components. 

    Integrated into the machine cabinet, the Torrid Zone™ delivers a controlled dynamic process that effectively removes moisture. Typical performance includes drying complex assemblies to within 0.1 gram of prewashed dry weight. The technology reduces exhaust requirements by 44% and uses 15% less power than conventional drying systems.

  • MPM EnclosedFlow Print head
    Patented technology with proven history in SEMI. Delivering superb performance for super fine aperture and spacing printing challenge....

  • MPM’s EnclosedFlow print head system offers improved volume deposition and maintainability and at the same time reduces process cycle time, paste waste, and operator intervention. Offered on MPM Momentum® series and Edison printers, EnclosedFlow provides unprecedented process control and reliability.  EnclosedFlow features an all new positive-displacement, servo-driven pressure system that controls paste pressures to within ±0.1 psi, setting a new standard in the industry. 

  • Camalot Advanced Tilt and Rotate dispensing
    Award winning technology that provides reduced wet out areas, improved capillary flow for underfill by accurately delivering on the side walls of packages....

  • This innovative and new Camalot design reduces wet out areas and improves capillary flow for underfill by accurately dispensing on the side walls of packages. State-of-the-art rotary actuators provide a fast, high precision, zero backlash mechanism that allows proprietary motion and controls allow articulation of the dispense pump in sub-degree increments for both axes as many times as you need, in other words total flexibility.
  • Vitronics Soltec Centurion
    Best-in-class thermal performance and improved sustainability, meeting the most critical and demanding reflow Industry's....

  • Centurion Reflow Oven.

    A forced-convection SMT reflow system with tight, closed-loop process control, built for today’s high-throughput PCB assembly environments. With the best heat transfer in the industry, the Centurion is able to run any profile at the lowest set point possible, which minimizes the thermal differences over the product and uses less energy.

    Features:

    • Thermal performance stability and repeatability
    • Comprehensive flux management solutions for all applications
    • Advanced Closed-loop cooling controls
    • Industry 4.0 Offerings
    • SECS/GEM ready
    • CE and Semi Standards compliant
    • Lifetime warranty on heater and cell fan