Smart Manufacturing: The Key Opportunities and Challenges of the Next Generation of Manufacturing for the Electronics Value Chain

  • Location:Keynote Stage, North Hall, Room 134
Thursday, July 14, 2016: 10:30 AM - 12:30 PM

Speaker(s)

Speaker
Sia Langrudi
VP, Worldwide Strategy and Business Development for Electronics & Semiconductor
Siemens
Speaker
Tony Graves
VP IoT, GM Industrial & Energy Solutions Group
Intel
Moderator
Brian Haas
VP, Global Customer Experience
KLA-Tencor
Speaker
Kirk Hasserjian
Corporate Vice President, Silicon Systems Group
Applied Materials
Speaker
Nozad Karim
VP, SiP & System Integration
Amkor Technology
Speaker
Rajeev Rajan
VP IoT
GLOBALFOUNDRIES

Description

Where can the IC sector make the most gains from gathering and analyzing more data across its fabs and packaging, assembly and test plants?  And what are the solutions needed to meet the industry’s common challenges in integrating even more data across more areas to extract actionable information, while protecting IP across companies? We’ve invited some of the sector’s major players to talk about what they see coming next.

 


Track



    Presentations:
    • Location:Keynote Stage, North Hall
    • Thursday, July 14, 10:30 AM - 10:55 AM
      • Location:Keynote Stage, North Hall
      • Thursday, July 14, 10:55 AM - 11:20 AM
        • Location:Keynote Stage, North Hall
        • Thursday, July 14, 11:20 AM - 11:45 PM
          • Location:Keynote Stage, North Hall
          • Thursday, July 14, 11:45 AM - 12:10 PM
            • Location:Keynote Stage, North Hall
            • Thursday, July 14, 12:10 PM - 12:35 PM