Palomar Technologies

2728 Loker Ave W
Carlsbad,  CA  92010

United States
http://www.palomartechnologies.com
  • Booth: 5952


Die attach, wedge, wire bond demos & more in booth #5952!

Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of die attach solutions, wire bonding equipment, optoelectronic packaging systems and contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to obtain precision wire and ball bonders and automated component placement systems. Palomar Technologies Assembly Services (TM) is the contract assembly, process development, prototyping and test division of Palomar Technologies. Customers utilize the solutions from Assembly Services to achieve high-precision, high-accuracy die attach and wire bonding services without the need to invest in capital equipment.


 Press Releases

  • Carlsbad, CA – July 6, 2016 – Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced product demos at SEMICON West 2016. The 9000 Wedge Bonder, 3880 Die Bonder, and SST 5100 with QuikCool systemTM will be showcased through live demonstrations in booth #5952 on July 12-14 at the Moscone Center in San Francisco, CA.

    Test Drive the New 3880 Die Bonder at SEMICON West 2016

    Palomar Technologies' new 3880 Die Bonder features a fully integrated Z-Theta bidirectional bond head enabling reduced maintenance and uniformity across a wide range of applications. The new machine’s combined fine placement accuracy, fast indexing time, and excellent tool planarity and repeatability make it the most advanced die bonder platform available today. Presentation options include wafer, waffle/gel pak, tape and reel, boat, and carriers. Custom stages are also available.

    In the early 1990s, Palomar developed the “tool turret” design which has become standard on all of our die bonders. This tool turret is outfitted with 8 tools and designed for customers who require maximum flexibility while maintaining throughput and yield. We designed the 3880 Die Bonder by keeping the tool turret idea and maintaining 8 tools. Several new features were added to improve capabilityspeedservice reliabilityease of operation, and cost-of-ownership.

    Automated High-Speed Fine Wire Wedge & Ribbon Bonder Demos

    Along with the 3880 Die Bonder, attendees at the show will be able to view a full application demo of the 9000 Wedge Bonder with inline handlers using i2Gi®: Intelligent Interactive Graphical Interface®.  The 9000 Wedge Bonder offers ultimate control and flexibility to change from a 45-60° wire feed range to 90° deep access with only a clamp change on the robust, theta-rotation bond head.

    SST Vacuum Reflow Systems Announce New QuikCoolTM Auxiliary Cooling System

    Also on exhibit in the Palomar Technologies booth will be SST’s new auxiliary cooling system option for their Model 5100 Vacuum Pressure Furnace. The QuikCool system is in response to customers who wanted to know how they could increase batch production throughput, thus reducing costs and increasing the volume of units produced. By quickly reducing the chamber’s temperature after reflow, process cycle time is reduced, thus allowing more production cycles per hour.

    Be sure to stop by the booth if you are visiting SEMICON West, check out a demo, and speak with our experts about your application challenges.

    About Palomar Technologies

    Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit www.palomartechnologies.com.

    ###

    Contact
    Katie Finney
    Marketing Communications Manager
    Palomar Technologies, Inc.
    kfinney@bonders.com | +1 760-931-3680


 Products

  • 9000 Wedge Bonder
    The 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder, offering the flexibility to change wire feed angles to 45-60° or 90°deep access on a single large work area. ...

  • The 9000 Wedge Bonder offers ultimate control and flexibility to change from a 45-60° wire feed range to 90° deep access with only a clamp change on the robust, theta-rotation bond head. No need for multiple expensive bond heads!

    LARGE BONDING AREA
    305 x 150 mm (12” x 6”)

    AUTOMATED ASSEMBLY 
    Material handler options
    available for full production
    line assembly. Unheated and heated work
    stages available.

    QUALITY CONTROL 
    Real-time bond monitoring and process
    control software. Robust, low maintenance voicecoil bondhead.

    BOND DATA MINER™ - comprehensive and centralized data management and analysis system. 
    Aggregates run data and timestamp data sets.
    Process tool analysis.
    Machine and process trends monitoring for increased yields and predictive maintenance.

    Fine Wire Wedge Bond Applications*

    • RF-SOE
    • Disk Drives
    • Large Complex Hybrids
    • RF and Microwave Devices
    • High Frequency Passive and Active Components
    • MCM Power Connections
    • Fine Pitch Devices
    • Running Stitch Interconnects (die-to-die)
    • Ribbon Bonding
    • Low Profile Wire Bonds

    *partial list

    9000 Wedge Bonder Options

    • Various stages, sizes, and tools
    • Automated material handlers 
    • Orthogonal bonding (unique angles for bond 1 and bond 2)
    • Chain bonding (bond – loop – bond – loop –bond)
    • Multi-user access software
    • 90 degree wire clamp

    Three entry points for unobstructed access to the complete large work envelope.

  • 3880 Die Bonder
    The 3880 is built upon the industry proven capability and rich feature set of the 3800 with an entirely new Z-Theta bidirectional bond head with voice coil technology....

  • Palomar Technologies' new 3880 Die Bonder features a fully integrated Z-Theta bidirectional bond head enabling reduced maintenance and uniformity across a wide range of applications. The new machine’s combined fine placement accuracy, fast indexing time, and excellent tool planarity and repeatability make it the most advanced die bonder platform available today. Presentation options include wafer, waffle/gel pak, tape and reel, boat, and carriers. Custom stages are also available.

    • Improved force range and linearity,
    • Tool index speed
    • Tool to tool index precision and planarity
    • Set up ease
  • 5100 Vacuum Pressure Furnace
    The Model 5100 is a vacuum and pressure furnace that provides precise automatic control of heating and cooling ramp rates....

  • This system allows for heating up to 500°C and cooling in an inert gas environment from vacuum levels below 50 millitorr to pressures up to 40 psig. An unlimited number of process profiles can easily be created and stored in the controller. Process heating is provided over the entire work area by a close-coupled planar infrared heating element. The system is designed for high production flux-less void-free soldering.


 Additional Info

New Exhibitor:
No
New Products:
Yes
Displaying Equipment:
Yes
Product Demonstrations:
Yes
Please indicate which segment(s) your company serves
Semiconductor, Packaging/Assembly

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