Royce Instruments, LLC

831 Latour Court, Suite C
Napa,  CA  94558

United States
http://www.royceinstruments.com
  • Booth: 5981


Thank you for visiting the Royce Instruments, LLC eBooth.

Proudly celebrating over 30 years of manufacturing in the USA, Royce Instruments Bond Testers and Die Sorters have an excellent reputation for performance and customer support. The entire 600 Series can be networked and operated from a single, central database. The highly integrated Royce 650 Universal Bond Tester has rich statistical capability and supports enterprise networked SPC, while the Royce 620 offers a mid-range solution for today’s most common bond test applications. The Royce 610 Dedicated Wire Pull Bond Tester allows for maximum throughput at an affordable cost. Our quick changeover Die Sorters excel at handling fragile die with critical geometry; either the fully automatic MP300 with wafer mapping or semi-automatic DE35-ST for lower cost.  Royce is a wholly owned subsidiary of V-TEK International, a global leader in packaging and processing equipment and services for high mix, low to mid volume electronic component manufacturers, specializing in tape and reel packaging and processing.  For more information find us on Facebook, LinkedIn, and follow us on twitter.


 Press Releases

  • Royce Instruments and V-TEK International introduce new AP+


    Highly customizable die sort solution offers multiple wafer and tray input options, adds output to tape and reel or tray.


    NAPA, California, U.S.A., September 14, 2016 -- Royce Instruments and V-TEK International today announced the release of their new automated die sorter, the AP+. The AP+ will be showcased at the upcoming IMAPS 2016 Symposium on Microelectronics in Pasadena, California from October 10-13, 2016. With over 30 years in the electronic component processing and packaging industry, Royce and V-TEK each bring a wealth of experience to the design table. The result is the AP+, a flexible solution that merges Royce’s capability of processing highly sensitive die with V-TEK’s most advanced taping technology. The highly customizable AP+ offers a variety of automated input and output options while maintaining fast change-over between processes. Die input is from wafer, waffle pack, Gel-Pak, JEDEC tray or custom tray using an input map. Output options are the same with the addition of a new tape and reel system. The AP+ taper features an adjustable width track with heat and pressure seal options. Die Sort Manager Software provides input to output traceability at the die level. Die Sort modes include pizza map or reticle mask wafer mapping, ink dot recognition and pick all die. AP+ options include non-surface die pick-up, 180 degree die flip and taper post-place vision inspection. With its multi-project wafer mapping capability and quick-change fixtures and tooling, the AP+ is ideal for supporting medium volume, high mix environments.


    For more information on the AP+, please contact:
    Bill Coney
    Business Development Manager
    Royce Instruments, LLC
    831 Latour CT, Suite C
    Napa, CA 94558
    707.975.2846
    bconey@royceinstruments.com


 Products

  • Royce 600 Series Bond Test Instruments
    Royce 650 Universal Bond Tester, Royce 620 Multitest Bond Tester, and Royce 610 Dedicated Wire Pull Bond Tester...

  • The entire 600 Series can be networked and operated from a single, central database. The highly integrated Royce 650 Universal Bond Tester has rich statistical capability and supports enterprise networked SPC, while the Royce 620 offers a mid-range solution for today’s most common bond test applications. The Royce 610 Dedicated Wire Pull Bond Tester allows for maximum throughput at an affordable cost.  

    Royce 650 - motorized, joystick-controlled part positioning, up to 10 kgf for pull/push testing, 200 kgf for shear and die (stud) pull testing

    Royce 620 - manual part positioning with manipulator, up to 10 kgf for pull/push testing, 5 kgf for shear testing

    Royce 610 - simple, mouse controlled machine for wire pull testing up to 100 gf

  • Royce AutoPlacer MP300
    Fully Automatic Die Sorter with wafer mapping capability, excelling in multi-project wafers, MEMS devices, and thin fragile die handling...

  • System Features:

    • Low cost automatic die sort from wafer to tray or film frame
    • Reads many wafer map formats
    • Supports Multi-Project, Pizza Map, Reticle Mask wafers
    • Picks 50 micron thick GaAs with air bridges and vias
    • Picks large, fragile, complex geometry MEMS devices (using optional non-surface contact edge grip technology)
    • Optional inline die inverter (for 180 degree device flip prior to placement)
    • Flexible die binning with tray pocket traceability
    • Wafer input up to 300 mm, film frames or rings
    • Quick change output fixtures, Gel-Pak, waffle pack, JEDEC trays, film frames
  • Royce DE35-ST
    Semi-automatic die sorter optimized for small lot production with simple, quick changeover and multiple device inspection options...

  • System Features:

    • Excels in sorting fragile GaAs and MEMS devices
    • Available for up to 300 mm wafers
    • Picks die as small as 200 microns square
    • Waffle pack, Gel-Pak, and film frame output
    • Topside, underside, and facet inspection options
    • Die inverter option
    • Throughput of 500 to 1200 UPH (product, process dependent)
    • Quick change over, under 10 minutes
    • Option non-surface contact operation for MEMS, air-bridge, GaAs, optical and other sensitive devices

 Additional Info

New Exhibitor:
No
New Products:
Yes
Displaying Equipment:
Yes
Product Demonstrations:
Yes
Please indicate which segment(s) your company serves
LED/solid state lighting, MEMS, Photovoltaic, Plastic/organic/flexible electronics, Power Semiconductors, Semiconductor, Water Processing, Test, Packaging/Assembly

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