Shenmao America Inc

2156 Ringwood Ave
San Jose,  CA  95131

United States
http://www.shenmao.com/
  • Booth: 6467


Visit # 6467 to discuss BGA Sphere, Bumping Paste and Flux

SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and extremely high quality sphericity. SHENMAO MICRO MATERIAL INSTITUTE applications engineers developed the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void to optimize manufacturing process performance. SHENMAO has successfully been approved by many international well-known electronic manufacturers. SHENMAO strives to offer the best quality without compromising cost and time-to-market while providing maximum value to all customers. As the Worlds Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Wave Solder Bar, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Flux and PV Ribbon.


 Press Releases

  • SHENMAO America, Inc. Press Releas                                                                                                                                            Published: June 28, 2016 - San Jose, CA, USA 

    SHENMAO Technology Inc. Introduces BGA and Micro BGA Solder Spheres

    SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 10 worldwide SHENMAO locations.

    SHENMAO High Drop-Resistance Alloy PF902-S (SAC0307X) greatly increases reliability and performance of Portable Electronic Devices drop test.

    As the World’s Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Wave Solder Bar, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Flux and PV Ribbon.

    SHENMAO America, Inc.  www.shenmao.com  Tel: 408-943-1755   e-mail: usa@shenmao.com

  • SHENMAO America, Inc. Press Release                                                                                                                                             Published: June 28, 2016 - San Jose, CA, USA 

    SHENMAO Technology Inc. Introduces BGA and Micro BGA Bumping Solder Paste

    SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process. SHENMAO applications engineers focused on developing the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void (<10%) to optimize manufacturing process performance. The world’s largest IC Packaging and Test Service OSAT utilize SHENMAO Bumping Solder Paste in production.

    As the World’s Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Wave Solder Bar, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Flux and PV Ribbon.

    SHENMAO America, Inc.   www.shenmao.com     Tel: 408-943-1755     e-mail: usa@shenmao.com

  • SHENMAO America, Inc. Press Release                                                                                                                                               Published: June 28, 2016 - San Jose, CA, USA 

    SHENMAO Technology Inc. Introduces SMF-WB02 / SMF-WB51 Water Soluble Flux

    SHENMAO SMF-WB02 / SMF-WB51 Water Soluble Flux are made locally in the USA and with the same quality in 10 other worldwide locations. It is said their Low Viscosity (easy to apply), High Tackiness (slump resistant), consistent printability for BGA and Micro BGA Ball Assemblies and excellent wash ability after high temperature reflow (255ºC and 60 seconds over 220ºC) create highly reliable Solder Joints with ultra maximized Quality.

    A Large Chipset Producer consistently uses SHENMAO SMF-WB02 / SMF-WB51 Water Soluble Flux to achieve ultimately reliable and residue clean Ball Attach connections.

    As the World’s Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Wave Solder Bar, Semiconductor Packaging Solder Spheres, Flux and PV Ribbon.

    SHENMAO America, Inc.  www.shenmao.com   Tel: 408-943 -1755   e-mail:usa@shenmao.com


 Products

  • SHENMAO BGA and Micro BGA Bumping Solder Paste
    SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process, optimizing manufacturing performance. World’s largest IC OSAT's utilize SHENMAO Bumping Solder Paste....

  • SHENMAO Technology Inc. Introduces BGA and Micro BGA Bumping Solder Paste

    SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process. SHENMAO applications engineers focused on developing the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void to optimize manufacturing process performance. The world’s largest IC Packaging and Test Service OSAT's utilize SHENMAO Bumping Solder Paste in production.

    As the World’s Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Wave Solder Bar, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Flux and PV Ribbon.

  • SHENMAO SMF-WB02 / SMF-WB51 Water Soluble Flux
    SHENMAO Introduces SMF-WB02 / SMF-WB51 Water Soluble Flux SHENMAO SMF-WB02 / SMF-WB51 Water Soluble Flux's Low Viscosity, High Tackiness (slump resistant), consistent printability for BGA Ball Assemblies create highly reliable quality Solder Joints....

  • SHENMAO Introduces SMF-WB02 / SMF-WB51 Water Soluble Flux

    SHENMAO SMF-WB02 / SMF-WB51 Water Soluble Flux are made locally in the USA and sold with the same quality in 9 other worldwide locations. It is said their Low Viscosity (easy to apply), High Tackiness (slump resistant), consistent printability for BGA and Micro BGA Ball Assemblies and excellent wash ability after high temperature reflow (255ºC and 60 seconds over 220ºC) create highly reliable Solder Joints with ultra maximized Quality.

    A Large Chipset Producer consistently uses SHENMAO SMF-WB02 / SMF-WB51 Water Soluble Flux to achieve ultimately reliable and residue clean Ball Attach connections.

    As the World’s Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Wave Solder Bar, Semiconductor Packaging Solder Spheres, Flux and PV Ribbon.

  • SHENMAO Introduces BGA and Micro BGA Solder Sphere
    SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made to various diameters of 0.76, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia. with accurate uniformity and high quality sphericity. ...

  • SHENMAO Introduces BGA and Micro BGA Solder Spheres

    SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.76, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 10 worldwide SHENMAO locations.

    SHENMAO High Drop-Resistance Alloy PF902-S (SAC0307X) greatly increases reliability and performance of Portable Electronic Devices drop test.

    As the World’s Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Wave Solder Bar, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Flux and PV Ribbon.


 Additional Info

New Exhibitor:
No
New Products:
Yes
Displaying Equipment:
Yes
Product Demonstrations:
Yes
Please indicate which segment(s) your company serves
LED/solid state lighting, MEMS, Photovoltaic, Plastic/organic/flexible electronics, Power Semiconductors, Semiconductor, Packaging/Assembly, Materials
If you checked Other, please indicate your Company Industry
SHENMAO is the leading solder material manufacturer in Asia since 1973. For more than 43 years, SHENMAO has been dedicated in solder products including solder paste, wire, bar, powder, BGA sphere, flux, solder preform, and solar ribbon. As an award-winning supplier of electronics assembly materials, we place quality at the heart of everything we do, and always provide excellent service to our customers. SHENMAO has established manufacturing sites all over the world to provide instant delivery and support.

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