SHENMAO America, Inc. Press Releas Published: June 28, 2016 - San Jose, CA, USA
SHENMAO Technology Inc. Introduces BGA and Micro BGA Solder Spheres
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 10 worldwide SHENMAO locations.
SHENMAO High Drop-Resistance Alloy PF902-S (SAC0307X) greatly increases reliability and performance of Portable Electronic Devices drop test.
As the World’s Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Wave Solder Bar, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Flux and PV Ribbon.
SHENMAO America, Inc. www.shenmao.com Tel: 408-943-1755 e-mail: firstname.lastname@example.org