Rudolph Technologies, Inc.

16 Jonspin Road
Wilmington,  MA  01887

United States
http://www.rudolphtech.com
  • Booth: 6543


Let's discuss advanced packaging applications and solutions!

Rudolph Technologies, Inc. is a leader in the design, development, manufacture and support of defect inspection, lithography, process control metrology, and process control software used by semiconductor and advanced packaging device manufacturers worldwide. Rudolph delivers comprehensive solutions throughout the fab with its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market of their devices.  Headquartered in Wilmington, Massachusetts, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the Company’s website at www.rudolphtech.com.


 Press Releases

  • Wilmington, Mass. (June 28, 2016)—Rudolph Technologies, Inc. (NYSE: RTEC), a leader in the design, development, manufacture and support of defect inspectionlithography,metrology, and process control software used by semiconductor and advanced packaging device manufacturers worldwide, announced today that a leading OSAT in Asia has placed an order for over $11 million USD for an integrated solution consisting of multiple process control inspection systems and yield management software suite. The solutions will be deployed into multiple applications including whole wafer inspection, 3D bump metrology and post-saw die inspection. The systems will begin shipping in Q2 2016, with the majority of the order shipping the second half of 2016.

    “We are pleased with this order and the confirmation of Rudolph Technologies’ fan-out wafer level packaging (FOWLP) solution portfolio,” said Mike Goodrich, vice president and general manager of Rudolph’s Process Control Group Business Unit. “Key factors of this win were the systems’ unique FOWLP process control capabilities including superior defect capture and identification rate, combination 2D+3D metrology and flexible wafer automation solutions. All systems will be equipped with Rudolph’s Discover® Yield Management Software andTrueADC® Classification software that enhances the user’s process analysis capability, enabling our customers to make targeted data-driven decisions increasing the total productivity of the overall fab.”

    “FOWLP is growing rapidly, and to facilitate that growth Rudolph has focused on integrating technologies into solutions for monitoring and characterizing manufacturing lines particularly in the areas of bump processing as well as die singulation quality control,” said Mike Plisinski, chief executive officer of Rudolph. “This continued investment by a leader in FOWLP underscores the importance of our solutions and the compelling value they provide. This investment is further confirmation of the advanced packaging sector’s growth rate as our industry continues the transition towards cost effective, high performance packaging solutions.”

    The NSX® Series inspection system product family is the market leader for automated macro defect inspection and metrology for advanced packaging manufacturing. The NSX 330 Series is a proven enabler of advanced packaging processes, by directly improving the cost-of-ownership with its capability to address multiple process steps in a single platform. The NSX 330 Series boasts flexible handling and sensor options, that when combined with advanced process management software capabilities, provides users with an unprecedented level of process control solutions.

    Discover YMS Software is Rudolph’s in-line defect, metrology and data management system designed to enhance Rudolph’s process analysis capability in real-time and post inspection analysis. While inspection and metrology systems provide a snapshot of the wafer or lots, limiting process correlation to a single event, Discover software collects individual tool results and provides an advanced statistical analysis of those results, allowing users to drill down into the data to reveal defect and metrology trends, wafer-level signatures, defect source analysis and metrology correlations. Discover software offers full characterization of inspection data, resulting in high productivity and demonstrable quality improvements.

    TrueADC software is Rudolph’s automatic defect classification software designed to automatically categorize defects detected by the NSX systems according to the defect’s attributes, enabling quick, consistent, and accurate classification without assistance from human operators. Accurate classification of the defect type is critical for users to identify root causes of process excursions.

    For more information about Rudolph’s NSX systems, Discover software, and TrueADC software, please visit http://www.rudolphtech.com

    About Rudolph Technologies
    Rudolph Technologies, Inc. is a leader in the design, development, manufacture and support of defect inspection, lithography, process control metrology, and process control software used by semiconductor and advanced packaging device manufacturers worldwide. Rudolph delivers comprehensive solutions throughout the fab with its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market of their devices. Headquartered in Wilmington, Massachusetts, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the Company’s website at www.rudolphtech.com.

    Safe Harbor Statement
    This press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 (the “Act”) which include the benefit to customers of Rudolph’s products and customer service, Rudolph’s ability to deliver products and services consistent with our customer’s demands and expectations and Rudolph’s ability to strengthen our market position as well as other matters that are not purely historical data. Rudolph wishes to take advantage of the “safe harbor” provided for by the Act and cautions that actual results may differ materially from those projected as a result of various factors, including risks and uncertainties, many of which are beyond Rudolph’s control. Such factors include, but are not limited to, the challenges presented by the new product development and marketing, Rudolph’s ability to develop, deliver and support a broad range of products, expand its markets and develop new markets, offered design enhancements may not necessarily translate into significant revenue and fluctuations in customer capital spending. Additional information and considerations regarding the risks faced by Rudolph are available in Rudolph’s Form 10-K report for the year ended December 31, 2015 and other filings with the Securities and Exchange Commission.  As the forward-looking statements are based on Rudolph’s current expectations, the company cannot guarantee any related future results, levels of activity, performance or achievements. Rudolph does not assume any obligation to update the forward-looking information contained in this press release.

    Contacts:

    Investors:    
    Steven R. Roth   
    973.448.4302    
    steven.roth@rudolphtech.com

    Guerrant Associates
    Laura Guerrant-Oiye
    Principal
    808.882.1467
    lguerrant@guerrantir.com

    Trade Press:
    MindWrite Communications, Inc.
    Sandy Fewkes
    408.224.4024
    sandy@mind-write.com

  • Wilmington, Mass. (July 11, 2016)—Rudolph Technologies, Inc. (NYSE: RTEC) today unveiled its new patented Clearfind™ technology, which can detect organic defects that are difficult or impossible to see with conventional white-light imaging techniques. Organic contaminants are often the root cause of field failures, which occur after the material has been exposed to operating conditions for extended periods. Rudolph has been actively collaborating with several key customers to fully understand their inspection challenges and how the new technology addresses them, and plans to incorporate Clearfind technology in its upcoming defect inspection systems for advanced packaging applications.

    “As advanced packaging processes become more complex, process windows are shrinking and manufacturers are seeking better methods for control and inspection that balance the need for high throughput against the ‘escape’ of true defects and the ‘false positive’ detection of nuisance defects,” said Mike Goodrich, vice president and general manager of Rudolph’s Process Control Group. “Organic defects, in particular, have become more troublesome as die interconnects shrink and there is less surface area for good adhesion. Clearfind technology will help our customers see these defects earlier in the process, permitting faster action to mitigate the root cause and reducing the amount of product in jeopardy.”

    Goodrich continued, “Using laser illumination we are able to clearly identify residue defects that typical white-light optics would miss. In addition to optimizing the wavelength of the illumination to enhance detection, we have specifically designed the mechanics of the system to accommodate the high warpage found in advanced packaging applications.”

    Clearfind technology highlights organic residues on bumps and bond pads or at the bottoms of vias so that they are easy to detect. On metals, it eliminates the high-contrast graininess seen under conventional illumination, resulting in an obvious defect signal against a featureless background. This same graininess in conventional imaging can also cause false positives, which are especially costly at this stage of the process where the sunk cost of unnecessarily rejected good product is high. Finally, Clearfind technology readily detects shorts and opens in metal lines when inspected with an underlying organic layer. Rudolph believes these capabilities will significantly increase its customer’s ability to detect process and manufacturing related issues earlier in the process resulting in significant yield, which equates to millions of dollars in savings, especially for processes utilizing known-good die. Rudolph’s customers see this as a critical technology to improve quality for their customers in order to avoid the high costs of replacement and penalties. 

    For more information about the new Clearfind technology, please visit Rudolph at SEMICON® West, booth 6543, in the North Hall, or go to the Rudolph Technologies website: www.rudolphtech.com/clearfind.

    About Rudolph Technologies
    Rudolph Technologies, Inc. is a leader in the design, development, manufacture and support of defect inspection, lithography, process control metrology, and process control software used by semiconductor and advanced packaging device manufacturers worldwide. Rudolph delivers comprehensive solutions throughout the fab with its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market of their devices. Headquartered in Wilmington, Massachusetts, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the Company’s website at www.rudolphtech.com.

    Safe Harbor Statement
    This press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 (the “Act”) which include the benefit to customers of Rudolph’s products, Rudolph’s ability to successfully innovate, develop new technologies and products and deliver products and services consistent with our customers’ demands and expectations as well as other matters that are not purely historical data. Rudolph wishes to take advantage of the “safe harbor” provided for by the Act and cautions that actual results may differ materially from those projected as a result of various factors, including risks and uncertainties, many of which are beyond Rudolph’s control. Such factors include, but are not limited to, the company’s offered design enhancements may not necessarily translate into significant revenue and the challenges presented by the new product development and marketing. Additional information and considerations regarding the risks faced by Rudolph are available in Rudolph’s Form 10-K report for the year ended December 31, 2015 and other filings with the Securities and Exchange Commission. As the forward-looking statements are based on Rudolph’s current expectations, the company cannot guarantee any related future results, levels of activity, performance or achievements. Rudolph does not assume any obligation to update the forward-looking information contained in this press release.

    Contacts:
    Investors:    
    Steven R. Roth   
    973.448.4302    
    steven.roth@rudolphtech.com

    Guerrant Associates
    Laura Guerrant-Oiye
    Principal
    808.882.1467
    lguerrant@guerrantir.com

    Trade Press:
    MindWrite Communications, Inc.
    Sandy Fewkes
    408.224.4024
    sandy@mind-write.com


 Products

  • NSX 330 Series
    The NSX 330 Series is a 2D/3D combined inspection and metrology system for advanced packaging applications....

  • The NSX 330 Series enables advanced packaging processes by directly improving the cost of ownership through support of multiple applications in a single platform. With a combination of inspection and metrology, the NSX 330 Series measures 100% wafer level metrology for micro bumps, RDL, kerf, overlay and through silicon via (TSV). As the industry transitions toward advanced packaging, increased process complexity requires new solutions to address both the technical and commercial challenges of advanced packaging control. The NSX 330 Series addresses these challenges with an array of inspection and optional metrology capabilities combined with Rudolph control software solutions to provide a turnkey, single-vendor solution for inspection, metrology and process control. Metrology capabilities include: wafer metrology, film metrology, bump metrology and metal metrology. 
  • JetStep Lithography System
    The JetStep System is a revolutionary 2X reduction stepper specifically designed to meet advanced packaging challenges. With a large field of view (52mm x 66mm), it can handle wafers and other round substrates up to 450mm and rectangular panels....

  • As resolution, overlay and other technical specifications become tighter and more sophisticated for advanced packaging processes, fulfilling lithography requirements becomes a challenge. The JetStep system has been specifically designed to meet these challenges head on. With specialized optics and key system advantages, the 2x reduction stepper was developed to maximize throughput without limiting resolution and overlay. The system boasts a large printable field combined with user-selectable wavelength options to maximize throughput while not limiting resolution when needed. High-fidelity optics image the fine features required while at the same time achieving superior depth of focus to minimize non-flatness effects. On-the-fly auto focus and an innovative reticle management system improve yield and utilization. Key applications include WLCSP, solder bump, gold bump, copper pillar bump, RDL/UBM, eWLB (fan-out packaging) and TSV.

  • Equipment Sentinel FDC Software
    Equipment Sentinel is a fault detection and classification software for process and equipment control. Equipment Sentinel Software can identify and catch critical issues to improve yield and optimize tool performance....

  • Equipment Sentinel is an automated fault detection and classification (FDC) software solution that seamlessly combines key wafer-level data with high-fidelity tool signal and event data into a single framework, giving users a comprehensive, easy-to-understand view of their processes and equipment. Equipment Sentinel software’s integrated user interface provides process engineers with full access to all equipment performance data produced within a factory and extensive drill-down capabilities to identify and characterize conditions with tools, sensors, or subsystems. Advanced detection models can be established so that process errors are caught and eliminated before they negatively impact yield.


 Additional Info

New Exhibitor:
No
New Products:
Yes
Displaying Equipment:
No
Product Demonstrations:
No
Please indicate which segment(s) your company serves
LED/solid state lighting, MEMS, Power Semiconductors, Semiconductor

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