SPTS Technologies (An Orbotech Company)

Ringland Way
Newport,  NP182TA

United Kingdom
http://www.spts.com
  • Booth: 1417


SPTS looks forward to meeting with you during SEMICON West.

SPTS Technologies, an Orbotech company, designs, manufactures, sells, and supports advanced etch, PVD, and CVD wafer processing equipment and solutions for the global semiconductor and micro-device industries, with focus on the Advanced Packaging, MEMS, high speed RF device, power management and LED markets.

With the addition of SPTS, Orbotech is able to offer a broader range of process solutions for Advanced Packaging, which includes Orbotech’s Inkjet solutions for die level printing of package marking, underfill dams and isolation layers.

SPTS has manufacturing facilities in Newport, Wales and Allentown, Pennsylvania, and operates across 19 countries in Europe, North America and Asia-Pacific.

For additional product or company information, please visit:
www.spts.com
www.orbotech.com


 Press Releases

  • Orbotech Receives $57 million in orders from a Leading Semiconductor Manufacturing Company to Support Fan-Out Wafer Level Packaging Production

    SPTS Extends its Lead as the Supplier of Choice for the Fastest Growing Format with Multiple Sigma fxP PVD Systems Orders

    SPTS Sigma fxP PVD systemYAVNE, ISRAEL, December 9, 2015 | ORBOTECH LTD. (NASDAQ: ORBK), today announced that SPTS Technologies, an Orbotech company and supplier of advanced wafer processing solutions for the global semiconductor and related industries, has received orders totaling approximately $57 million in value for multiple Sigma fxP PVD systems from a global manufacturer of packaged die.  The systems will deposit under bump metals and redistribution layers (RDL) for Fan-Out Wafer Level Packaging (FOWLP) production.  System deliveries and revenue recognition are expected to commence in the fourth quarter of 2015 and continue throughout the first half of 2016.  Orbotech’s fourth quarter and full year 2015 revenue guidance included the initial revenues expected to be recognized from these orders during this period.

    According to a report entitled “Fan-Out WLP Forecast: Update 09/2015” published by research firm Yole Développement in September 2015, the launch of TSMC’s InFO format is expected to increase industry packaging revenues for FOWLP from $240M in 2015 to $2.4B in 2020.  With a projected 54% CAGR, Yole expects FOWLP to be the fastest growing advanced packaging technology in the semiconductor industry.  The burgeoning market for thinner smart phones, tablets, wearable devices and Internet of Things (IoT) connected consumer goods has created a significant need for this cost-effective high density format.   There are numerous FOWLP platforms in or near production from many companies including eWLB (STATS ChipPAC, NANIUM and ASE), SLIM & SWIFT (Amkor), InFO (TSMC) and RCP (Freescale). As part of Orbotech, with its multiple touch points throughout diverse electronics manufacturing environments, SPTS plays a key role in FOWLP advanced packaging solutions with numerous customer installations.

    “This groundbreaking multi-PVD system order, the first from any semiconductor manufacturing company for FOWLP, is a ‎milestone moment for advanced packaging,” said Mr. Kevin Crofton, President of SPTS and Corporate Vice President at Orbotech. “It marks the beginning of an industry-wide transition of FOWLP from a niche packaging technique for small devices such as RFID and power management ICs to mainstream architecture for high value chips.  We expect FOWLP to become the leading low cost, high density packaging format.”

    This order reinforces advanced packaging as SPTS’ most important growth driver.  During 2015, the company has received multiple new technology orders from packaging fabs for a range of applications including plasma dicing for frame-supported wafers, through-silicon via etch and deposition for 3DWLP and TSV reveal and passivation as announced by imec on July 14, 2015.

    About Sigma fxP PVD

    The Sigma fxP is a cluster PVD system used by device manufacturers in various end markets including power management, MEMS and RF devices.  In semiconductor packaging, the Sigma fxP deposits RDL and under bump metals (UBM) for Cu micropillar and TSV’s, plus TSV liner/barrier for 3DWLP.  For FOWLP, the system carries a Multi Wafer Degas (MWD) for low temperature, high productivity degas of epoxy mold compound.  Its SE-LTX etch module pre-cleans organic films with twice the mean wafers between cleans (MWBC) compared to competing systems.  For more information please see http://www.spts.com/tech-insights/advanced-packaging/fowlp.

    About Orbotech Ltd.

    Orbotech Ltd. (NASDAQ:ORBK) is a global innovator of enabling technologies used in the manufacture of the world’s most sophisticated consumer and industrial products throughout the electronics and adjacent industries.  The company is a leading provider of yield enhancement and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems and other electronic components.  Virtually every electronic device in the world is produced using Orbotech systems.  For more information, visit http://www.orbotech.com/.

     

    Cautionary Statement Regarding Forward-Looking Statements

    Except for historical information, the matters discussed in this press release are forward-looking statements within the meaning of the U.S. Private Securities Litigation Reform Act of 1995.  These statements relate to, among other things, future prospects, developments and business strategies and involve certain risks and uncertainties.  The words "anticipate," "believe," "could," "will," "plan," "expect" and "would" and similar terms and phrases, including references to assumptions, have been used in this press release to identify forward-looking statements.  These forward-looking statements are made based on management's expectations and beliefs concerning future events affecting Orbotech and are subject to uncertainties and factors relating to Orbotech's operations and business environment, all of which are difficult to predict and many of which are beyond the Company's control.  Many factors could cause the actual results to differ materially from those projected including, without limitation, timing and extent of achieving the anticipated benefits of the acquisition of SPTS; Orbotech's ability to effectively integrate and operate SPTS's business, the timing, terms and success of any strategic or other transaction, cyclicality in the industries in which the Company operates, the Company's production capacity, timing and occurrence of product acceptance (the Company defines 'bookings' and 'backlog' as purchase arrangements with customers that are based on mutually agreed terms, which, in some cases for bookings and backlog, may still be subject to completion of written documentation and may be changed or cancelled by the customer, often without penalty), fluctuations in product mix, worldwide economic conditions generally, especially in the industries in which the Company operates, the timing and strength of product and service offerings by the Company and each of its competitors, changes in business or pricing strategies, changes in the prevailing political and regulatory framework in which the relevant parties operate or in economic or technological trends or conditions, including currency fluctuations, inflation and consumer confidence, on a global, regional or national basis, the level of consumer demand for sophisticated devices such as smartphones, tablets and other electronic devices, the timing for a verdict in the ongoing appeal of the criminal matter and ongoing investigation in Korea, the final outcome and impact of this matter, including its impact on existing or future business opportunities in Korea and elsewhere, any civil actions related to the Korean matter brought by third parties, including the Company's customers, which may result in monetary judgments or settlements, expenses associated with the Korean matter, ongoing or increased hostilities in Israel and other risks detailed in the Company's SEC reports, including the Company's Annual Report on Form 20-F for the year ended December 31, 2014, and subsequent SEC filings. The Company assumes no obligation to update the information in this press release to reflect new information, future events or otherwise, except as required by law.

    COMPANY CONTACTS:

    Anat Earon-Heilborn

    Tally Kaplan Porat

    Destanie Clarke

     

    Director of Investor Relations

    Head of Corporate Marketing

    Corporate Marketing DIrector

    Orbotech Ltd.

    Orbotech Ltd.

    SPTS Technologies Ltd

    Tel: +972-8-942-3582;

    Investor.relations@orbotech.com

    Tel: +972.8.942.3603

    Tally-Ka@orbotech.com

    Tel: +44 7951 203278

    destanie.clarke@orbotech.com

  •  

    PRESS RELEASE:

     

     

    Orbotech’s SPTS Technologies Presented with Supplier Excellence Award by Qorvo

     

    SPTS Receives Special Honor for Outstanding Support and Commitment to Excellence

     

    Newport, United Kingdom, 29 June, 2016 – SPTS Technologies, an Orbotech company, and a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced it was given a Supplier Excellence Award by Qorvo in appreciation of SPTS’s hard work, support and commitment to excellence.

    “Qorvo needed to quickly and cost-efficiently increase production capacity of their Richardson, Texas line in order to meet customer demand,” said Kevin Crofton, President of SPTS Technologies and Corporate Vice President at Orbotech. “They set some challenging timescales, but by adapting our manufacturing and installation processes, we were able to meet their requirements on schedule and to specification. This Qorvo Supplier Excellence Award recognizes the results achieved through hard work and close collaboration between our teams. Delighting our customers is the goal of all of us at SPTS, and we’re extremely proud of the quality and performance of the teams across all disciplines that contributed to this success.”

    Howard Witham, Vice President, Texas Operations, Qorvo, said, “We have been impressed with the ability of SPTS to achieve the promised delivery deadlines to meet our planned ramp, with the flexibility to accommodate late changes, while also providing cost-savings associated with re-configuring existing toolsets and efficient hand-over of all the tools. Open and clear communication between us has been key at all stages from PO to process qualification. SPTS exemplifies what we need in a business partner, and I am very pleased to present this Supplier Excellence Award to SPTS.”

    Qorvo is a leading provider of RF solutions for mobile, infrastructure and defense applications, with a broad portfolio of RF technologies. Formed from the merger of RFMD and TriQuint, Qorvo has more than 7,000 global employees dedicated to delivering solutions for everything that connects the world. SPTS Technologies is a preferred supplier to Qorvo, and the Sigma fxP PVD solution is the process of record (POR) for depositing piezoelectric films.

    About SPTS Technologies

    SPTS Technologies, an Orbotech company, designs, manufactures, sells, and supports etch, PVD, and CVD wafer processing solutions for the MEMS, advanced packaging, LED, high speed RF on GaAs, and power management device markets. With manufacturing facilities in Newport, Wales, and
  •  

    PRESS RELEASE

     

    Orbotech’s SPTS Technologies Adds Rapier-300S to its Mosaic Platform for Plasma Dicing of 300mm Wafers on Taped Frames

     

    Rapier-300S Overcomes Singulation Challenges of Ultra-Small and Ultra-Thin Devices in Volume Production

     

    NEWPORT, UK, July 7, 2016 | SPTS Technologies, an Orbotech company and a supplier of advanced wafer-processing solutions for the global semiconductor and related industries, has introduced the Rapier-300S plasma etch module, the latest addition to its Mosaic plasma dicing platform. The Rapier-300S singulates 300mm wafers on 400mm taped frames, and offers significant throughput and yield benefits for manufacturers of ultra-small and ultra-thin devices. Using SPTS’s industry leading deep reactive ion etch (DRIE) technology, the Rapier-300S offers the tight process control and fast etch rates necessary to achieve the high yields and throughput required for this cost sensitive step.

     “As devices continue to shrink, singulation by plasma etching offers considerable benefits for die quality and strength as compared to traditional dicing solutions,” stated Kevin Crofton, President of SPTS Technologies and Corporate Vice President at Orbotech. “With wafer thicknesses trending below 50µm, conventional dicing methods are reaching their limits. Ultra-small and ultra-thin devices like RFID chips or fragile devices like MEMS are more susceptible to damage from the vibration and chipping caused by mechanical saws, or from the heat caused by lasers. Plasma dicing is a purely non-contact chemical process, thus offering a far less damaging method of singulating devices when they are in their most valuable state. With customers already qualifying devices on 300mm, and in volume production on 150mm and 200mm, our plasma dicing solutions are well positioned to be the benchmark technology for fabs seeking to increase throughputs and yields for small or thinned fragile die.”

    The Rapier-300S is a silicon DRIE module, designed specifically for dicing of 300mm wafers mounted on 400mm frames.  It builds on SPTS’s experience in plasma singulation of 150mm, 200mm and 300mm wafers. Unique aspects of SPTS’s plasma dicing technology include the use of SPTS’s patented Claritas end-point detection system, which provides the earliest possible detection of the lane clearing, allowing the use of patented “bias pulsing” techniques to prevent lateral damage of the die sidewall.

    The Rapier-300S can etch die of any shape with dicing lanes below 10µm and accommodates wafer thicknesses up to and including full wafer thickness. For the smallest die, for example RFID devices (at~0.04mm2), the adoption of narrow dicing lanes could provide up to 80% more die per wafer, at much higher throughputs since all dicing lanes are etched in parallel. Plasma dicing also gives device designers much greater flexibility with regards to fundamental die position/shape/size, removing guard rings and positioning of die/test groups, to make better use of the wafer area.

    SPTS Technologies will be showcasing the Rapier-300S, which has been shortlisted for the Best of West Awards, at SEMICON West, Booth No. 1417 in South Hall, July 12 – 14, Moscone Center, San Francisco, Calif. The “Best of West” awards which are presented annually by Solid State Technology and SEMI at SEMICON West was established to recognize new products moving the industry forward with technological developments in the electronics supply chain.

    To learn more about SPTS’s Rapier-300S, the Mosaic plasma dicing platform, and full range of industry leading etch and deposition process solutions, visit us on Booth #1417 in South Hall. To arrange a meeting with a member of our team, email enquiries@spts.com.

     

    ####

     

    About SPTS Technologies

    SPTS Technologies, an Orbotech company, designs, manufactures, sells, and supports etch, PVD, and CVD wafer processing solutions for the MEMS, advanced packaging, LED, high speed RF on GaAs, and power management device markets. With manufacturing facilities in Newport, Wales, and Allentown, Pennsylvania, the company operates across 19 countries in Europe, North America and Asia-Pacific. For more information about SPTS Technologies, please visit www.spts.com

     

    About Orbotech Ltd.

    Orbotech Ltd. (NASDAQ:ORBK) is a global innovator of enabling technologies used in the manufacture of the world’s most sophisticated consumer and industrial products throughout the electronics and adjacent industries. The Company is a leading provider of yield enhancement and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems and other electronic components. Today, virtually every electronic device in the world is produced using Orbotech systems. For more information, visit http://www.orbotech.com/.

    COMPANY CONTACTS:

    Destanie Clarke

    Tally Kaplan Porat      

    Senior Director, Marketing Communications

    Head of Corporate Marketing

    SPTS Technologies

    Orbotech Ltd.

    Tel: +44 7951 203278

    Tel: +972 8 942 3603                                                                          

    Destanie.Clarke@orbotech.com

    Tally.KaplanPorat@orbotech.com

     

     

     


 Products

  • Sigma® Deposition Systems
    The Sigma product range supports wafer sizes from 100mm to 300mm with deposition technologies covering conventional PVD through to MOCVD...

  • Sigma Metal Deposition Technologies

    Standard PVD – conventional sputter modules for low topography features

    Advanced Hi-Fill (AHF) PVD – ionized sputter source for deposition into high aspect ratio features

    C3M – Virtually conformal metal coverage using MOCVD technology for advanced liner/barrier

    Advantages

    Single wafer processing, improves yields and on-wafer performance, when compared to batch processing.

    Planar target with full face erosion,avoids re-sputtering, reduces particle contamination and improves target life

    Rapid target change (<5mins), with common magnetron increases uptime

    Reliable handling of fragile, thinned or bowed wafers

    "Super Uniformity" option available for specialist applications

    Multi-wafer degas to increase throughput for long (low temp) degas applications

    Common software for 200mm and 300mm systems - ease of use

    Markets Served

    MEMS, Advanced Packaging, Power Semiconductors, LED Manufacturing, RF-IC

  • Omega® Etch Systems
    SPTS offers advanced etch technologies for a wide range of applications within MEMS, Advanced Packaging, LEDs, high speed RF IC & power semiconductors...

  • Plasma Etch

    ICP Etch
    The Omega® ICP process module uses a patented high density plasma source incorporating a radial coil design. The SPTS ICP process module is highly flexible and etches a wide range of materials including oxides, nitrides, polymers, low aspect ratio Si and metals. The ICP module is the market leader for compound semiconductor applications.

    Dielectric Etch
    SPTS’s Omega® SynapseTM process module is an ICP-based high density plasma source, designed to etch materials which are difficult to etch using conventional RIE or ICP sources.

    The process chamber is of metallic construction and is heated to reduce the level of deposition on it, thereby increasing process stability and increasing the mean time between cleans by more than a factor of 10.

    Si DRIE
    Install base of over 1000 DRIE process modules, SPTS’s market-leading position is spearheaded by the Rapier module, which etches Si using Bosch switched processing as well as non-switched etching for tapered profiles, wafer thinning and via reveal.

  • Delta® Deposition Systems
    SPTS's Delta PECVD systems are used for a wide range of applications within MEMS, compound semiconductors, and advanced packaging...

  • PECVD

    • Wafer sizes from 75mm to 300mm
    • Radially symmetrical gas flow for superior wafer-in-wafer (WIW) uniformity
    • Up to 10 gas lines and optional on-board liquid delivery system
    • Mixed frequency plasma capability for stress tuning
    • Active platen cooling for critical, low temperature [<175°C] packaging applications
    • Single and multi-wafer preheat chamber options for de-gassing sensitive substrates

    Markets Served

    MEMS applications demand a wide range of dielectric film types,SPTS’s PECVD module offers SiO, SiN and amorphous silicon films tailored to meet the needs of MEMS manufacturers

    Advanced 3D-IC applications, SPTS offers low temperature [<175°C] processes compatible with 300mm bonded substrates. Applications include via-last TSV liner and via-reveal passivation.

    SPTS is the only PECVD provider who can deposit electrically robust, stable nitride and oxide films at <200°C

    RF-IC semiconductor applications, SPTS develops processes and hardware for today’s production needs and Single wafer processing enables unrivalled repeatability and flexibility in a manufacturing environment

    Our handlers and process chambers are proven in high volume production, and are fully compatible with both transparent and carried wafers


 Additional Info

New Exhibitor:
No
New Products:
Yes
Displaying Equipment:
No
Product Demonstrations:
No
Please indicate which segment(s) your company serves
LED/solid state lighting, MEMS, Power Semiconductors, Semiconductor, Water Processing, Packaging/Assembly

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