Nikon Precision

1399 Shoreway Rd
Belmont,  CA  94002-4107

United States
http://www.nikonprecision.com
  • Booth: 1705

Since 1980, Nikon Corporation has been revolutionizing lithography with innovative products and technologies. The company is a worldwide leader in semiconductor lithography systems for the microelectronics manufacturing industry with more than 8,000 (semiconductor) lithography systems installed worldwide. Nikon offers the most extensive selection of production-class steppers and scanners in the industry. These products serve the semiconductor, flat panel display (FPD) and thin-film magnetic head (TFH) industries. Nikon Precision Inc. provides service, training, applications and technical support, as well as sales and marketing for Nikon lithography systems in North America. For more information about Nikon, access our website at https://www.nikonprecision.com.


 Press Releases

  • Nikon Announces the Industry’s Most Advanced Immersion Scanner for Multiple Patterning

     

    Tokyo, Japan — February 18, 2016 — Nikon Corporation introduces the NSR-S631E ArF immersion scanner, ensuring world-class device patterning and optimum fab productivity to fully satisfy real-world 7 nm node requirements. The S631E builds upon industry-leading Streamlign platform technology to further extend crucial 193 nm immersion lithography. Scanner stage and alignment system innovations enable mix-and-match overlay to 2.3 nm and below, while high speed processing and defectivity reduction provide throughput up to 270 wafers per hour (96 exposure shots/wafer) with enhanced yield, to meet chipmakers’ 7 nm node manufacturing requirements.

     

    It is real-world, on-product performance that is vital to semiconductor manufacturers. The S631E incorporates key advancements in lens, autofocus, and alignment technology to deliver unparalleled on-product multiple patterning, while other progressions maximize fab daily output and yield. In addition, the NSR-S631E is compatible with sophisticated computational and on-product learning solutions that further enhance device patterning.   

     

    Committed to delivering real-world lithography solutions for customers, Nikon continues to introduce pioneering new scanners and software technology to achieve next-generation manufacturing performance and productivity objectives. “The NSR-S631E leverages crucial elements of our proven immersion scanners, while incorporating pivotal new developments that ensure world-class device patterning and optimum fab productivity. Our customers tell us these are essential factors in supporting their success at the 7 nm node," stated Hamid Zarringhalam, Executive Vice President of Nikon Precision Inc.

     

    About Nikon:

    Since 1980, Nikon Corporation has been revolutionizing lithography with innovative products and technologies. The company is a worldwide leader in semiconductor lithography systems for the microelectronics manufacturing industry with more than 8,000 (semiconductor) lithography systems installed worldwide. Nikon offers the most extensive selection of production-class steppers and scanners in the industry. These products serve the semiconductor, flat panel display (FPD) and thin-film magnetic head (TFH) industries. Nikon Precision Inc. provides service, training, applications and technical support, as well as sales and marketing for Nikon lithography systems in North America. For more information about Nikon, access our website at https://www.nikonprecision.com.

     

    ####

     

    This press release contains forward-looking statements as that term is defined in the Private Securities Reform Act of 1995, which are subject to known and unknown risks and uncertainties that could cause actual results to differ materially from those expressed or implied by such statements. Such statements are subject to risks, uncertainties and changes in condition, particularly those related to industry requirements and other risks. The Company undertakes no obligation to update the information in this press release.


 Products

  • NSR-S631E Immersion Scanner
    Delivers world-class device patterning and productivity for 7 nm node applications. Ensures maximized yield and fab flexibility with exceptional on-product overlay accuracy and stability....

  • Introducing the NSR-S631E Immersion Scanner

    Today’s lithography systems provide overlay accuracy and throughput capabilities far beyond what was previously thought possible. However, it is real-world, on-product performance that is vital to chipmakers.

    The newly-announced NSR-S631E immersion scanner builds upon industry-leading Streamlign platform technology to extend crucial 193 nm lithography. With the S631E, Nikon combines superior immersion technology with innovative software solutions to deliver exceptional manufacturing performance and productivity — now and for the future.

    The NSR-S631E is the industry’s most advanced scanner for aggressive multiple patterning processes. The S631E ensures world-class device patterning and optimum fab productivity to fully satisfy real-world 7 nm node requirements.

    Nikon. Delivering Real-world Solutions.

    Key Benefits

    - Delivers world-class device patterning and productivity for 7 nm node applications

    - Ensures maximized yield and fab fl exibility with exceptional on-product overlay accuracy and stability

    - Optimizes affordability with superior reliability and ultra-high throughput up to 270 wafers per hour

    Delivers world-class device patterning and productivity for 7 nm node applications                                                                 

    The semiconductor industry is moving to development of 7 nm generation process devices, with the most critical layers exposed using ArF immersion scanners. Although today’s lithography systems provide unprecedented overlay and throughput capabilities, it is real-world, on-product performance that is essential to semiconductor manufacturers.

    The NSR-S631E leverages the well-known Streamlign platform, incorporating the latest developments in lens, autofocus, and alignment technology to deliver unparalleled multiple patterning performance. Meanwhile, progressions in stage technology and defectivity reduction maximize fab productivity and yield. In addition, the S631E is compatible with sophisticated computational and on-product learning software solutions supported by the Nikon Plug and Play Manager. Together, these pivotal elements satisfy stringent manufacturing requirements at the 7 nm node.

    Ensures maximized yield and fab flexibility with exceptional on-product overlay accuracy and stability                               

    The NSR-S631E utilizes the established Bird's Eye Control system that accurately determines wafer position time after time. The S631E also features recent wafer stage and FIA alignment system innovations that enhance on-product overlay accuracy and stability. Leading-edge multiple patterning applications employ a wide range of illumination conditions, exposure doses, and reticle transparency levels. Therefore, the S631E uses on-product learning and comprehensive software solutions to ensure optimal performance under the most extreme process conditions. These innovations enable the S631E to deliver mix-and-match overlay to 2.3 nm and below.

    Optimizes affordability with superior reliability and ultra-high throughput up to 270 wafers per hour                               

    Affordability is a significant challenge for immersion multiple patterning. NSR-S631E reliability and throughput are critical factors in boosting wafer output per day and overall cost efficiency. The S631E incorporates high speed stages to process up to 270 wafers per hour. In addition, defectivity reduction, as well as enhanced overlay and focus stability contribute to maximized tool productivity and fab daily output. These are all crucial factors in enabling cost-effective, leading-edge multiple patterning.

    NSR-S631E Overview

    Wavelength (nm)

    193

    Lens-NA

    1.35

    Exposure Area (mm)

    26 x 33

    Reduction Ratio

    ¼

    Resolution (nm)

    38

    Single Machine Overlay (nm)

    1.7

    Mix-and-Match Overlay (nm)

    2.3

    Throughput:

     

    300 mm (96 exp. shots/wafer)

    250

    270 (optional)

    Wafer Size (mm)

    300

     

    Summary                                                                                                                                                                                               

    It is real-world, on-product performance that is vital to chipmakers. With the NSR-S631E, Nikon combines superior immersion scanner technology with innovative software solutions to deliver exceptional manufacturing performance and productivity—now and for the future.

    Nikon. Delivering Real-world Solutions.

  • MEMS Steppers
    Basic and enhanced systems available to satisfy varied product/budget requirements. Projection-based designs minimize mask cleaning and defects. Superior Nikon lens technology enables resolution ≤ 1.6 μm....

  • MEMS Steppers   

    Lithography Systems to Meet the Needs of MEMS, LEDs, and More

    Key Benefits

    • Basic and enhanced systems available to satisfy varied product/budget requirements

    • Projection-based designs minimize mask cleaning and defects

    • Superior Nikon lens technology enables resolution ≤ 1.6 μm

    • Large depth of focus and shot-by-shot autofocusing maximize yield

    • Flexible, advanced alignment systems enable overlay accuracy ≤ 0.30 μm

    • Deliver high productivity and accommodate various substrate sizes

    Meeting the needs of MEMS, LEDs, and More

    Micro Electro Mechanical Systems (MEMS) do not have the same aggressive imaging or overlay requirements demanded by semiconductors. However, they necessitate that lithography systems are able to handle extremely warped wafers and very thick films, and accommodate significant step heights. In addition, bulk MEMS applications often need precise alignment to marks located on the backside of the wafer surface.

    Nikon MEMS Steppers

    Nikon MEMS Steppers provide extremely diverse processing capabilities. They have been very successful in meeting customers’ unique requirements for not only Air Bearing Surface (ABS) fabrication and MEMS applications, but also for light emitting diodes (LEDs), discretes, and more. Well over 150 MEMS Steppers are in use around the world today.

    Basic and enhanced systems available to satisfy varied product/budget requirements

    Nikon continues to focus on expanding MEMS Stepper capabilities to meet varied performance and budgetary objectives for our customers. An expanded MEMS Stepper product line and newly developed systems maximize productivity, support substrates up to 200 mm, and enhance imaging with ghi/i-line capabilities. In addition, a multitude of add-on functions further boost system performance and yield.

    Large depth of focus and shot-by-shot autofocusing maximize yield

    MEMS Steppers use low numerical aperture (NA) lens designs specifically optimized for MEMS-type applications, as well as shot-by-shot autofocusing. This combination enables them to deliver the necessary resolution with tremendous depth of focus (DOF).

    MEMS Steppers are capable of resolution down to 1.6 μm. They use proven Nikon IC stepper lens technology that ensures optimal CD uniformity across the wafer. In addition, their projection lens designs eliminate costly mask contamination/defectivity issues experienced with contact or proximity printing methods.

    Flexible, advanced alignment systems enable overlay accuracy ≤ 0.30 μm

    Nikon MEMS Steppers provide a high degree of alignment flexibility. They utilize proven Enhanced Global Alignment (EGA) technology with FIA alignment capabilities. These systems have long been employed on traditional Nikon Step and Repeat equipment, to provide optimal overlay accuracy.

    MEMS Steppers support Each Row Alignment (ERA) capabilities as well. ERA can be used to align shot rows separately to further enhance overlay accuracy. MEMS Steppers also provide Pattern Matching Alignment capabilities that enable alignment to any uniquely patterned structure, as compared to only specific alignment marks.

    The majority of MEMS Steppers also support critical Backside Alignment (BSA) capabilities, and enable BSA accuracy to 0.8 μm and below to satisfy customers’ process requirements. The newly developed hybrid backside alignment system uses direct backside alignment (D-BSA) coupled with infrared backside alignment (IR-BSA) to optimize accuracy. Backside alignment performance can be further enhanced to below 0.5 μm with the Fixed Alignment Points (FAP) system.

    Deliver high productivity and accommodate various substrate sizes

    MEMS Steppers deliver excellent performance capabilities on user-friendly, high productivity stepper platforms. Products support a variety of substrate sizes, as well as a range of exposure wavelengths and field sizes to best meet manufacturing goals. These systems also have small footprints to minimize equipment cost and cleanroom floor space usage. Further, due to their simplified body designs, MEMS Steppers ensure the fastest path to manufacturing.

     


 Additional Info

New Exhibitor:
No
New Products:
Yes
Displaying Equipment:
No
Product Demonstrations:
No
Please indicate which segment(s) your company serves
MEMS, Semiconductor

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