Lithography Systems to Meet the Needs of MEMS, LEDs, and More
• Basic and enhanced systems available to satisfy varied product/budget requirements
• Projection-based designs minimize mask cleaning and defects
• Superior Nikon lens technology enables resolution ≤ 1.6 μm
• Large depth of focus and shot-by-shot autofocusing maximize yield
• Flexible, advanced alignment systems enable overlay accuracy ≤ 0.30 μm
• Deliver high productivity and accommodate various substrate sizes
Meeting the needs of MEMS, LEDs, and More
Micro Electro Mechanical Systems (MEMS) do not have the same aggressive imaging or overlay requirements demanded by semiconductors. However, they necessitate that lithography systems are able to handle extremely warped wafers and very thick films, and accommodate significant step heights. In addition, bulk MEMS applications often need precise alignment to marks located on the backside of the wafer surface.
Nikon MEMS Steppers
Nikon MEMS Steppers provide extremely diverse processing capabilities. They have been very successful in meeting customers’ unique requirements for not only Air Bearing Surface (ABS) fabrication and MEMS applications, but also for light emitting diodes (LEDs), discretes, and more. Well over 150 MEMS Steppers are in use around the world today.
Basic and enhanced systems available to satisfy varied product/budget requirements
Nikon continues to focus on expanding MEMS Stepper capabilities to meet varied performance and budgetary objectives for our customers. An expanded MEMS Stepper product line and newly developed systems maximize productivity, support substrates up to 200 mm, and enhance imaging with ghi/i-line capabilities. In addition, a multitude of add-on functions further boost system performance and yield.
Large depth of focus and shot-by-shot autofocusing maximize yield
MEMS Steppers use low numerical aperture (NA) lens designs specifically optimized for MEMS-type applications, as well as shot-by-shot autofocusing. This combination enables them to deliver the necessary resolution with tremendous depth of focus (DOF).
MEMS Steppers are capable of resolution down to 1.6 μm. They use proven Nikon IC stepper lens technology that ensures optimal CD uniformity across the wafer. In addition, their projection lens designs eliminate costly mask contamination/defectivity issues experienced with contact or proximity printing methods.
Flexible, advanced alignment systems enable overlay accuracy ≤ 0.30 μm
Nikon MEMS Steppers provide a high degree of alignment flexibility. They utilize proven Enhanced Global Alignment (EGA) technology with FIA alignment capabilities. These systems have long been employed on traditional Nikon Step and Repeat equipment, to provide optimal overlay accuracy.
MEMS Steppers support Each Row Alignment (ERA) capabilities as well. ERA can be used to align shot rows separately to further enhance overlay accuracy. MEMS Steppers also provide Pattern Matching Alignment capabilities that enable alignment to any uniquely patterned structure, as compared to only specific alignment marks.
The majority of MEMS Steppers also support critical Backside Alignment (BSA) capabilities, and enable BSA accuracy to 0.8 μm and below to satisfy customers’ process requirements. The newly developed hybrid backside alignment system uses direct backside alignment (D-BSA) coupled with infrared backside alignment (IR-BSA) to optimize accuracy. Backside alignment performance can be further enhanced to below 0.5 μm with the Fixed Alignment Points (FAP) system.
Deliver high productivity and accommodate various substrate sizes
MEMS Steppers deliver excellent performance capabilities on user-friendly, high productivity stepper platforms. Products support a variety of substrate sizes, as well as a range of exposure wavelengths and field sizes to best meet manufacturing goals. These systems also have small footprints to minimize equipment cost and cleanroom floor space usage. Further, due to their simplified body designs, MEMS Steppers ensure the fastest path to manufacturing.