Sono-Tek Corporation

2012 Route 9W
Milton,  NY  12547-5017

United States
  • Booth: 2146

Sono-Tek’s ultrasonic coating technology is used for applications in which material consumption, uniformity, repeatability, and control are required. Our ultrasonic technology is well known in the semiconductor industry for precision photoresist coatings. Sono-Tek’s new SPT200 photoresist coating machine is the perfect tool for providing uniform photoresist coverage of deep well topographies such as MEMs and other challenging applications where spin coating is not adequate. By forming very small and controlled droplets, this unique technology allows for uniform photoresist coverage of deep well topographies such as MEMs and other challenging applications where spin coating is not adequate.  Other applications include flux dispensing for flip chip applications as well as thin film solar/display applications like TCO layers, nano suspensions (CNT, graphene, nano-wires, etc), OPV polymers, AR, and CIGS active layers.  Visit for more information.


 Press Releases

  • Sono-Tek has supplied precision ultrasonic coating equipment to the semiconductor industry since the 1980s. Advances in MEMs wafer technology have caused challenges for the industry in coating deep well topographies using conventional spin coating methods. Ultrasonic spray offers an ideal solution, with the ability to coat all areas of high aspect ratio trenches uniformly. Sono-Tek has combined their patented ultrasonic nozzle technology with all the necessary ingredients to create the ultimate solution for spraying photoresist onto MEMs wafers. The SPT200 system has been carefully developed to be the perfect full coating solution for 200mm standard wafers with high aspect ratios. Go to to learn more or email us at


  • SPT200 Spray Photoresist Tool
    The SPT200 is designed to meet the unique challenges of coating high aspect ratios & deep well topographies such as MEMs wafers with photoresist....

  • The SPT200 replaces traditional spin coating equipment, providing more uniform coverage of side walls in difficult to coat applications.Ultrasonic spray has been used for photoresist deposition for years, and is a well proven method for semiconductor lithography manufacturing.

    SPT200 is configured with Vortex or AccuMist ultrasonic spray shaping nozzles, depending upon coating requirements. Sono-Tek’s team of application engineers ensures the correct configuration for each process. At the heart of the system is Sono-Tek’s patented ultrasonic nozzle technology. All ultrasonic nozzles feature up to 95% reduction in material consumption, non-clogging performance, and precise, targeted spray patterns at ultra-low flow rates.

    Unique system features include:

    • Automated spray coating with recipe storage
    • Designed for 100, 150, 200, and 300mm wafers
    • Precision temperature control
    • Integrated wafer lockdown
    • Highly repeatable syringe pump with auto refill
    • Manual wafer load/unload
    • Highly repeatable, stable process

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LED/solid state lighting, MEMS, Photovoltaic, Plastic/organic/flexible electronics, Power Semiconductors, Semiconductor

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