XwinSys

Ramat Gabriel Industrial Zone, 6 Hatikshoret St., P.O.B. 997
Migdal Haemek,  Israel  2310901

Israel
http://www.xwinsys.com/
  • Booth: 2245


Welcome to Xwinsys! please schedule a meeting for more info

XwinSys Technology Development Ltd., founded in 2012, headquartered at Israel in a hi-tech industrial park at Migdal Haemek, 
and fully owned by a public Canadian company ‘Eurocontrol’ (TSXV, EUO).
XwinSys is dedicated to the design, manufacture and marketing of novel solutions based on improved
X-ray technology combined with automated optical 3D & 2D microscopes, for the semiconductor and related industries.
It's product line was designed to offer an attractive and innovative technological solution
to the rapid-growing semiconductors market, allowing multiple application capabilities, modular
technological concept, cost-effective maintenance and budget oriented approach.
It’s Integrated and improved X-Ray and optical (3D & 2D) analysis is a new approach to meet
the challenges of future roadmap requirements for inspection and metrology of 3D structures in the semiconductor industry. 

Knowing that 3D-IC is the fastest growing segment of the semiconductor industry and leads the way to vertical
stacking that is evolving as the disruptive force of the industry, Xwinsys responses with it's innovative superb solutions.


 Press Releases

  • Toronto, CANADA, May 10, 2016 - Eurocontrol Technics Group Inc. (TSX Venture: EUO) (“Eurocontrol” or the “Company”), a Canadian public company specializing in the acquisition, development and commercialization of innovative authentication, verification and certification technologies, is pleased to announce that its wholly-owned subsidiary, XwinSys Technology Development Ltd. (“XwinSys”), has been granted for a patent from the United States Patent and Trademark Office for its patent application # 14/234,169 made in 2014 covering a method and a system for inspection of voids in a bump.

    This process patent protects XwinSys ONYX and AGATE systems, which are non-destructive in-line metrology systems, designed to handle the 3D-IC current and future challenges using the advent of X-Ray Technology for semiconductor metrology. These systems with their enable both inspection and metrology capabilities, along with small-scale material composition and 3D structure analysis.

    Bruce Rowlands, Chairman and CEO stated, “The acceptance of this patent application by the United States Patent and Trademark Office is a significant milestone for our subsidiary XwinSys. This invention in the field of wafer inspection is new for its ability to detect the existence of voids in a bump and to calculate voids volume along with other critical dimensions relative to bump inspection, such as: bump height, pillar height and solder composition”

    About XwinSys Technology Development Ltd.

    XwinSys was founded at 2012 and is a wholly owned subsidiary of Eurocontrol.  The company is located in the hi-tech industrial park at Migdal Haemek in Israel.  XwinSys is led by an outstanding team of senior managers, board members and global advisers with vast accumulated experience in high technology industries and is dedicated to the design, manufacture and marketing of novel solutions based on improved x-ray technology combined with automated optical 2D and 3D microscopes, for the semiconductor and related industries. 

    The XwinSys NMT technology was designed to offer an innovative cost effective technological solution to the rapid-growing semiconductor industry.  It offers a new approach that meets the challenge of roadmap requirements for inspection and metrology of 3D structures in the semiconductor industry. 3D-IC is the fastest growing segment of the semiconductor industry and leads the way to vertical stacking that is evolving as the disruptive force of the industry.  For more information on XwinSys, visit www.xwinsys.com.

    About Eurocontrol Technics Group Inc.

    Eurocontrol is a TSX Venture listed company that specializes in the acquisition, development and commercialization of innovative authentication, verification and certification technologies. Eurocontrol has two wholly owned subsidiaries, Xenemetrix Ltd. and XwinSys Technology Development Ltd. (“XwinSys”).  Xenemetrix is a leading designer, manufacturer and marketer of ED-XRF systems, a technology that is the most accurate and economic method for determining the chemical composition of many types of materials, including the analysis of petroleum oils and fuel. Xenemetrix has an exclusive long-term supply, maintenance and support agreement with SICPA/GFI to supply SICPA/GFI with Xenemetrix products and services related to the oil and gas marking and monitoring field.  XwinSys is in the final stage of developing a fully automated metrology system for the semiconductor industry that combines 2D and 3D image processing technology with Xenemetrix’s ED-XRF technology.

     


 Products

  • ONYX
    In-line Non-Destructive Inspection and Metrology Analysis for the Semiconductor A Hybrid Configuration of X-Ray Analysis, Automated 3D Microscope and 2D Image Processing. ...

  • The advent of X-Ray Technology for semiconductor metrology reduces the need for entrenched destructive methodologies requiring sample preparation.
    The Onyx combines X-Ray and optics, allowing significant advantages: 

    • Height and critical dimension (CD) monitoring
    • Volume measurement 3D structure analysis: Misprocess, Voids, Surface defects
    • Thin film multi-layer analysis
    • Materials composition inspection

    Energy dispersive X-RAY fluorescence (EDXRF)
    spectroscopy is the most accurate and economical analytical method for the determination of the elemental composition of many types of materials.
    This technique is non-destructive, requiring no sample preparation, and is suitable for almost all sample types and shapes. X-ray Fluorescence (XRF) spectrometric analysis can be employed to measure a wide range of atomic elements, from Carbon (6) through Fermium (100), with low detection limits and high precision.

    Automated 3D imaging
    This second core competency covers a variety of optical/laser based metrology methodologies including confocal, interferometry and triangulation.
    We supplement them with dedicated algorithms and software packages that can be applied to specialized and automated machine-vision solutions for quality control and hands-free 2D and 3D geometrical measurements in industrial applications.
    Computerized image processing is an essential ingredient of this core competence and one that enables accurate automated inspection.
    2D Image Processing
    The main importance of the 2D microscope is its advanced optical features, mainly used for efficient geometrical inspection purposes, as well as an accurate navigation tool. The high level of image processing and pattern recognition allow defect inspection, color inspection, feature dimension and more.

    Application Highlights

    The XwinSys Onyx is a high-end system serving the in-line semiconductor fab environment and is equipped with a robotic wafer handler and loader. It is a unique hybrid product that acts as a Review Station as well as serving the rapidly evolving 3D IC segment of the Semiconductor industry.

    The system combines high resolution elemental material composition analysis with 3D geometrical inspection of features exemplified by micro- bumps, and
    associ-ated UBM and RDL features, and TSV’s. Other Semiconductor applications are also relevant and include ultra-thin (sub nm) layer measurement and
    localized layer thickness measurement, and composition analysis associated with FinFET structures. An added advantage of the XwinSys Onyx system is its
    proven ability to concentrate an X-ray beam to a spotsize of 10-30 microns in diameter, crucial for inspection of micro-features of corresponding size.

    The Onyx is equipped with an array of 4 state-of-the-art silicon drift detectors (SDD) including a light-element SDD allowing for highest throughput and
    precision (2 axis symmetry) of an expanded range of elements detection from Carbon upwards. The integrated XRF and 2D/3D optical imaging technologies
    allow for the system to function as a Review Station for defect verification using 2D defect imaging, 3D defect structure rendering and material composition of the defect. The highly accurate, automated feature location and indexing enable fast and precise material analysis and 3D geometrical inspection of 300mm wafers and multi-feature arrays of specimens.


 Additional Info

New Exhibitor:
Yes
New Products:
Yes
Displaying Equipment:
No
Product Demonstrations:
Yes
Please indicate which segment(s) your company serves
Semiconductor, Packaging/Assembly

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