Toronto, CANADA, May 10, 2016 - Eurocontrol Technics Group Inc. (TSX Venture: EUO) (“Eurocontrol” or the “Company”), a Canadian public company specializing in the acquisition, development and commercialization of innovative authentication, verification and certification technologies, is pleased to announce that its wholly-owned subsidiary, XwinSys Technology Development Ltd. (“XwinSys”), has been granted for a patent from the United States Patent and Trademark Office for its patent application # 14/234,169 made in 2014 covering a method and a system for inspection of voids in a bump.
This process patent protects XwinSys ONYX and AGATE systems, which are non-destructive in-line metrology systems, designed to handle the 3D-IC current and future challenges using the advent of X-Ray Technology for semiconductor metrology. These systems with their enable both inspection and metrology capabilities, along with small-scale material composition and 3D structure analysis.
Bruce Rowlands, Chairman and CEO stated, “The acceptance of this patent application by the United States Patent and Trademark Office is a significant milestone for our subsidiary XwinSys. This invention in the field of wafer inspection is new for its ability to detect the existence of voids in a bump and to calculate voids volume along with other critical dimensions relative to bump inspection, such as: bump height, pillar height and solder composition”
About XwinSys Technology Development Ltd.
XwinSys was founded at 2012 and is a wholly owned subsidiary of Eurocontrol. The company is located in the hi-tech industrial park at Migdal Haemek in Israel. XwinSys is led by an outstanding team of senior managers, board members and global advisers with vast accumulated experience in high technology industries and is dedicated to the design, manufacture and marketing of novel solutions based on improved x-ray technology combined with automated optical 2D and 3D microscopes, for the semiconductor and related industries.
The XwinSys NMT technology was designed to offer an innovative cost effective technological solution to the rapid-growing semiconductor industry. It offers a new approach that meets the challenge of roadmap requirements for inspection and metrology of 3D structures in the semiconductor industry. 3D-IC is the fastest growing segment of the semiconductor industry and leads the way to vertical stacking that is evolving as the disruptive force of the industry. For more information on XwinSys, visit www.xwinsys.com.
About Eurocontrol Technics Group Inc.
Eurocontrol is a TSX Venture listed company that specializes in the acquisition, development and commercialization of innovative authentication, verification and certification technologies. Eurocontrol has two wholly owned subsidiaries, Xenemetrix Ltd. and XwinSys Technology Development Ltd. (“XwinSys”). Xenemetrix is a leading designer, manufacturer and marketer of ED-XRF systems, a technology that is the most accurate and economic method for determining the chemical composition of many types of materials, including the analysis of petroleum oils and fuel. Xenemetrix has an exclusive long-term supply, maintenance and support agreement with SICPA/GFI to supply SICPA/GFI with Xenemetrix products and services related to the oil and gas marking and monitoring field. XwinSys is in the final stage of developing a fully automated metrology system for the semiconductor industry that combines 2D and 3D image processing technology with Xenemetrix’s ED-XRF technology.