TDK Corporation, a leader in factory automation systems, will exhibit its TAS300 J1 Load Port at SEMICON West, July 12-14, 2016 at the Moscone Convention Center in San Francisco, CA. Visitors can go to the TDK booth #2405 in the South Hall to see a demonstration.
An environment with a high degree of cleanliness is essential for state-of-the-art semiconductor device manufacturing processes, but this requires massive capital investment for large-scale air cleaning and other equipment. To control such capital investment, in recent years, automated transport systems that deliver semiconductor substrates (wafers) to completely sealed pods (FOUP) and shift the wafers between semiconductor production equipment have become the mainstream production method.
The TAS300 is a wafer transport system for 300 mm diameter wafers, which are currently used in manufacturing in the semiconductor industry, and was developed to provide higher cost competitiveness. In addition, door opening and closing for wafer input and output is approximately 40% faster than the H1 series. Additionally, an innovative door is used to prevent the generation and introduction of particles.
The company will also be demonstrating for the first time the self-circulating Nitrogen purge Equipment Front End Module. The N2 EFEM CAVS-NE uses a sealed enclosed frame with integrated TDK Load Ports that provides a low O2 and humidity environment for FAB wafer processing.
We will also have video presentation of TDK high precision AFM 15 Thermosonic and Thermal Compression Flip Chip Die Bonders. TDK flip chip die bonder uses a micro scrub process to lower energy required and reduce cycle time for die attach process. TDK micro scrub process eliminates flux.