TDK Corporation of America

475 Half Day Road
300
Lincolnshire,  IL  60069

United States
http://www.tdk.com/fa.php
  • Booth: 2405


Welcome to TDK featuring Purge Equipment Front End Module!

TDK is the leading manufacturer of factory automoation equipment

Visit the TDK booth to view a live demonstration of our products on display:

This year TDK is featuring it N2 Purge Equipment Front-End Module (EFEM).

* Mini Environment Control at Critical Process for Next Generation Transistor Manufacturing * Reliable Cost Effective Nitrogen Environment of 50 ppm Oxygen Level Combined with Sealed Design Purge Loadport * Achieves Very Low Wafer Contamination levels for AMC, O2, and RH * Better Process Uniformity and Higher Yields * Best in Class Wafer to Wafer Variation Control

 

* TAS300 J1 Loadport

* CE Mark Semi Compliant * Over 65,000 Installed at All Major FABS * FAB Proven Interoperability with MCBF Over 750,000 * 30% Improvement in Cycle Time * 50% Reduction is Shipping Package Volume *

* TAS 300mm Nitrogen Purge Loadport

* For Next Generation FABS * 10 Years of Experience with N2 Purge Systems *FAB Proven Interoperability with MCBF Over 750,000 *FAB Proven Design  for N2 Bottom Purge FOUPs *

Loadports offer options such as: N2 Purge Field Retrofit, Wafer Mapping, Integrated CID, Integrated E84, Ethernet Communication
 

 


 Press Releases

  • TDK Corporation, a leader in factory automation systems, will exhibit its new Self-circulating Nitrogen Purge Equipment Front End Module (EFEM) at SEMICON West, July 12-14, 2016 at the Moscone Convention Center in San Francisco, CA.  Visitors can go to the TDK booth #2405 in the South Hall to see a demonstration of this new technology.

     

    The N2 EFEM CAVS-NE uses a sealed enclosed frame with integrated TDK Load Ports that provides a low O2 and humidity environment for FAB wafer processing. “The TDK design ensures that wafers are never exposed to the atmosphere during transport between the FOUP and load lock,” said Kiyoshi Kanashiro, Factory Automation Manager. “This is the first kind of this type of idea in the industry and can provide a major wafer yield improvement to our customers.”

     

    In addition, the company will demonstrate its TAS300 J1 Load Port wafer transport system for 300 mm diameter wafers.

     

    We will also have video presentation of TDK high precision AFM 15 Thermosonic and Thermal Compression Flip Chip Die Bonders.  TDK flip chip die bonder uses a micro scrub process to lower energy required and reduce cycle time for die attach process.  TDK micro scrub process eliminates flux.

  •  

    TDK Corporation, a leader in factory automation systems, will exhibit its TAS300 J1 Load Port at SEMICON West, July 12-14, 2016 at the Moscone Convention Center in San Francisco, CA.  Visitors can go to the TDK booth #2405 in the South Hall to see a demonstration.

     

    An environment with a high degree of cleanliness is essential for state-of-the-art semiconductor device manufacturing processes, but this requires massive capital investment for large-scale air cleaning and other equipment. To control such capital investment, in recent years, automated transport systems that deliver semiconductor substrates (wafers) to completely sealed pods (FOUP) and shift the wafers between semiconductor production equipment have become the mainstream production method.

     

    The TAS300 is a wafer transport system for 300 mm diameter wafers, which are currently used in manufacturing in the semiconductor industry, and was developed to provide higher cost competitiveness. In addition, door opening and closing for wafer input and output is approximately 40% faster than the H1 series. Additionally,  an innovative door is used to prevent the generation and introduction of particles.

     

    The company will also be demonstrating for the first time the self-circulating Nitrogen purge Equipment Front End Module. The N2 EFEM CAVS-NE uses a sealed enclosed frame with integrated TDK Load Ports that provides a low O2 and humidity environment for FAB wafer processing.

     

    We will also have video presentation of TDK high precision AFM 15 Thermosonic and Thermal Compression Flip Chip Die Bonders.  TDK flip chip die bonder uses a micro scrub process to lower energy required and reduce cycle time for die attach process.  TDK micro scrub process eliminates flux.


 Products

  • TAS300 J1 Load Port
    The TAS300 is a wafer transport system for 300 mm diameter wafers and was developed to provide lower cost. In addition, door opening and closing for wafer input and output is approximately 40% faster than the H1 series....

  • An environment with a high degree of cleanliness is essential for state-of-the-art semiconductor device manufacturing processes, but this requires massive capital investment for large-scale air cleaning and other equipment. To control such capital investment, in recent years, automated transport systems that deliver semiconductor substrates (wafers) to completely sealed pods (FOUP) and shift the wafers between semiconductor production equipment have become the mainstream production method.

    The TAS300 is a wafer transport system for 300 mm diameter wafers, which are currently used in manufacturing in the semiconductor industry, and was developed to provide higher cost competitiveness. In addition, door opening and closing for wafer input and output is approximately 40% faster than the H1 series. Additionally,  an innovative door is used to prevent the generation and introduction of particles.

  • N2 Purge Equipment Front End Module
    The new Self-circulating Nitrogen Purge Equipment Front End Module (EFEM) uses a sealed enclosed frame with integrated TDK Load Ports that provides a low O2 and humidity environment for FAB wafer processing....

  • TDK Corporation, a leader in factory automation systems, will exhibit its new Self-circulating Nitrogen Purge Equipment Front End Module (EFEM).

    The N2 EFEM CAVS-NE uses a sealed enclosed frame with integrated TDK Load Ports that provides a low O2 and humidity environment for FAB wafer processing. The TDK design ensures that wafers are never exposed to the atmosphere during transport between the FOUP and load lock. This is the first kind of this type of idea in the industry and can provide a major wafer yield improvement.

  • TDK Flip Chip Die Bonder
    TDK high precision AFM 15 Thermosonic and Thermal Compression Flip Chip Die Bonders. TDK flip chip die bonder uses a micro scrub process to lower energy required and reduce cycle time for die attach process. TDK micro scrub process eliminates flux....

  • TDK AFM 15 available with Thermosonic Die Bond Head or Thermal Compression Die Bond Head. TDK precision AFM 15 Die Bonder can be configured for various pad metallization : Au-Au, Au-Al, Au-Ag, AuSn, & Cu-Pillar. 

    AFM 15 Die Bonder provides precision low COO die assembly process to reduce device packaging geometry by 70% when compared to wire bonding process. 


 Additional Info

New Exhibitor:
No
New Products:
Yes
Displaying Equipment:
Yes
Product Demonstrations:
Yes
Please indicate which segment(s) your company serves
Water Processing, Packaging/Assembly

Send Email

Type your information and click "Send Email" to send an email to this exhibitor. To return to the previous screen without saving, click "Reset".