Yole Developpement

75 Cours Emile Zola
Villeurbanne,  F-69100

France
http://www.yole.fr
  • Booth: 2434


Feel free to to meet with our analysts on booth #2434

ABOUT US

Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing, the Yole Développement group has expanded to include more than 50 collaborators worldwide covering MEMS, Compound Semiconductors, LED, Image Sensors, Optoelectronics, Microfluidics & Medical, Advanced Packaging, Manufacturing, Nanomaterials, Power Electronics and Batteries & Energy Management.

The “More than Moore” company Yole Développement and its partners System Plus Consulting, Blumorpho and KnowMade support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business.

CONTACTS

  • Consulting & Financial Services: Jean-Christophe Eloy (eloy@yole.fr)
  • Reports business: David Jourdan (jourdan@yole.fr)
  • Marekting & Communication: Camille Veyrier (veyrier@yole.fr)


 Press Releases

  • OUTLINES:

    • Driven by a strong semiconductor market outlook and aggressive investment in advanced packaging capability fueld by strong government support, advanced packaging revenue in China is expected to reach US$4.6 billion at an impressive 16% CAGR.
    • Last year, more than US$ 1 billion was invested in China's advanced packaging ecosystem - and there is much more to come.
    • Local equipment and materials suppliers for advanced packaging: a key bottleneckin the local supply chains?

    LYON, France – June 8, 2016: Driven by a strong semiconductor market outlook and aggressive investment in advanced packaging capability fueled by strong government support, advanced packaging revenue in China is expected to reach US$ 4.6 billion in 2020, against US$ 2.2 billion in 2015, announces Yole Développement (Yole). This market is showing an impressive 16% CAGR during this period. China has the world’s largest population, and its economy will continue to grow at a high pace: the economists predict a 6% growth, reaching around US$16 trillion by 2020. Also, an increase in per capita income (more purchasing power) will ensure China remains a dominant market in the coming years. Today, no business can afford to ignore China…
     

    Under this context, the “More than Moore” market research and strategy consulting company, Yole explores the advanced packaging industry in China and details, in its latest advanced packaging report entitled “Status & Prospects for the Advanced Packaging Industry in China”, the status of this industry, its market drivers and key market data and technology trends. Yole’s analysts propose a clear vision of the Chinese government commitment within the advanced packaging industry in China and point out the huge China’s IC investments fund. Business opportunities, technical challenges and more are also part of Yole’s market & technology analysis.

    China commands a significant market for key electronic products. In fact, over half of all key electronic products are consumed in China. In 2014, the Chinese smartphone, LCD, notebook/tablet, and wearable markets were around 81%, 63%, 71%, and 47% of the global market, respectively. The global IC market will grow by a CAGR of 4% from 2014 - 2020, while the Chinese IC market will grow by 7% over the same period. According to Yole, the Chinese IC market is expected to reach about US$149 billion by 2020, around 40% of the total IC market.

    “There is a huge gap between China’s IC consumption and its manufacturing,” comments Santosh Kumar, Senior Technology & Market Analyst at Yole. And he details: “In 2015, China produced only 12.5% roughly of the IC it consumes, and the gap between IC consumption and production is about US$91 billion. Currently, IC is China’s #1 import commodity, exceeding oil.”

    China considers the IC industry to be a key strategic sector. The Chinese government is making a significant effort through funding and a national IC policy, with an aggressive growth strategy to make China an IC design and manufacturing hub. The goal by 2030 is to become the global leader in all primary IC industrial supply chain segments.

    The Chinese government has employed a multi-pronged strategy to support domestic IC industry development in order to achieve the goal of becoming the global leader in all primary IC industrial supply chain segments by 2030. Over the last few decades the Chinese government has supported the domestic IC industry, but with limited success. One key reason for failure was the bureaucratic approach to resource allocation, which was by nature inefficient. This time around, the government is adopting a market-based approach where funding is available for investment in the form of equity investments rather than subsidies in invested companies. The goal is to generate return on investment while simultaneously aligning with government policy.

    Out of more than 200 firms, there are 128 companies having significant advanced packaging & assembly (A&P) operations in China. Yole’s analysts identified around 147 plants all over China, mostly based in Jiangsu (43), Guangdong (30) and Shanghai (22) regions. In this part of the globe, more than 50% of A&P plants belongs to IDMs . A number of Taiwan-HQ OSAT plants are concentrated in Jiangsu, especially in the Suzhou Industry Park. Indeed global OSATs such as Amkor Technology and SPIL are investing in advanced packaging capability of their own Chinese operations: China (Shanghai) operation is the Amkor’s second-largest factory by revenue. The advanced packaging market growth is led by JCET/STATSChipPAC, Huatian, NFME & China WLCSP. And the Chinese advanced packaging market is offering a wide range of platforms including:
      •  Flip-chip technology is the largest advanced packaging market segment in China reaching US$ 1,8 billion in 2015. The Flip-chip market is covering bumping and assembly steps. “We see a huge ramping of bumping capacity in China, especially by Chinese players with 12” Cu pillar process,” comments Santosh Kumar from Yole. “This growth is mainly supported by the Flip-chip industry in China showing a 16% CAGR between 2015 and 2020”. Flip-chip platform is followed by WLCSP technology with US$ 343 million in 2015 as well.
      •  Fan-out and 2.5/3D platforms are only emerging in China and will have less than 1% market share by 2020.

    Under its latest advanced packaging report, Yole’s advanced packaging team points out the key market drivers of this industry. They list:
      •  Long-term growth in China IC industry
      •  Aggressive mergers & acquisitions
      •  Numerous Chinese government initiatives
      •  Investments led by global OSATs
    This analysis also gives an overview of China’s semiconductor ecosystem and discusses in detail the country’s advanced packaging market. A detailed description of this analysis is available on i-micronews.com, advanced packaging reports section.

    Yole confirms its commitment towards the Chinese industry: its collaboration with the National Center for Advanced Packaging (NCAP China) and the organization of the Advanced Packaging and System Integration Technology Symposium are showing consulting company’s desire to reinforce its business position and expand its existing network in this region. After the success of this 2nd edition in April 2016, Yole and NCAP announce the 3rd edition in 2017. Stay tuned!
    Your contact: Camille Veyrier (veyrier@yole.fr).

    Source: www.yole.fr

     

  • OUTLINES:

    • New functions are pushing change in CMOS image sensors, boosting the market towards US$18.8 billion in 2021 at 10.24% CAGR.
    • Beyond US$10 billion, the CMOS image sensor industry keeps growing new market and technology dynamics.
    • The CIS industry has become an attractive part of the semiconductor industry, generating more than US$7 billion of mergers & acquisition last year.
    • Technology remains a key driver for the CIS industry: 3D stacking, computational approaches, biometry and more...

    LYON, France – June 22, 2016: Driven by renewed mobile and automotive applications, the CIS industry is expected to expand at a CAGR of 10.4% from 2015 to 2021, reaching US$18.8 billion market value by 2021. Yole Développement (Yole), the “More than Moore” market research and strategy consulting company, expects sustained growth of the CIS industry for the next five years. Increasing camera content in smartphones will more than offset slower smartphone volume growth. The trend for dual and 3D cameras will have a major impact on CIS volumes. While it is too early to fully describe the strategy of the main actors yet, some products are already on the market. What is the status of the CIS industry today? What will be the impact of the disruptive technologies? Beyond the technical challenges, who will be the winners? ...Under the Status of the CMOS image sensor industry 2016: New market & technology dynamics report, Pierre Cambou, Activity Leader, Imaging & Sensors at Yole and Jean-Luc Jaffard, formerly at STMicroelectronics and part of Red Belt Conseil both pursue their investigation and propose you to discover the latest market & technology trends.


    This 2016 edition comprehensively covers key market and technology choices, announces Yole. Indeed with this new technology & market report, the consulting company proposes a powerful analysis of the CIS applications with a relevant market segmentation and detailed technology roadmap. Yole also points out the related sensor technologies per application and analyze the market positioning of the major CIS firms. This report presents the main drivers and challenges of the CIS industry. 

    One big story in 2016 is the consumer market, which is recovering from the total collapse of digital photography. While action cameras seem to have reached a ceiling, new applications such as drones, robots, virtual reality and augmented reality are ready to rejuvenate this emblematic market. The automotive camera market has established itself as a key growth market for CIS. The ADAS trend is further increasing pressure on vendors to provide sensors beyond their current technical capabilities. Image analysis is the new frontier and early usage of artificial intelligence is catching people’s imagination. “We are therefore in the middle of an explosive growth pattern that will not slow down before 2021,” comment Pierre Cambou from Yole. “An exceptionally high 23% CAGR is predicted in automotive for the 2015-2021 period.”
    For similar reasons to automotive, namely increasing usage of image analytics and improved performance and productivity, the security, medical and industrial market are currently thriving and all deserve specific analysis.

    “The CIS industry has become an attractive part of the semiconductor industry, generating more than US$7 billion of mergers & acquisitions last year”, asserts Pierre Cambou. Big moves in the CIS industry have greatly modified the competitive landscape:
      •  Sony is now a market, production and technology leader.
      •  Samsung and Omnivision have remained strong.
      •  Notable mergers and acquisitions in 2015 include:
          o The purchase of Axis by Canon for US$2.8 billion
          o Fairchild by On Semiconductor for US$2.4 billion
          o And Omnivision by a Chinese investor consortium for US$1.9 billion.
      •  Other notable news items are the sale of Toshiba’s CIS business to Sony for US$155 million and in 2016 Toshiba’s medical business to Canon for US5.9 billion.

    Sony truly demonstrated its leadership in 2015. Its capital expenditure hit US$2 billion, a level never seen before. That Sony has 50% of the world’s production capacity with ‘only’ 35% global market share shows its ambition. Its current lack of profitability shows that market pressure is extremely high. It is also in the middle of key transformative changes to adapt to the impressive growth of the last five years. Nevertheless Yole expects competition in CIS will remain relatively open as long as the growth pattern is maintained and key technology changes occur almost every other year.
    SK Hynix is a great example of how quickly a prominent position can be obtained. The company has propelled itself into the top 10 in very little time. It has been able to monetize the increasing resolution of smartphone front-facing cameras, therefore capturing business from Galaxycore and Omnivision.
    Navigating through this pivotal time is difficult. Giant tech companies seem to rise and fall overnight.

    Under this new report, Yole’s analysts gives a global overview of key markets and technologies for CIS. It shows the present situation and the dynamic forces shaping the future.
    A detailed description of this technology & market analysis is available on i-micronews.com, imaging reports section.

    Source: www.yole.fr

     

  • OUTLINES:

    • What does the future hold fo the MEMS industry?
    • Amid a commodization paradox, Chinese players taking off, sales stabilization and new applications, how can the MEMS industry regenerate value?
    • Outlook for 2016 and beyond...

    LYON, France – June 8, 2016: Recent years have been a golden age for MEMS markets, with large, increasing volumes driven by consistent smart phone shipment growth. “We have now entered more uncertain times,” announces Yole Développement (Yole). The market for smart phones/portable applications is levelling out, meaning MEMS markets are growing more slowly than in previous years. Today, CAGR from 2015-2021 for the value of MEMS markets will be 8.9%, moving from US$11.9 billion to US$20 billion. Over the same period the CAGR of units shipped will be 13%.

    Under the Status of the MEMS Industry (2016 Edition) report, Yole proposes a close and detailed analysis of the MEMS industry status. It is comprehensive understanding of the MEMS markets and related applications (automobile, consumer, defense & aeronautics, medical, industry and telecommunications). Yole’s report details the MEMS players’ dynamics and market figures for the 2015 – 2021 period. MEMS & Sensors team from Yole also identified emerging MEMS devices and invite you to discover the detailed review of the MEMS game-changers and industry trends.

    Consumer is no longer a goldmine… The consumer market is challenging MEMS manufacturers. Although volumes are still increasing, this market is becoming highly competitive. Use of sensors such as MEMS microphones, inertial, pressure and gas sensors in mobile phones is spreading, but these devices have very low margins today. Since 2013, MEMS ASP for consumer applications has fallen below US$ 1. Meanwhile, end users are giving their suppliers a hard time as the business relationship is sometimes very short, shifting from one device maker to another. Moreover, Yole’s analysts do not see large volume markets being a short-term growth driver for MEMS:
      •  The Internet of Things (IoT) is still a niche market today. The main applications are industrial, not looking for low costs and large volumes.
      •  Wearable electronics applications look very promising as part of the consumer industry, however volumes are not yet high.
    … But there are some rich seams in other markets Industrial, medical and automotive applications still offer pockets of growth and profitability. “The car industry is still hungry for sensors, with 20 MEMS devices per car on average today, and autonomous cars might offer more possibilities for MEMS technologies,” comments Dr Eric Mounier, Senior Technology & Market Analyst at Yole. And he adds: “New opportunities in medical come with long-term developments that are finding the market today. These include silicon microfluidic chips for medical micropumps, with Debiotech earning significant revenue from its MEMS micropump in 2015. Industrial and defense markets also provide growing opportunities for high-end and high-margin devices such as inertial and pressure sensors.”

    How can companies escape the commodization paradox? Over the past five years, the MEMS industry has been driven by increasing volume from the consumer industry with smart phones and wearables. This industry has in turn pushed for smaller dies for integration in thinner handsets. This reduced prices, shrinking margins so that the MEMS market currently does not have the same comfortable growth rate as previous years. There are several ways to escape this commodization paradox:
      •  The “Production Infrastructure” pathway with either shared manufacturing infrastructure cost with other applications, for example between automotive and consumer, or improved processes that lower cost, like CMOS MEMS.
      •  The “Creation of Value” pathway with either new devices, like gas sensors, merging with other sensors to make combos, or improved sensor output. The CMOS image sensor (CIS) industry offers an example of the last option, solving the commodization issue by increasing pixel and die size, and therefore also price, as customers’ value high quality pictures. “Creation of Value” is closely linked to the growing importance of software embedded within the sensor to deliver higher level functions for system makers.

    Outlook for 2016 and beyond: what can we expect? We believe the MEMS markets will continue to grow and will provide interesting business opportunities. We see new devices coming that could be interesting growth drivers in the future, including gas and environmental sensors and combos, ultrasonic MEMS, and silicon microfluidics. Along with these new devices, some established ones promise more growth such as radio-frequency MEMS or inertial measurement units (IMUs).
    “2016 might be challenging for MEMS companies, but there are also opportunities with emerging and growing demand for pressure and gas sensors, fingerprints, and autofocus shaping the consumer market,” asserts Claire Troadec, Technology & Market Analyst, Semiconductor Manufacturing from Yole. “At Yole, we believe the future growth of the MEMS market will be driven by various applications, including smartphones, wearables, automotive and medical.” A detailed description of this report is available on i-micronews.com, MEMS & Sensors reports section.

    Key results of this report will be presented during the next few weeks. Yole’s team encourages you to attend the following events:
      •  Sensors Expo & Conference, IoT 2.0 session: during his talk, entitled “Inertial, environmental, optical sensors: We haven't seen it all yet!” (On June 21 at 9:45 AM) Yole’s speaker, Guillaume Girardin, Technology & Market Analyst will highlight the latest MEMS innovations and related business opportunities.
      •  Sensors for Drones & Robots webcast organized by Yole and sponsored by Parot. This free webcast will take place on June 21 at 8:00 AM PDT. Speakers are Yannick Lévy, VP of Corporate Business Development, Parrot and Pierre Cambou, Activity Leader, in Imaging & Sensors, Yole.
    To discover the program and register right now please click Drones & Robots.

    Be part of Yole’s network and every day, learn more about MEMS innovations & opportunities. Stay tuned!

    Source: www.yole.fr

     


 Products

  • Market & Technology Reports
    Yole Développement, together with KnowMade and System Plus Consulting, publishes a comprehensive collection of reports from market and technology to patent analyses through to teardowns and reverse costing analyses.....

  • Yole Développement, together with KnowMade and System Plus Consulting, publishes a comprehensive collection of reports from market and technology to patent analyses through to teardowns and reverse costing analyses. They cover:
    • MEMS & Sensors
    • Imaging
    • Medical Technologies
    • Photonics
    • Manufacturing
    • Advanced Packaging
    • Power Electronics
    • Batteries and Energy Management
    • Compound Semiconductors
    • LEDs

    These reports are unmatched in quality and in-depth technological detail and typically include:
    • Technology trends and evolution
    • Supply and value chain analysis
    • In depth analysis of applications and market drivers
    • Market data
    • Patent investigation
    • Component and module reverse engineering and costing analysis

    In 2015, Yole Développement published over 25 reports.
    In 2016, we plan to produce over 30 reports, and more from System Plus Consulting and KnowMade. 

    For more information, please contact David Jourdan (jourdan@yole.fr)

  • Consulting
    We support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business......

  • Yole Développement is a market research and strategy consulting company. Our unique position and methodology for market analysis in our various technology areas allows us to obtain  detailed and accurate information to meet your marketing needs.
     
    Yole Développement is able to carry out the following services:

    • Market research and marketing analysis
           – Provide market data
           – Set-up market segmentation
           – Identify of new applications and markets
           – Propose marketing strategies and action plans

    • Strategy consulting
           – Analysis of positioning to create value
           – Development of action plans to improve company performance
           – Support for plan implementation and fund raising

    • Technology analysis
           – Analysis of technical areas and definition of technology strategies
           – Process cost analysis and cost comparisons
           – Development of product and technology roadmaps

    • Patent analysis

    • On site market workshops

    • Corporate finance advisory services

    For more information, please contact Jean-Christophe Eloy (eloy@yole.fr)


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