Hortech Company

A11, 1F. No. 1, Li-Hsin 1st Rd., Hsinchu Science Park
Hsinchu,  30078

Taiwan
http://www.hortek.com.tw
  • Booth: 2308


Welcome to visit Hortech and laser micro-machining technolgy

Since September 1995, we have been focusing on laser processing and the integration of opto-mechatronic system on industry innovation development. By using green technology for friendly environment & mass production, it is our goal to research and develop the related laser dry etching optimization processing solution with precise automatic intelligence for laser applications.
We have already obtained the invention patents to be used on our solution that  integrates with our core technology, and also have such patents at Taiwan, Mainland China, US, Japan and South Korea. It is our goal to create a business opportunity with partners who would like to use laser green technology for production in the future.

 


 Press Releases

  • Since September 1995, we have been focusing on laser processing and the integration of opto-mechatronic system on industry innovation development. By using green technology for friendly environment & mass production, it is our goal to research and develop the related laser dry etching optimization processing solution with precise automatic intelligence for laser applications.
    We have already obtained the invention patents to be used on our solution that  integrates with our core technology, and also have such patents at Taiwan, Mainland China, US, Japan and South Korea. It is our goal to create a business opportunity with partners who would like to use laser green technology for production in the future.

    In 1989, we have successfully developed the Carbon Film Resistors laser trimming equipment to use as the memory model for circuit board manufactures. In 2009, we’ve successfully developed the Touch panel glass/film narrow border circuit scribing equipment, for sales to the main international manufacture of the touch panel industry. In 2011, we’ve developed the Dual stages of touch panel film narrow border circuit scribing equipment for mass production to the main international manufacture of the touch panel industry. In the year 2015, we’ve successfully developed the Touch panel 0.42mm DITO glass laser patterning equipment for sales to the main international manufacture of the navigational industry.

    In recent years, we’ve continuously developed new technology and key industry market applications, and have joined the optical-mechanical-electrical alliance of the National institution for experimental science technology equipment Development Center for the technical research forum concerning optical and electrical integration. We are a part of the Sapphire fabrication alliance of the Metal Industries Research and  Development Centre of microfabrication for the technical research forum concerning laser microfabrication. We are also a member of the three-dimensional laser fabrication alliance of the laser application center within the Industrial Technology Research Institute for the technical research forum of three-dimensional laser additive manufacturing. In 2016, we’ve entered the Hsinchu Science and Industrial Park for research and development for research-related purposes. We work along with system automation manufacturers to conduct partnerships within the laser industry to accelerate the innovation of development within Taiwan's laser industry in order to proactively increase various industrial needs.

     

    It can also be used for semiconductor micro-hole as well as a depth width ratio of the double-sided drilling to increase a higher aspect ratio to create a semiconductor probe card or IC packaging scribing or cutting processes. 

    Please visit http://www.hortek.com.tw and contact laserexp@hortek.com.tw for detail discussion.

     


 Products

  • Laser micro-machining system
    Our recently developed invention is concerning a type of laser processing machine, specifically a IC package laser drilling, double-sided ITO touch panel module laser processing machine...

  • Due to the progression of touch panel sensor technology, there are currently many electronic devices that utilize touch screens. And yet, because electricity capacitive touch screens’ induction is created through the use of wet chemical etching and multi-layer procedures such as: mask production, development and exposure, chemical etching and cleansing; all repeated multiple times with different strategies to form and repair, etc. it is not only complicated but difficult to maintain efficiency. This invention for one example, provides a type of double-sided thin film laser patterning processing machine, used for one glass touch panel solution. The advantage of laser micro-machining system contains relatively the highest yield by user-proved, laser direct writing for one side thin film patterning without damaging the thin film on the other side, and/or continue to laser direct write on the other side with the highest quality. The automatic system contains: a laser processing machine and a 6 axis robot arm with load/unload module. The laser processing machine is composed of: a laser source, a beam delivery module with focuser module, a beam-shaping module and the total 7 axis motion stage by real time control. The processing steps includes loading the machined goods onto the initial table manually, and then the robot will move the machined goods onto the motion stage. An optical XY inspection measuring device and laser Z axis ranger are used to detect the location of a machined goods based on the current horizontal coordinates with the current level of height; and a control equipment based on the optimal parameters to make the XYZ with laser parameters for current conditions, driving the 5-axis motion platform to move the machined goods to a best level of processing that coordinates with each parameter of processing, and driving beam delivery with focuser module guiding the laser beam to focus on the first side surface of the machined goods that needs to be machined upon. The robot arm, communicating with the laser processing human machine interface to accept the controls of a laser processing machine, will finish the first laser patterning on the first surface of the machined goods, and then it will flip the machined goods by the inversing table to allow the laser processing machine to work on the other side of the machined goods that is supposed to be machined upon.

    The innovation of this system is to make the touch panel glass sensing thinner and without lamination, and also become a thin single glass XY sensor. This single glass sensor is currently capable to be designed to 0.4mm thin for glass double-sided thin film with XY sensors, using lasers for direct writing process and for isolation patterning line-width of less than 10um. This technology will enable the touch panel sensing circuit manufactured by the wet process to switch to use green manufacturing technology by laser process, offering higher manufacturing flexibility.

    According to the process mentioned above concerning the double-sided laser machine, it is suitable for machined goods in need of double-sided laser processing. Through the precise alignment and energy control, the laser process of one side of a machined surface will not hurt the other side of the machined surface. When applied on the manufacturing of touch panels, it can replace the complex wet process step, and can also enhance the efficiency of the process. At the same time, it can also be used for semiconductor micro-hole as well as a depth width ratio of the double-sided drilling to increase a higher aspect ratio to create a semiconductor probe card or IC packaging scribing or cutting processes. 

     


 Additional Info

New Exhibitor:
No
New Products:
Yes
Displaying Equipment:
No
Product Demonstrations:
No
Please indicate which segment(s) your company serves
MEMS, Semiconductor, Packaging/Assembly
If you checked Other, please indicate your Company Industry
Hortech focus on laser processing solution and system integration for Semiconductor, touch panel, OLED,....

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