TeraView is pleased to announce the launch of its new product, the EOTPR 5000 at SEMICON West 2016
San Francisco, California July 12, 2016 – TeraView, the pioneer and leader in terahertz technology and solutions (http://www.teraview.com/) is pleased to introduce our fully automated integrated circuit (IC) package inspection system, the EOTPR 5000. Building on the success of the EOTPR 2000 which has an established track record in the industry for rapid fault isolation and manual inspection, the EOTPR 5000 is a fully automated advanced IC package inspection system that utilizes TeraView’s proprietary EOTPR terahertz technology to detect weak or marginal interconnect quality in high volume manufacturing environments, which no other technology can detect today.
Today’s advanced IC packages are susceptible to a variety of faults and quality variations, including solder ball defects such as head-in-pillow failures in Package-on-Package (PoP) or 2.5/3D packages. These weak or marginal interconnect conditions may not be captured by logic or electrical testers even if there is a good electrical continuity present. However, due to the EOTPR 5000’s superior accuracy and sensitivity, users can now detect minute shifts in impedance changes from weak or marginal interconnects after accelerated life tests or high temperature cycle tests. The same principle applies to the detection and reduction of manufacturing variations to improve packaging-related yield, since the complexity of the advanced IC packages is increasing while the features sizes are decreasing. The goal of the EOTPR 5000 is to improve yield and reliability of today’s advanced IC packages.
The EOTPR 5000 is truly a one-of-a-kind interconnect quality inspection tool for advanced IC packaging technology in high volume manufacturing environment. No other tool can inspect and detect like the EOTPR 5000.
Dr. Don Arnone, TeraView CEO commented, “We are excited not only for TeraView, but also for the entire terahertz industry to announce the launch of the EOTPR 5000. This product will be the first terahertz system ever to be deployed in a mass production environment. It will be deployed to detect weak or marginal interconnects in the advanced IC packages which no other testers or inspection equipment can detect. This is a truly revolutionary inspection system for the world’s leading IC manufacturers and OSATs.”
According to Martin Igarashi, VP of TeraView’s Semiconductor Business, “Until the EOTPR 5000’s arrival, IC manufacturers did not have 100% confidence in a so-called “golden device” or “known good device or KGD”. How would you know that your golden device is truly golden? But with the EOTPR 5000, combined with other existing inspection methods, IC manufacturers now can breathe a sigh of relief that their devices are reliable, and when their devices are put in their customers’ smart phones or tablet devices, their confidence level should be significantly higher because of the EOTPR 5000. We are starting beta testing of the EOTPR 5000 at a major IC manufacturer’s site in Asia shortly to demonstrate that this product meets the rigor of the 24x7 IC manufacturing environments. This product will be available for customers in early 2017.”
Please visit us at Semicon West 2016 at booth number 5771