TeraView LTD

Platinum Building
St. John's Innovation Park
Cambridge,  CB4 0DS

United Kingdom
http://www.teraview.com
  • Booth: 5771

TeraView is the world’s first and leading company solely focused upon the application of Terahertz light to provide solutions to customer issues. A spin out from the Toshiba Corporation and Cambridge University, TeraView has developed its proprietary technology across a number of markets. These include fault analysis and quality assurance for semiconductor chips used in mobile computing and communications, as well as non destructive inspection of high value coatings used in the automotive, pharmaceutical, food and solar industries. Headquartered in Cambridge UK, sales and customer support are available throughout the Far East, North America and Europe either directly or through a network of distributors.


 Press Releases

  • TeraView is pleased to announce the launch of its new product, the EOTPR 5000 at SEMICON West 2016

    San Francisco, California July 12, 2016 – TeraView, the pioneer and leader in terahertz technology and solutions (http://www.teraview.com/) is pleased to introduce our fully automated integrated circuit (IC) package inspection system, the EOTPR 5000.  Building on the success of the EOTPR 2000 which has an established track record in the industry for rapid fault isolation and manual inspection, the EOTPR 5000 is a fully automated advanced IC package inspection system that utilizes TeraView’s proprietary EOTPR terahertz technology to detect weak or marginal interconnect quality in high volume manufacturing environments, which­ no other technology can detect today.

    Today’s advanced IC packages are susceptible to a variety of faults and quality variations, including solder ball defects such as head-in-pillow failures in Package-on-Package (PoP) or 2.5/3D packages. These weak or marginal interconnect conditions may not be captured by logic or electrical testers even if there is a good electrical continuity present. However, due to the EOTPR 5000’s superior accuracy and sensitivity, users can now detect minute shifts in impedance changes from weak or marginal interconnects after accelerated life tests or high temperature cycle tests.  The same principle applies to the detection and reduction of manufacturing variations to improve packaging-related yield, since the complexity of the advanced IC packages is increasing while the features sizes are decreasing.  The goal of the EOTPR 5000 is to improve yield and reliability of today’s advanced IC packages.

    The EOTPR 5000 is truly a one-of-a-kind interconnect quality inspection tool for advanced IC packaging technology in high volume manufacturing environment. No other tool can inspect and detect like the EOTPR 5000.

    Dr. Don Arnone, TeraView CEO commented, “We are excited not only for TeraView, but also for the entire terahertz industry to announce the launch of the EOTPR 5000.  This product will be the first terahertz system ever to be deployed in a mass production environment.  It will be deployed to detect weak or marginal interconnects in the advanced IC packages which no other testers or inspection equipment can detect.  This is a truly revolutionary inspection system for the world’s leading IC manufacturers and OSATs.” 

    According to Martin Igarashi, VP of TeraView’s Semiconductor Business, “Until the EOTPR 5000’s arrival, IC manufacturers did not have 100% confidence in a so-called “golden device” or “known good device or KGD”.  How would you know that your golden device is truly golden?  But with the EOTPR 5000, combined with other existing inspection methods, IC manufacturers now can breathe a sigh of relief that their devices are reliable, and when their devices are put in their customers’ smart phones or tablet devices, their confidence level should be significantly higher because of the EOTPR 5000.   We are starting beta testing of the EOTPR 5000 at a major IC manufacturer’s site in Asia shortly to demonstrate that this product meets the rigor of the 24x7 IC manufacturing environments.  This product will be available for customers in early 2017.”

    Please visit us at Semicon West 2016 at booth number 5771


 Products

  • EOTPR 5000
    The EOTPR 5000 is a THz based advanced IC package inspection system. The EOTPR 5000 offers high accuracy and high sensitivity inspection method to inspect weak or marginal interconnect quality....

  • Today’s advanced IC packages are susceptible to a variety of faults and quality variations, including solder ball defects such as head-in-pillow failures in Package-on-Package (PoP) or 2.5/3D packages. These weak or marginal interconnect conditions may not be captured by logic or electrical testers even if there is a good electrical continuity present. However, due to the EOTPR 5000’s superior accuracy and sensitivity, users can now detect minute shifts in impedance changes from weak or marginal interconnects after accelerated life tests or high temperature cycle tests.  The same principle applies to the detection and reduction of manufacturing variations to improve packaging-related yield, since the complexity of the advanced IC packages is increasing while the features sizes are decreasing.  The goal of the EOTPR 5000 is to improve yield and reliability of today’s advanced IC packages.
     
    The EOTPR 5000 is truly a one-of-a-kind interconnect quality inspection tool for advanced IC packaging technology in high volume manufacturing environment. No other tool can inspect and detect like the EOTPR 5000.
  • EOTPR 2000
    The EOTPR 2000 is a state of the art non-destructive fault isolation system for today's most demanding IC package failure analysis to isolate IC package failure locations in seconds to an accuracy of 5um....

  • The EOTPR 2000  is used to identify and quickly isolate faults on the interconnects of advanced packages. The injected pulse refl ects off faults within DUT locating their position with an improved accuracy of 5 μm. Applications include Flip Chip, Package-on-Package (PoP), and Through-Silicon Vias (TSV).

    Key advantages of the EOTPR system
    ● Quick non-destructive fault isolation - minutes rather than days
    ● Identification of weak connections that may lead to future faults
    ● Ability to isolate faults not previously seen with conventional TDR


 Additional Info

New Exhibitor:
Yes
New Products:
Yes
Displaying Equipment:
No
Product Demonstrations:
No
Please indicate which segment(s) your company serves
Test, Packaging/Assembly

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