Aehr Test Systems

400 Kato Terrace
Fremont,  CA  94539-8332

United States
http://www.aehr.com
  • Booth: 5851

Aehr Test Systems has been a leading producer of test and burn-in equipment since 1977. The company develops, manufactures and sells systems that are designed to reduce the cost of test and perform reliability screening (burn-in) of complex logic and memory integrated circuits (ICs) such as Digital Signal Processors (DSPs), Dynamic Random Access Memories (DRAMs), Flash memories and other ICs. Aehr's systems can be configured for burning-in and testing devices as packaged parts, bare die or full wafer. Aehr Test Systems has over 2,500 systems installed worldwide with offices in the USA, Germany, Japan, and Taiwan.


 Press Releases

  • Aehr Test Systems Announces Delivery of New FOX-XP™ Wafer Level Test and Burn- in

    System

    Fremont, CA (February 29, 2016) – Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of

    semiconductor test and burn-in equipment, today announced that it has received customer acceptance for and

    delivered its first FOX-XP Wafer Level Test and Burn-in System. The order included multiple FOX-XP WaferPak

    Contactors and application development services. The delivery occurred in the third quarter of Aehr Test’s fiscal

    2016, which closes on February 29, 2016.

    Gayn Erickson, President and CEO of Aehr Test Systems, commented, “We are very excited to have delivered

    this first FOX-XP system and are pleased with the performance of this latest member of our FOX-P family. This

    system is configured for a single wafer but is scalable in our production systems for up to 25 wafers or more in

    parallel in a single test cell. In addition, this unique multi-wafer system uses our proprietary WaferPak wafer

    contactor, which is a critical portion of the solution for this particular application, due to certain specific technical

    requirements for testing and handling these wafers.

    “This FOX-XP system and the WaferPak Contactors will be used for reliability and qualification test of sensor

    devices intended for a very high volume application. We believe our high power FOX-XP multi-wafer system is a

    perfect fit for this application and represents a significant new opportunity as this device moves into high volume

    manufacturing with wafer level burn-in. We believe the success of the engineering tests that are being run on this

    system will lead to volume production orders from this customer. This customer anticipates that they will need a

    significant number of systems to meet their device volume shipments beginning in the fourth quarter of this

    calendar year and ramp through the entire calendar years 2017 and 2018.”

    Aehr Test’s FOX-XP system is the company’s next-generation multi-wafer test solution that is capable of

    functional test and burn-in/cycling of flash memories, microcontrollers, sensors, and other leading- edge ICs in

    wafer form before they are assembled into single or multi-die stacked packages or for non-packaged die sales or

    applications where known good die is critical. These singulated die or single-die or stacked-die packaged parts

    can then be used for high reliability and quality applications such as enterprise solid state drives, automotive

    devices, highly valuable mobile applications, and mission critical integrated circuits and sensors. The FOX-XP

    system utilizes Aehr Test's FOX WaferPak contactor, which provides a cost effective solution for making electrical

    contact with a full wafer or substrate in a multi-wafer environment. Aehr Test’s WaferPak contactors contain up to

    tens of thousands of probes to contact all devices on wafers and substrates up to 300mm simultaneously. The

    FOX-XP system is being developed in configurations of 25 wafers in parallel in a single cell to operate within an

    efficient manufacturing space footprint. Aehr Test estimates the test equipment and consumables for the

    emerging multi-wafer level test and burn-in market will add $200 million to $300 million to its served available

    market.

    About Aehr Test Systems

    Headquartered in Fremont, California, Aehr Test Systems is a worldwide provider of test systems for burning-in

    and testing logic and memory integrated circuits and has an installed base of more than 2,500 systems

    worldwide. Increased quality and reliability needs of the Automotive and Mobility integrated circuit markets are

    driving additional test requirements, capacity needs and opportunities for Aehr Test products in package and

    wafer level test. Aehr Test has developed and introduced several innovative products, including the ABTSTM and

    FOX families of test and burn-in systems and the DiePak® carrier. The ABTS system is used in production and

    qualification testing of packaged parts for both lower-power and higher-power logic as well as all common types of

    memory devices. The FOX system is a full wafer contact test and burn-in system used for burn-in and functional

    test of complex devices, such as leading-edge memories, digital signal processors, microprocessors,

    microcontrollers and systems-on-a-chip. The DiePak carrier is a reusable, temporary package that enables IC

    manufacturers to perform cost-effective final test and burn-in of bare die. For more information, please visit the

    Company’s website at www.aehr.com.

  • Aehr Test Systems Receives $6 Million Order for a FOX-15™ Multi-Wafer Burn-In

    System for Production Test & Burn-In Application

    Fremont, CA (April 27, 2015) - Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of

    semiconductor test and burn-in equipment, today announced it has received an order from a new

    customer for a FOX-15 Multi-Wafer Test and Burn-In System, multiple WaferPak™ contactors and a

    WaferPak Aligner. The order is for more than $6 million and is for a production test and burn-in

    application. The order includes prepayments in order to lock in lead times and volume-related discounts

    and is expected to ship within the next six months.

    “We are very excited to announce our initial order from this major new customer,” said Gayn Erickson,

    President and CEO of Aehr Test Systems. “This production customer is extremely quality and cost

    conscious, which makes them a great match for the reliability and yield improvements that our wafer level

    burn-in and test solutions provide.”

    “We see the markets for automotive sensors and infotainment, mobile consumer electronic devices,

    servers with high-reliability stacked flash memory, and ultimately the Internet of Things (IoT), as key

    growth opportunities for Aehr Test’s wafer level test and burn-in solutions,” said Carl Buck, Aehr Test Vice

    President of Marketing. “Aehr Test currently has an installed base of customers using our FOX-15 multiwafer

    test systems in the automotive sensor and data communications spaces with systems configured to

    test and burn-in 15 wafers in parallel in high volume production today. This new customer’s production

    application represents a significant opportunity for Aehr Test as we expand our unique and highly cost

    effective wafer level test and burn-in solution into the rapidly growing automotive, consumer, mobile, and

    computing markets.”

    Buck continued, “Extensive test and burn-in is required to weed out early-life failures to meet the

    standards of automotive and quality conscious consumer, server, and mobile device manufacturers. The

    challenge is how to handle these devices, which are often extremely small, measuring in the one to few

    millimeters in size and having thousands or even tens of thousands of devices per wafer. Contacting the

    devices in package form is often both impractical and expensive. Aehr Test provides a unique solution to

    contact and test all of the devices at once in wafer form. Today, we test wafers with up to 20,000 devices

    at a time and can do this at elevated temperatures up to 170C with our proprietary WaferPak contactors.

    Typical packaged part burn-in systems can only go to 150C and typical wafer probe cards used in

    production today may only go up to 125C. Aehr Test can make contact with the very small contact pads

    that are often under 100 microns wide (less than four one-thousandths of an inch) and 200 microns apart

    from each other versus typical pads on surface mount package parts with 300 microns wide pads that are

    1,000 microns apart. Our customers have shown that handling and burning-in their devices in wafer form

    is much more reliable and leads to higher quality and lower defect rates in the end products. Our FOX-15

    multi-wafer burn-in system can burn-in 15 wafers at once, allowing customers to test thousands of

    devices on each of the 15 wafers in parallel, providing them with a very low cost platform for doing test

    and burn-in of their wafers.”

    Aehr Test’s FOX family of products is focused on high reliability test needs and long-duration full wafer

    burn-in and test of products such as sensors, automotive ICs, discrete memories, and devices with

    embedded memories including microcontrollers and smart card devices. The FOX-1 system offers highthroughput

    single-touchdown sort testing. The FOX-15 system has a capacity of up to 15 WaferPak

    single-touchdown full wafer contactors for burn-in and test of state-of-the-art integrated circuits and

    sensors. Testing the ICs in wafer form before they are assembled into multi- die stacked packages

    enables the stacked packages to then be used for high reliability and quality applications such as

    enterprise solid state drives, automotive devices, mission critical integrated circuits and sensors. Aehr

    Test’s recently-introduced FOX-1P system extends the capabilities of its FOX-1 system by adding high

    density, low cost I/O and DPS modules with the capability to provide over 16,000 I/O or DPS channels in

    a single test head for massive parallelism on a single wafer.

    About Aehr Test Systems

    Headquartered in Fremont, California, Aehr Test Systems is a worldwide provider of test systems for

    burning-in and testing logic and memory integrated circuits and has an installed base of more than 2,500

    systems worldwide. Increased quality and reliability needs of the Automotive and Mobility integrated

    circuit markets are driving additional test requirements, capacity needs and opportunities for Aehr Test

    products in package and wafer level test. Aehr Test has developed and introduced several innovative

    products, including the ABTSTM and FOX families of test and burn-in systems and the DiePak® carrier.

    The ABTS system is used in production and qualification testing of packaged parts for both low-power

    and high-power logic as well as all common types of memory devices. The FOX system is a full wafer

    contact test and burn-in system used for burn-in and functional test of complex devices, such as leadingedge

    memories, digital signal processors, microprocessors, microcontrollers and systems-on-a-chip. The

    DiePak carrier is a reusable, temporary package that enables IC manufacturers to perform cost-effective

    final test and burn-in of bare die. For more information, please visit Aehr Test’s website at www.aehr.com.

  • Aehr Test Systems Announces $1.7 Million Follow-On Order for ABTS™ Burn-in and

    Test Systems from Leading IC Manufacturer

    Fremont, CA (June 25, 2015) - Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of semiconductor

    test and burn-in equipment, today announced that it has received a $1.7 million follow-on order for its Advanced

    Burn-in and Test Systems (ABTS) from a leading multi-national manufacturer of advanced logic integrated circuits

    (ICs) for automotive, embedded processing, digital signal processing and analog applications. The order includes

    prepayments in order to lock in short lead times and special pricing, and the systems are expected to ship within

    the next six months.

    “We are pleased to receive this follow-on order for additional systems,” said Mark Allison, vice president of sales

    at Aehr Test Systems. “The customer is running at full capacity in their production burn-in and test area and

    needed to add capacity quickly due to increasing demand for their advanced automotive devices. The ABTS

    systems, with their individual temperature control capability for high-power devices, are a key part of the

    customer’s quality and reliability program for their expanding line of automotive products.”

    “Automobiles are making increasing use of infotainment, safety and communications systems,” said Carl Buck,

    vice president of marketing at Aehr Test. “These systems consist of a range of electronic functions from sensing,

    through conversion and transmission to high-performance processing, requiring the full spectrum of analog and

    embedded processing ICs. For example, Advanced Driver Assistance Systems employ processors and sensors

    which enable multiple vision and radar systems for applications such as lane departure warning, rearview and

    surroundview camera systems, and collision warning and avoidance as well as blind spot detection. The

    manufacturers of the components of these systems are required to meet the exacting quality and reliability

    standards of the automotive market. Our systems provide our customers with the ability to screen out devices with

    latent defects in order to meet those stringent reliability requirements.”

    The ABTS family of products is based on a new hardware and software platform that is designed to address not

    only today’s devices, but also future devices for many years to come. It can test and burn-in both logic and

    memory devices, including resources for high pin-count devices and configurations for high-power and low-power

    applications. ABTS systems can be configured with up to 72 burn-in boards, up to 320 I/O channels, 32M of test

    vector memory per channel and up to 16 independent device power supplies. The ABTS system is optimized for

    use with the Sensata iSocket* Thermal Management Technology, which provides a scalable cost-effective

    solution using individual device temperature control for up to 64 devices per burn-in board and up to 75 watts per

    device or more. Individual temperature control enables high-power devices with a broad range of power

    dissipation to be burned-in simultaneously in a single burn-in chamber while maintaining a precise device

    temperature. The ABTS system also uses N+1 redundancy technology for many key components in the system to

    maximize system uptime.

    *iSocket is a trademark of Sensata Technologies, Inc.

    About Aehr Test Systems

    Headquartered in Fremont, California, Aehr Test Systems is a worldwide provider of test systems for burning-in

    and testing logic and memory integrated circuits and has an installed base of more than 2,500 systems

    worldwide. Increased quality and reliability needs of the Automotive and Mobility integrated circuit markets are

    driving additional test requirements, capacity needs and opportunities for Aehr Test products in package and

    wafer level test.

    Aehr Test has developed and introduced several innovative products, including the ABTS and FOXTM families of

    test and burn-in systems and the DiePak® carrier. The ABTS system is used in production and qualification testing

    of packaged parts for both low-power and high-power logic as well as all common types of memory devices. The

    FOX system is a full wafer contact test and burn-in system used for burn-in and functional test of complex

    devices, such as leading-edge memories, digital signal processors, microprocessors, microcontrollers and

    systems-on-a-chip. The DiePak carrier is a reusable, temporary package that enables IC manufacturers to

    perform cost-effective final test and burn-in of bare die. For more information, please visit Aehr Test’s website at

    www.aehr.com.


 Products

  • FOX-1P Product Information
    FOX-1P Product Information...

  • FOX-1P Product Information

  • FOX-XP Product Information
    FOX-XP Product Information...

  • FOX-XP Product Information
  • ABTS-Pi Product Information
    ABTS-Pi Product Information...

  • ABTS-Pi Product Information

 Additional Info

New Exhibitor:
Yes
New Products:
Yes
Displaying Equipment:
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Product Demonstrations:
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Semiconductor, Test

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