FlexTech Alliance

3081 Zanker Road
San Jose,  CA  95134

United States
  • Booth: 5254

Welcome to FlexTech, a SEMI Strategic Association Partner!

FlexTech is focused on growth, profitability, and success throughout the manufacturing and distribution chain of flexible, printed electronics, by developing solutions for advancing these technologies from R&D to commercialization. As a part of SEMI, FlexTech is part of an organization which connects more than 2,000 member companies and more than a quarter-million professionals worldwide to advance the science and business of electronics manufacturing. Members are responsible for the innovations in materials, design, equipment, software, and services that enable smarter, faster, more powerful, and more affordable electronic products. Since 1970, SEMI has built connections that have helped our members grow more profitably, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C.  Visit FlexTech at www.flextech.org and SEMI at www.semi.org.

 Press Releases

  • Posted on May 11, 2016

    FlexTech, a SEMI Strategic Association Partner, today announced the formal completion of three flexible hybrid electronics (FHE) R&D projects under its U.S. Army Research Laboratory (ARL) technology investment agreement. The completed projects are with ENrG for a flexible ceramic substrate; nScrypt and NovaCentrix for a next-generation three-dimensional (3D) printing tool for creating complex and functional objects; and PARC, a Xerox company, for a flexible sensor platform. Projects ranged from 12-18 months and were managed by a member of the FlexTech Technical Council, which is a team of experts in flexible, hybrid and printed electronics technologies.

    ENrG, located in Buffalo, New York, completed a 15 month project to develop a high-yield process to create a 20 micron thick, flexible ceramic substrate capable of retaining its integrity when drilled, cut, rolled and processed at high temperatures. During the project, ENrG developed processes to print thin-film lithium batteries, circuits, application of copper cladding and other metallization with excellent performance characteristics. The project, valued at $570,000 total, was 56% cost shared by the company.

    nScrypt, based in Orlando, Florida, in partnership with NovaCentrix of Austin, Texas, developed a 3D printer for rapid prototyping of new electronic devices. The total award of $1,291,000 was cost-shared by nScrpyt, NovaCentrix and FlexTech and it was completed over a 16-month period. The new tool additively builds integrated hybrid circuits on 3D surfaces, as well as devices on flexible, low temperature, and rigid planar substrates. It integrates processing of three previously-separate tools. The first tool has been installed at ARL. Commercial tools are available from nScrypt.

    PARC, a Xerox Company, Palo Alto, California, developed a passively powered, digitally-fabricated, communication-enabled, flexible sensor platform that is easily customizable to multiple sensor types. The project addressed the availability of an end-to-end system design that can be manufactured in large quantities with digital printing for smart tag or wearable applications. In its final report, the PARC researchers noted several key areas where additional development would be helpful, including components designed specifically to be compatible with flexible, printed sensor systems. Total cost was $409,000 and shared equally between PARC and FlexTech.

    “Each of these projects, chosen and supported by the Technical Council, moves the needle on learning how to fabricate electronics on flexible substrates,” stated Michael Ciesinski, president of FlexTech. “Especially impressive is the teaming on the projects, which helps build out the FHE supply chain.”

  • Posted on June 14, 2016

    Equipment Vendor Reception: Register for the July 15 event by July 8

    NextFlex, America’s Flexible Hybrid Electronics Manufacturing Institute, invites electronics manufacturing supply chain participants attending SEMICON West 2016 to an equipment briefing at the new NextFlex hub facility in San Jose. NextFlex staff will sharing plans for its manufacturing facility, conducting tours of the cleanroom facilities being constructed, and soliciting inputs on the design and capabilities of this unique facility, which will be the first of its kind.

    Launched in August, 2015, NextFlex is a public-private consortium chartered to advance the maturity of flexible hybrid electronics manufacturing in the United States. Flexible hybrid electronics involves the integration of thinned semiconductor or other bulk devices with printed electronics on flexible substrates. This technology is envisioned to enable advanced forms of human monitoring, up to and including “smart bandages” and other therapeutic applications; flexible sensor networks for monitoring of vehicles, buildings, bridges and other high-value assets; flexible, rollable, and conformable integrated array antennas; and “soft” robotics that utilize flexible electronics to impart and control motion in prosthetics and robotic devices.

    These and other applications represent a new set of platforms for semiconductor devices, which have been limited by bulky, rigid chip packages and fixed circuit boards; unlike flex circuits, flexible hybrid electronics involves integrating semiconductor devices in ways that enable a much higher level of flexibility, as well as reducing size, weight, and power consumption. These features will enable semiconductors to be utilized in a new set of IoT edge devices that conform to the body and the built environment, as well as creating new flexible systems.

    In addition to funding manufacturing development and demonstration projects through its members, NextFlex is also building the San Jose hub to evaluate, integrate, and demonstrate advanced techniques for flexible hybrid electronics manufacturing, and is soliciting tool, equipment, material, and other electronics manufacturing supply chain participants to make their products available to the Institute as a part of a special membership category. Benefits include a high level of visibility at the NextFlex hub, as well as promotional activities highlighting those vendors that contribute to the hub facility.

    NextFlex invites interested companies and organizations to attend the briefing on July 15th, from 10:00am to 1:00pm, with lunch served. The agenda for the event follows.

    10:00      Welcome and NextFlex Overview
    10:15      Presentation of Facility Plan and Equipment Needs
    10:45      Benefits of Membership for Equipment Suppliers
    11:00      Q&A
    11:15      Facility Tour
    12:00      Lunch and Continued Discussion of Facility Plans
    1:00        Event Concludes

    To attend, please register by July 5th at www.nextflex.us/events/open-house-july/

    2244 Blach Place, Suite 150
    San Jose, CA 95131

  • Posted on June 13, 2016

    Members of FlexTech Alliance join expert panels and sessions to share insights on evolving flexible circuit market.

    MELVILLE, N.Y., June 6, 2016 — BZ Media LLC announced today that members of the FlexTech Alliance™, Heidi Hoffman, Senior Director of the FlexTech Group and Melissa Grupen-Shemansky, Chief Technology Officer of the FlexTech Group, will join Wearables TechCon™ faculty at the San Jose Convention Center, July 18-20. Hoffman will moderate the Flexible Circuits Enabling the Wearable Revolution panel which will feature Grupen-Shemansky and Jason Marsh, Director of Technology at NextFlex, sharing their perspectives on the evolution of flexible circuits and their role in the next phase of wearable tech.

    The FlexTech Alliance provides advocacy and support for companies developing flexible electronics products and technologies. Since 1994, they have played a leading role in the growth of flexible circuits. “We have been quietly helping build the un-sexy part of the wearables community for years with our work in flexible electronics, microfluidics, printing sensors, etc. I am looking forward to Wearables TechCon for the opportunity to share our thoughts on the challenges and opportunities to developing and manufacturing the building blocks for high-end technology,” said Hoffman.

    In addition to the flexible circuits panel, Wearables TechCon will include classes on other forms of wearables beyond the common smartwatch formfactor such as “The Hardest Wearables Are the Soft Ones: Challenges and Opportunities for Smart Textiles” and “System-on-Chip Innovation: The Catalyst for Next-Generation Sports and Fitness Wearables.”

    “Sometimes people think wearables are only smartwatches and pedometers, but some of the most innovative implementations of the technology can be worn like a t-shirt or fit in the sole of your shoe,” said Katie Flash, Conference Program Director for Wearables TechCon and Internet of Things TechCon.

    Wearables TechCon returns for its third year with an expanded program and the addition of a new co-located conference Internet of Things TechCon. The two conferences will share an exhibit hall with 55+ leading vendors showcasing the latest in sensor-based tech, flexible and textile circuits, wearable and IoT components, and backend services.

    Registration for Wearables TechCon—for developers, designers, builders, business decision makers and OEMs driving the next generation of wearables and the Internet of Things—is now open at www.wearablestechcon.com. Receive $100 discount off a ticket by using the code FLEX.



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