Wire bonding is the leading technology for attaching the power connections to semiconductor devices. Rather like a sewing machine, the wires are drawn from the semiconductor to the package and welded - quickly, reliably and highly flexible. Eventually though, the current carrying capacity reaches a limit. On the other hand, laser welding can join conductors of virtually any thickness, for example, on batteries for E-Vehicles. However, the process requires pre-fabricated connectors and is thus less flexible. What could be more reasonable than to take the best of both worlds and develop a laser bonder able to weld heavy wires in a highly flexible manner between two points?
Dr. Farhad Farassat, President of F&K Delvotec said, "We are very proud to be honored with the Innovation Award from Productronica for our laser bonder. The machine originates from a successful and enjoyable joint development with the Fraunhofer-Institute for Laser Technology in Aachen, within the framework of a publicly funded project. Already we are seeing considerable interest in this completely new technology."
About F&K Delvotec
F&K Delvotec has been one of the pioneers in wire bonding, the most important technology for connecting semiconductor components, for almost 40 years. As a classical "hidden champion" among the machine manufacturers, the company has been involved from the start in many attractive niche markets - most recently, for example, in batteries for E-Vehicles. F&K Delvotec is situated in the Munich area and develops and manufactures all its machines there, but exports over 80% worldwide to practically all players in the semiconductor and automotive electronics industries. Since 2014, the company is part of the medium-sized machine manufacturer, Strama-MPS in Straubing.