F&K Delvotec, Inc.

27182 Burbank
Foothill Ranch,  CA  92610-2503

United States
http://www.fkdelvotec.com
  • Booth: 6278


F&K Delvotec machines are the most flexible on the market.

F&K Delvotec is the worldwide leader in innovative wire bonding technology. Delvotec's expansive portfolio of products deliver intelligent one-stop shop solutions for any wire bonding application, from lab bond process development to completely automated systems. Over 40 patents in wire bonding technology, and award-winning new products and customer satisfaction, attest to the continuing emphasis on providing innovative solutions that drive the industry forward. Whatever bonding is required, Delvotec delivers smart technology that follows the "staying ahead" philosophy that is the heart of the company. F&K's corporate office is in Germany, with satellite offices in Singapore and the U.S. For more information, please visit www.fkdelvotec.com. 


 Press Releases

  • Wire bonding is the leading technology for attaching the power connections to semiconductor devices. Rather like a sewing machine, the wires are drawn from the semiconductor to the package and welded - quickly, reliably and highly flexible. Eventually though, the current carrying capacity reaches a limit. On the other hand, laser welding can join conductors of virtually any thickness, for example, on batteries for E-Vehicles. However, the process requires pre-fabricated connectors and is thus less flexible. What could be more reasonable than to take the best of both worlds and develop a laser bonder able to weld heavy wires in a highly flexible manner between two points?

    Dr. Farhad Farassat, President of F&K Delvotec said, "We are very proud to be honored with the Innovation Award from Productronica for our laser bonder. The machine originates from a successful and enjoyable joint development with the Fraunhofer-Institute for Laser Technology in Aachen, within the framework of a publicly funded project. Already we are seeing considerable interest in this completely new technology."

    About F&K Delvotec

    F&K Delvotec has been one of the pioneers in wire bonding, the most important technology for connecting semiconductor components, for almost 40 years. As a classical "hidden champion" among the machine manufacturers, the company has been involved from the start in many attractive niche markets - most recently, for example, in batteries for E-Vehicles. F&K Delvotec is situated in the Munich area and develops and manufactures all its machines there, but exports over 80% worldwide to practically all players in the semiconductor and automotive electronics industries. Since 2014, the company is part of the medium-sized machine manufacturer, Strama-MPS in Straubing.


 Products

  • SmartBonder G6
    Generation 6 Fully Automatic Wire Bonder capable of ball, wedge and ribbon bonding. The most compact machine in our lineup has the latest F&K Developments....

  • The SmartBonder G6 is the latest generation bonder in the family of technology-driven and innovative solutions offered by F&K Delvotec. The G6 has the smallest overall footprint and the most recent developments from F&K, including a new motion control system, new drive electronics, and new ultrasonic control.

    The NEW Motion Control System includes state-of-the-art linear motors, swiss precision linear guides and special development by THK.

    The NEW Drive Electronics include integrated motion control, fewer boards, and simpler electronics.

    The NEW Ultrasonics Control features a new communication interface to the bonder (Gin-LINK), better control and faster feedback from the generator to the host, new controller model with FPGA and a new amplifier board with 50% more power than the previous generation.

  • G5 Fully Automatic All-in-One Bonder
    Generation 5 Fully Automatic All-in-One Bonder covers all current wire bonding processes....

  • The compact, space saving Wire Bonder G5 is multi-talented. Highly innovative and flexible, the G5 covers all wire bonding processes. Its features include bond heads that can be exchanged in under 15 minutes and comprehensive solutions for automation and handling from the lab to production.
  • F&S Bondtec Series 58
    The Production Machine...

  • New Large Area Benchtop Wire Bonder with interchangeable bond heads. Whether you need 1K to 100K bonds per day, this all-in-one bonder will fit your needs from the lab to production.

 Additional Info

New Exhibitor:
No
New Products:
Yes
Displaying Equipment:
Yes
Product Demonstrations:
Yes
Please indicate which segment(s) your company serves
Photovoltaic, Power Semiconductors, Semiconductor, Test, Packaging/Assembly

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