2401 Crest Line Dr.
Madison,  WI  53704-2840

United States
  • Booth: S19

Check out our approach to flexible hybrid device assembly!

systeMECH is developing tools and processes based on our patented direct-transfer printing technology for transferring thin, high-performance semiconductor components onto flexible substrates in order to build flexible hybrid electronic (FHE) devices. In addition to being able to transfer components that are thinner and laterally smaller than those that can be supported by conventional tools, a key differentiator of our technology is that only a single transfer-printing step is involved, thus eliminating the time and materials required to handle fragile IC components with a temporary carrier. Printing tools and processes based on our core technology will significantly lower the technological barriers that are hindering the widespread manufacture of flexible devices that integrate high-performance semiconductors into their architectures. 

 Press Releases

  • In July, 2015, systeMECH, LLC completed an STTR Phase II project funded by the Air Force to develop a new rolling-based printing approach for transferring arrays of patterned micro- and nano-structures directly from rigid fabrication substrates onto flexible substrates. The printing approach is designed to enable a new class of large-area, flexible photonic devices based on inorganic materials patterned to have sub-optical-wavelength dimensions. The rolling-based process can be integrated into a roll-to-roll manufacturing line or can be used as a standalone tool. Tools based on systeMECH's novel approach can enable researchers and manufacturers to produce a range of nanomembrane-based flexible photonic and electronic devices.



  • In June, 2016, systeMECH, LLC completed an STTR Phase I project funded by the National Science Foundation to demonstrate the feasibility of a disruptive direct-transfer printing technology that will enable a new class of nanomembrane-based electronic devices to be assembled and integrated on flexible substrates. systeMECH's innovative technology can provide flexible electronics developers and manufacturers a new option for assembling a wide range of flexible devices that require the integration of ultra-thin, high-performance semiconductors. Printing tools and processes based on this core technology will significantly lower the technological barriers that are hindering the widespread manufacture of next-generation flexible hybrid devices.

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