YINCAE Advanced Materials, LLC

19 Walker Way
Albany,  NY  12205

United States
http://www.yincae.com/
  • Booth: 5248


Find us in the NORTH HALL! Booth # 5248

Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.   Products:

  • Solder Joint Encapsulants
  • Underfill Materials
  • Die Attach Adhesives
  • Conformal Coatings
  • TIM
  • Optical Adhesive
  • Board Level Assembly
  • Anti-Warpage Materials
  • Nanofilm


 Press Releases

  • (Albany, NY) 10 May, 2017 – YINCAE has developed a new innovative solder joint encapsulant paste. Designed to be used for mass production via dispensing or printing, SMT 256EP replaces traditional solder paste, flux, and underfill. STM 256EP enhances solder joint strength by 5 to 10 times and has demonstrated high pull strength at both room and high temperatures (280 °C). At 280 °C, SMT 256EP has a pull strength up to 180g. Thus, SMT 256EP eliminates the RTV or red glue that is typically used to hold components during double reflow, and reduces manufacturing costs. This product is commercially available and used by companies for package level applications. SMT 256EP has demonstrated outstanding thermocycling performance, cost efficiency, and the ability to be reflowed at 230 °C, used for high temperature applications (300°C). These results point to SMT 256EP being the next generation adhesive for the Microelectronics industry.

                Additional information on the SMT 256EP is available by contacting YINCAE at info@yincae.com.

    If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

    * * * * * * * * * *

    Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

     ###

    The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

  • (Albany, NY) 10 May, 2017 – BP 256 is YINCAE’s new ball attach adhesive product.  BP 256 has been designed to enhance solder joint reliability and eliminate cleaning processes for LEAD-FREE ball bumping procedures on CSP, BGA, Flip chip, and PoP devices. It is compatible with current ball bumping processes. BP 256 is generally applied via printing or pin transfer methods and can replace traditional solder paste, flux, and underfill. During reflow, BP 256 encapsulates individual solder joints improving both reliability and drop test performance. This product also has the benefit of being 100% reworkable. BP 256 is commercially available, is currently being used for ball bumping applications.

                Additional information on the BP 256 is available by contacting YINCAE at info@yincae.com.

    If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

    * * * * * * * * * *

    Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

     ###

    The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

  • (Albany, NY) 23 June, 2017 – The DA 90 series materials are YINCAE’s new low temperature die attach adhesives. The DA 90 series offers conductive and insulating options to suit a large variety of applications. These products can be cured at low temperatures (82 – 90°C) and can be used for high temperature applications (215°C for 15 years). In addition to low temperature curing, these products also offer no delamination, high reliability, and high thermal and electrical conductivity. DA 90 series die attach adhesive materials are commercially available and are currently being used for insulating and conductive die attach applications.

    Additional information regarding DA 90 products is available by contacting YINCAE at info@yincae.com.

    If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

    * * * * * * * * * *

    Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

     ###

    The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.


 Products

  • BP 256
    BP 256 ball attach adhesives have been designed to enhance solder joint reliability and eliminate cleaning process for ball bumping process of CSP, BGA, Flip chip and PoP (package on package) and so on, particularly for lead free application....

  • BP 256 ball attach adhesives have been designed to enhance solder joint reliability and eliminate cleaning process for ball bumping process of CSP, BGA, Flip chip and PoP (package on package) and so on, particularly for lead free application. BP 256 is a kind of polymer adhesive. During the reflow process, this polymer adhesive removes metal oxide and allows solder joint to be formed; meanwhile, a 3-D   polymer network starts to form and encapsulates individual solder bump with enhancing the joint to eliminate some drawbacks of later underfilling (large CTE above Tg, trouble process control). The performance of drop test has been improved by two orders of magnitude compared with that with the use of solder paste. The polymer network can be removed using methyl ethyl ketone (MEK) or heating.

    We offer a broad range of colors, filler concentrations, and particle sizes for the SMT256 series to cater to our customer needs and requirements.

  • DA 90
    Solvent-free and fast curing thermosetting DA adhesives....

  • The DA90 series are solvent-free and fast curing thermosetting die attach adhesives. The series offers excellent adhesion to the substrate and bare die. It can be used for small and large die attach. Both dispense and printing methods can be used. Advantages include high reliability and high temperature reflow performance. This material is easily dispensed, minimizes induced stresses and provides outstanding reliability performance and excellent mechanical resistance.

    The DA90 series can be customized in color, fillers, and particle sizes to customer specifications and needs.

  • TM 150
    Rapid cure, self-filling, self-leveling and self-soldering adhesives...

  • TM150 solderable conductive adhesives series are rapid cure, self-filling, self-leveling and self-soldering adhesives, which can be used as die attach adhesives for LED, CSP, QFP, among others, to replace conductive adhesives (Ag) or solder materials such as solder paste or preform. By comparison with conductive adhesives (Ag), TM150 solderable adhesives has higher, more stable electrical and thermal conductivity, easily fills and enables easy control of the bonding thickness.

    By comparison with soldering materials, TM150 solderable adhesives eliminates the outgassing from soldering process, die skewing, shifting, and soldering bleed.

    Soldered interface will be encapsulated with the curing of TM150 solderable adhesives, thus soldered metal interface is protected by 3D polymer network, which can tolerate harsh environmental conditions


 Additional Info

New Exhibitor:
No
New Products:
Yes
Displaying Equipment:
No
Product Demonstrations:
No

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