Shenmao America Inc

2156 Ringwood Ave
San Jose,  CA  95131

United States
http://www.shenmao.com/
  • Booth: 5716


Visit # 5716 to discuss BGA Sphere, Bumping Paste and Flux

SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and extremely high quality sphericity. SHENMAO ADVANCED MATERIALS DEVELOPMENT CENTER applications engineers developed the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void to optimize manufacturing process performance. SHENMAO has successfully been approved by many international well-known electronic manufacturers. SHENMAO strives to offer the best quality without compromising cost and time-to-market while providing maximum value to all customers. As the Worlds Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Laser Soldering Paste, Cored Solder Wire, Wave Solder Bar, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Flux and Solar PV Ribbon. SHENMAO America, Inc. blends SMT Solder Paste in it's facility in San Jose, CA for distribution in North America.


 Press Releases

  • SHENMAO Introduces New Low Residue Liquid Flux SMF-B51

    SHENMAO Technology. Inc. introduces New Generation Ultra Low Residue Liquid Flux SMF-B51 with superior spray uniformity, excellent soldering performance and a wide process window for Chip Scale and Fan Out Wafer Level Packaging.

    SHENMAO introduces New Generation Lead-free Solder Paste PF606-P140 and Zero-Halogen Lead-free Solder Paste PF606-P245 with a wide process window, superior print and solderability to solve Head on Pillow issues and improve ICT testability, easily fit into complicated PCB designs through excellent convergence performance.

    SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high-quality sphericity. Various diameters (0.76, 0.65, 0.64, 0.5, 0.45, 0.4, 0.3, 0.25, 0.2, 0.15, 0.1, 0.09, 0.08, 0.075, 0.07, 0.06, 0.055 and 0.05 mm Dia.- 0.045 and 0.040 mm Dia. are in development) are available in SAC305, SAC405 and SAC1205 Alloys at affordable low cost from 10 worldwide SHENMAO locations.

    As the World’s Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Wave Solder Bar, Cored Solder Wire and Flux, Solder Preforms, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Dipping Flux and PV Ribbon.

    For more information, please contact:

    SHENMAO America, Inc. www.shenmao.com  Tel: 408-943-1755   e-mail: usa@shenmao.com

  • SHENMAO Introduces New Ball Attach Flux SMF-WB51 for WLCSP/FOWLP

    SHENMAO Technology, Inc. introduces New WLCSP/FOWLP Ball Attach Flux SMF-WB51 for excellent ball attach soldering due to its highly suitable wide reflow profile and designed for slump resistance to prevent bridging. Applicable for lead free and lead containing alloys, its higher viscosity, medium Ti index with stable slump characteristics present great printability and excellent stencil life, uniform dipping value in Flux Dip/Pin Transfer and Solder Ball Drop to create excellent Ball Hight and Coplanarity.

    SHENMAO introduces New Generation Lead-free Solder Paste PF606-P140 and Zero-Halogen Lead-free Solder Paste PF606-P245 with a wide process window, superior print and solderability to solve Head on Pillow issues and improve ICT testability, easily fit into complicated PCB designs through excellent convergence performance.

    SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high-quality sphericity. Various diameters (0.76, 0.65, 0.64, 0.5, 0.45, 0.4, 0.3, 0.25, 0.2, 0.15, 0.1, 0.09, 0.08, 0.075, 0.07, 0.06, 0.055 and 0.05 mm Dia.- 0.045 and 0.040 mm Dia. are in development) are available in SAC305, SAC405 and SAC1205 Alloys at affordable low cost from 10 worldwide SHENMAO locations.

    As the World’s Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Wave Solder Bar, Cored Solder Wire and Flux, Solder Preforms, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Dipping Flux and PV Ribbon.

    For more information, please contact:

    SHENMAO America, Inc. www.shenmao.com  Tel: 408-943-1755   e-mail: usa@shenmao.com

  • SHENMAO Introduces New Tacky Flux SMF-WC52 for Flip Chip Technology

    SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.

    SHENMAO introduces New Generation Lead-free Solder Paste PF606-P140 and Zero-Halogen Lead-free Solder Paste PF606-P245 with a wide process window, superior print and solderability to solve Head on Pillow issues and improve ICT testability, easily fit into complicated PCB designs through excellent convergence performance.

    SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high-quality sphericity. Various diameters (0.76, 0.65, 0.64, 0.5, 0.45, 0.4, 0.3, 0.25, 0.2, 0.15, 0.1, 0.09, 0.08, 0.075, 0.07, 0.06, 0.055 and 0.05 mm Dia.- 0.045 and 0.040 mm Dia. are in development) are available in SAC305, SAC405 and SAC1205 Alloys at affordable low cost from 10 worldwide SHENMAO locations.

    As the World’s Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Wave Solder Bar, Cored Solder Wire and Flux, Solder Preforms, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Dipping Flux and PV Ribbon.

    For more information, please contact:

    SHENMAO America, Inc. www.shenmao.com  Tel: 408-943-1755   e-mail: usa@shenmao.com


 Products

  • Lead-Free Solder Paste PF606-P140
    SHENMAO Introduces New Generation Lead-Free Solder Paste PF606-P140 to solve HoP issues and improve ICT Testability ...

  • SHENMAO Technology, Inc. introduces New Generation Lead-free Solder Paste PF606-P140. With superior continuous high-speed printability producing great Solder Paste Print Quality and a wide reflow process window for excellent solderability, it prevents Head on Pillow issues and can easily fit into highly complicated PCB designs through excellent convergence performance.

    SHENMAO PF606-P140 improves ICT testability with flux completely removed from top of solder to prevent contamination of Test Pins during Test operation. Minimal Flux Residue gathers near outside of Solder Joint on the PCB Substrate, a substantial improvement over legacy solder Paste.

    For more than 44 years, SHENMAO has been dedicated to produce Solder Products including Water Soluble and No-clean Solder Paste, Laser Solder Paste, Cored Solder Wire, Wave Solder Bar Alloys, Wave Soldering Fluxes, Extremely Pure Solder Powder up to Type 8, BGA and Micro BGA Solder Sphere, Wafer Level Packaging Solder Paste and Fluxes, LED Die Attach Paste, High Performance Liquid Fluxes, Solder Preform, Solar Ribbon, Plating Anode used in PCB Fabrication, Assembly and Semiconductor Packaging Processes.

    SHENMAO Solder Materials are available at affordable cost from 10 worldwide locations.

    For more information, please contact:

    SHENMAO America, Inc. www.shenmao.com  Tel: 408-943-1755   e-mail: usa@shenmao.com

  • Zero Halogen Lead-Free Solder Paste PF606-P245
    Zero Halogen L-F Solder Paste PF606-P245 solves HoP issues, Improve ICT Testability...

  • SHENMAO Technology, Inc. introduces New Generation Lead-free Zero Halogen Solder Paste PF606-P245. With superior continuous high-speed printability producing great Solder Paste Print Quality and a wide reflow process window for excellent solderability, it prevents Head on Pillow issues, produces the lowest void and easily fit complicated PCB designs through excellent convergence performance.

    SHENMAO PF606-P245 improves ICT testability with flux completely removed from top of solder to prevent contamination of Test Pins during Test operation. Minimal Flux Residue gathers near outside of Solder Joint on the PCB Substrate, a substantial improvement over legacy solder Paste.

    For more than 44 years, SHENMAO has been dedicated to produce Solder Products including Water Soluble and No-clean Solder Paste, Laser Solder Paste, Cored Solder Wire, Wave Solder Bar Alloys, Wave Soldering Fluxes, Extremely Pure Solder Powder up to Type 8, BGA and Micro BGA Solder Sphere, Wafer Level Packaging Solder Paste and Fluxes, LED Die Attach Paste, High Performance Liquid Fluxes, Solder Preform, Solar Ribbon, Plating Anode used in PCB Fabrication, Assembly and Semiconductor Packaging Processes.

    SHENMAO Solder Materials are available at affordable cost from 10 worldwide locations.

    For more information, please contact:

    SHENMAO America, Inc. www.shenmao.com  Tel: 408-943-1755   e-mail: usa@shenmao.com

  • SHENMAO Introduces New Mobile Responsive Website
    SHENMAO Technology, Inc., new, more user-friendly and mobile Responsive www.shenmao.com web site, New Product Brochure and Semicon Show Cataloge...

  • SHENMAO NEW 24 PAGE PRODUCT CATALOGE

    http://www.shenmao.com/s/2/product-c114987/Product-Brochure.html

    SHENMAO SEMICON SHOW CATALOGE:

    http://www.shenmao.com/s/2/product-c110135/SEMICON-show-catalog.html


 Additional Info

New Exhibitor:
No
New Products:
Yes
Displaying Equipment:
No
Product Demonstrations:
Yes

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