OEM Group, LLC.

2120 W. Guadalupe Rd.
Gilbert,  AZ  85233

United States
http://www.oemgroupinc.com
  • Booth: 7831

With global headquarters in metro Phoenix, Arizona and additional sites throughout the North America, Europe, Japan and Asia, OEM Group, LLC is a semiconductor capital equipment manufacturer and innovator in new and remanufactured 75mm–200mm tools and services. We serve the LED, MEMS, Wireless, Power, Energy Harvesting, WLP, Data Storage and Logic markets. Our proven manufacturing procedures deliver production performance and process expertise demanded by today’s most competitive fabs. OEM Group Product Lines include: •Tegal 900ACS-Series and 6500-Series (thin-film etch) •Sputtered Films Endeavor (PVD) •MRC Eclipse (PVD) •AG Heatpulse (RTP) •Varian Sunset (implant) •Lam AutoEtch •Cintillio Spray Ozone Tool, Spray Acid Tool and Spray Solvent Tool •Semitool Scepter, Spin Rinse Dryer and Storm OEM Group, LLC. also offers foundry services designed for piezoelectric AlN films and yield-optimization, as well as process and product development and demonstration. Corporate Profile: •Founded: 1999, privately held •President: Spencer F.W. Wall


 Press Releases

  • OEM Group has launched the P5000:CS automated single wafer cluster tool for the compound semiconductor market.  As the exclusive licensed manufacturer of the Applied Materials P5000, OEM Group’s P5000:CS was designed and developed specifically to handle and process 75mm, 100mm, and 150mm compound semiconductor substrates such as Gallium Arsenide (GaAs), Silicon Carbide (SiC), Sapphire, Germanium (Ge), Indium Phosphide (InP), and Gallium Nitride (GaN).

    “Prior to the release of the P5000:CS, customers in the compound semiconductor market had very few options for Etch and CVD cluster tools” said John Almerico, Production Manager Etch and CVD of OEM Group.  “Their choices were limited to boutique custom built, unproven, and expensive systems.  With the P5000:CS, it’s the first time an industry proven, single wafer cluster tool with high volume capability has been made available to the compound semiconductor industry.”

    The P5000:CS features a proprietary Bi-Polar Electrostatic Chuck for single wafer processing temperature control best suited for SiC, GaAs, and Sapphire etch applications.  The option for a proprietary Wafer Orienter utilizing special software and sensors specifically tuned to do edge detection on transparent wafers has been added.  An Advanced Spectrometer Endpoint Detection system is built into the chamber to diagnose, analyze, and “fingerprint” any kind of plasma present on the wafer.

    In 2016, SEMI reported the total compound semiconductor market was estimated at $24B and expected to almost double at a CAGR of ~13% to ~$44B in 2020.  “With the projected growth in the industry”, said Almerico, “we developed the P5000:CS platform to address the special high volume production needs and support the market at an affordable price”.

    About OEM Group, Inc.

    OEM Group is a global manufacturer of new and remanufactured semiconductor capital equipment and upgrades focused on innovative and sustaining solutions for emerging markets. Our proven portfolio consists of exclusive intellectual property acquired from leading semiconductor brands, including: P5000, Tegal™ Etch, Sputtered Films® Endeavor™, MRC® Eclipse™, AGHeatpulse®, Varian® Sunset™, Lam® AutoEtch™ and SEMITOOL® Manual Batch, Automated Batch and Single Wafer Equinox™. In addition to the LEGENDS™ lines, OEM offers an Applications Development lab for wet processing and Foundry services for piezoelectric AlN films. For more information, please visit www.oemgroupinc.com.


 Products

  • P5000:CS™
    P5000:CS was designed and developed specifically to handle and process 75mm, 100mm, and 150mm compound semiconductor substrates....

  • The P5000:CS features a proprietary Bi-Polar Electrostatic Chuck for single wafer processing temperature control best suited for SiC, GaAs, and Sapphire etch applications.  The option for a proprietary Wafer Orienter utilizing special software and sensors specifically tuned to do edge detection on transparent wafers has been added.  An Advanced Spectrometer Endpoint Detection system is built into the chamber to diagnose, analyze, and “fingerprint” any kind of plasma present on the wafer.
  • Endeavor f(x)™
    The Endeavor f(x) PVD system features a modular architecture designed to enable users to quickly and easily modify, upgrade, and maintain their system without disrupting productivity and uptime....

  • This latest addition is an evolution in design from their Endeavor AT™, a proven platform widely used by thin-film bulk acoustic resonator filter (FBAR) makers.  Each chamber on the Endeavor f(x) is mounted on a standalone frame with the ability to be detached from the mainframe for ease of maintenance or future chamber additions.

  • Cintillio™
    Leveraging an innovative enhanced spray technology OEM Group’s Cintillio portfolio offers wet-chemical processing to meet most any application demand. The Cintillio SAT, SST, SOT, and Eco processes multiple wafer sizes with one carrier change....

  • As part of the Chemical Process Technology (CPT) group, OEM Group offers Cintillio Spray Ozone Tool, Spray Acid Tool and Spray Solvent Tool, as well as Scepter, Spin-Rinse Dryer and Storm. This product line expansion is the result of OEM Group’s May 2011 purchase of Rhetech and Semitool Austria GmbH manual batch tool sales and service operations from Applied Materials.

    Capable of meeting any wet application demand, the CAD-designed Cintillio products break new technological ground in 25/50 wafer batch process. OEM Group’s versatile wet-chemical processing Cintillio family was conceptualized with end users in mind. Spray Acid Tool (SAT), Spray Solvent Tool (SST) and Spray Ozone Tool (SOT) feature convenient side access, which makes routine maintenance checks both safe and user friendly.  Cintillio’s innovative and proprietary Enhanced Spray Technology, featuring up to six rows of nozzles, ensures high throughput and reliable wafer surface wetting with chemical mixtures.

    Cintillio can be configured with up to four onboard chemical tanks, external support of chemical delivery units (CDUs), external O3 generators for Ozone processes and 25- or 50-wafer process loads.

    Cintillio processes multiple wafer sizes with a single carrier change. With the smallest footprint among similar equipment, Cintillio products not only save fab floor space, it also enables high up-time and low cost of ownership.


 Additional Info

New Exhibitor:
No
New Products:
Yes
Displaying Equipment:
No
Product Demonstrations:
No

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