SPTS Technologies (An Orbotech Company)

Ringland Way
Newport,  NP182TA

United Kingdom
http://www.spts.com
  • Booth: 7617


SPTS looks forward to meeting with you during SEMICON West.

SPTS Technologies, an Orbotech company, designs, manufactures, sells, and supports advanced etch, PVD, and CVD wafer processing equipment and solutions for the global semiconductor and micro-device industries, with focus on the Advanced Packaging, MEMS, high speed RF device, power management and LED markets.

With the addition of SPTS, Orbotech is able to offer a broader range of process solutions for Advanced Packaging, which includes Orbotech’s Inkjet solutions for die level printing of package marking, underfill dams and isolation layers.

SPTS has manufacturing facilities in Newport, Wales and Allentown, Pennsylvania, and operates across 19 countries in Europe, North America and Asia-Pacific.

For additional product or company information, please visit:
www.spts.com
www.orbotech.com


 Press Releases

  • Industry Adoption of SPTS’s Plasma Dicing Solution Further Verified by System Plus Consulting ‘Teardown’ Analysis of MEMS Microphones in iPhone 7 Plus

    YAVNE, ISRAEL, March 8, 2017 | ORBOTECH LTD. (NASDAQ: ORBK) today announced that SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor and related industries, has won an order for its Mosaic Plasma Dicing System from JCAP Corporation (Jiangyin Changdian Advanced Packaging Co., Ltd), a JCET company and leading Chinese advanced packaging services provider to global semiconductor companies. Orbotech's SPTS also announced that a recent analysis of MEMS microphones in the iPhone 7 Plus conducted by System Plus Consulting[1] confirmed that an ASIC device in the iPhone 7 Plus had been plasma diced.

    Commenting on this recent order, Kevin Crofton, Corporate Vice President at Orbotech and President of SPTS Technologies, said: “JCAP selected Orbotech’s SPTS plasma dicing solution over competing options because the Mosaic system demonstrated superior results and offers lower cost of ownership. We were also selected for our inclusive approach and willingness to work alongside other suppliers in the back-end space to produce sustainable process flows.”

    Mr. Crofton continued, “The Mosaic platform configured with the Rapier-300S is designed for handling 400mm framed wafers in a high volume manufacturing environment. It allows customers to offer industry-leading plasma dicing services that will meet the packaging needs of next generation devices. By adding plasma dicing to their service portfolio, customers can provide higher value packaging services and gain improved profitability in a highly cost sensitive industry.”

    According to Amandine Pizzagalli, Technology & Market Analyst, at Yole Développement and author of the report entitled “Thin Wafer Processing and Dicing Equipment Market”[2], “Plasma dicing could reshape the dicing industry landscape by increasing the number of chips per wafer and thus reducing the cost of ownership of the dicing process. Driven by the rising demand for thinner wafers and stronger die, plasma dicing is positioned to become the only viable dicing option for next generation ultra small, ultra thin and fragile devices such as RFID, MEMS, and Power devices.”

    Mr. Crofton added, “We have had continuous interest in the Mosaic plasma dicing solutions in our demo lab, and we continue to win business and expand our installed base. We see this as a real validation of our dicing platform. System Plus Consulting’s discovery of a plasma diced ASIC in the iPhone 7 Plus, which has been processed by our equipment, confirms industry acceptance and adoption of plasma dicing as a singulation method in the industry in high volume manufacturing.”

    ####

    About Mosaic Plasma Dicing System

    Orbotech's SPTS Mosaic plasma dicing system with the Rapier-300S overcomes many of the design limitations of conventional dicing methods, particularly for smaller, thinner, more fragile die, as well as offering the potential for significant increases in yield and throughput. The Rapier-300S is a silicon DRIE module, designed specifically for dicing of 300mm wafers mounted on 400mm frames and is available along with plasma dicing solutions for 150mm, 200mm and 300mm wafers. Unique aspects of SPTS’s plasma dicing technology include the use of SPTS’s patented Sentinel end-point detection and “bias pulsing” techniques to maximize die strength.

    To learn more about SPTS’s Rapier-300S and Mosaic plasma dicing platform go to the Tech Insights section for articles on dice before grind (DBG) and dice after grind (DAG). Published papers and presentations can also be found in the Resources section.

    About Orbotech Ltd.

    Orbotech Ltd. (NASDAQ:ORBK) is a global innovator of enabling technologies used in the manufacture of the world’s most sophisticated consumer and industrial products throughout the electronics and adjacent industries. Orbotech is a leading provider of yield enhancement and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems (MEMS), RF devices, power semiconductors, and other electronic components. Orbotech’s solutions include automated optical inspection and shaping, direct imaging, laser drilling, Inkjet printing, array test and repair, yield management, and etch and deposition wafer process solutions.

    Today, virtually every electronic device in the world is produced using Orbotech systems. For more information, visit www.orbotech.com and www.spts.com

    Cautionary Statement Regarding Forward-Looking Statements

    Except for historical information, the matters discussed in this press release are forward-looking statements within the meaning of the U.S. Private Securities Litigation Reform Act of 1995.  These statements relate to, among other things, future prospects, developments and business strategies and involve certain risks and uncertainties.  The words “anticipate,” “believe,” “could,” “will,” “plan,” “expect” and “would” and similar terms and phrases, including references to assumptions, have been used in this press release to identify forward-looking statements.  These forward-looking statements are made based on management’s expectations and beliefs concerning future events affecting Orbotech and are subject to uncertainties and factors relating to Orbotech’s operations and business environment, all of which are difficult to predict and many of which are beyond the Company’s control.  Many factors could cause the actual results to differ materially from those projected including, without limitation, cyclicality in the industries in which the Company operates, the Company’s production capacity, timing and occurrence of product acceptance (the Company defines ‘bookings’ and ‘backlog’ as purchase arrangements with customers that are based on mutually agreed terms, which, in some cases for bookings and backlog, may still be subject to completion of written documentation and may be changed or cancelled by the customer, often without penalty), fluctuations in product mix, within and among divisions, worldwide economic conditions generally, especially in the industries in which the Company operates, the timing and strength of product and service offerings by the Company and its competitors, changes in business or pricing strategies, changes in the prevailing political and regulatory framework in which the relevant parties operate, including as a result of the Brexit process and administration change in the United States, or in economic or technological trends or conditions, including currency fluctuations, inflation and consumer confidence, on a global, regional or national basis, the level of consumer demand for sophisticated devices such as smartphones, tablets and other electronic devices as well as automobiles, the Company’s global operations and its ability to comply with varying legal, regulatory, exchange, tax and customs regimes, the timing and outcome of tax audits, including the ongoing audit in Israel (the amount of taxable income is subject to ongoing audit by the Israel tax authority and such audits often result in proposed assessments and any estimation of the potential outcome of an uncertain tax issue is a matter for judgment, which can be subjective and highly complex; however, the Company believes that it has provided adequately for any reasonably foreseeable outcomes related to the tax audit, but future results may include favorable or unfavorable material adjustments to estimated tax liabilities in the periods when the assessments are made or resolved or the audit is closed), the Company’s ability to achieve strategic initiatives, including related to its acquisition strategy, the Company’s debt and corporate financing activities; the final timing and outcome, and the impact, of the criminal matter and ongoing investigation in Korea, including any impact on existing or future business opportunities in Korea and elsewhere, any civil actions related to the Korean matter brought by third parties, including the Company’s customers, which may result in monetary judgments or settlements, expenses associated with the Korean matter, ongoing or increased hostilities in Israel and the surrounding areas, and other risks detailed in the Company’s SEC reports, including the Company’s Annual Report on Form 20-F for the year ended December 31, 2016, and subsequent SEC filings.  The Company assumes no obligation to update the information in this press release to reflect new information, future events or otherwise, except as required by law.

    ORBOTECH COMPANY CONTACTS:

    Rami Rozen

    Tally Kaplan Porat

    Director of Investor Relations

    Director of Corporate Marketing

    Tel: +972-8-942-3582

    Investor.relations@orbotech.com    

    Tel: +972-8-942-3603

    Tally-Ka@orbotech.com


    [1] Knowles MEMS Microphones in iPhone 7 Reverse Costing Analysis, System Plus Consulting, October 2016

    [2]Thin Wafer Processing and Dicing Equipment Market report, Yole Développement, May 2016

  • SPTS’s 300mm Sigma® fxP PVD System Chosen by NANIUM, Europe’s Largest OSAT

    NEWPORT, UK, November 3, 2016 | SPTS Technologies, an Orbotech company and a supplier of advanced wafer-processing solutions for the global semiconductor and related industries, today announced that it has received an order from NANIUM, S.A., a Portugal-based semiconductor manufacturing, test and engineering services provider, for a 300mm Sigma fxP PVD system to expand NANIUM’S Fan-out Wafer Level Packaging (FOWLP) capacity. Following the successful evaluation of the Sigma fxP PVD system for deposition of redistribution layers (RDL) for FOWLP production, NANIUM selected SPTS’s PVD solution as the new process tool of record (PTOR) for their 300mm wafer-level fan-out line.

    “Fan-out wafer-level packaging is rapidly becoming the packaging solution of choice for mobile applications as it provides semiconductor manufacturers with cost-effective and flexible high density packaging schemes,” said Kevin Crofton, President of SPTS Technologies and Corporate Vice President at Orbotech. “NANIUM has been at the forefront of the growth of FOWLP. The addition of our 300mm Sigma PVD system will enable NANIUM to meet the accelerating demand from mobile device customers as well as address growing interest from IC manufacturers targeting automotive and medical applications.”

    “NANIUM is committed to delivering creative, reliable and cost-effective wafer-level packaging solutions by combining world-class expertise with leading-edge equipment,” stated Steffen Kroehnert, Director of Technology at NANIUM. “SPTS’s Sigma fxP PVD system is the recognized leader for FOWLP packaging schemes and has a well-established track record in volume production. To remain competitive in a cost-sensitive industry and deliver the quality and level of customer service expected by our customers, we must adopt the latest technologies and equipment to secure our position as one of the leading proponents of FOWLP.  SPTS’s 300mm Sigma PVD solution offers superior performance and lower cost of ownership than competing PVD systems and is a valuable addition to our portfolio of solutions.”

    About Sigma fxP PVD

    The Sigma fxP is a cluster PVD system used by device manufacturers in various end markets including power management, MEMS and RF devices.  In semiconductor packaging, the Sigma fxP deposits RDL and under bump metals (UBM) for Cu micropillar and TSV’s, plus TSV liner/barrier for 3DWLP.  For FOWLP, the system carries a Multi Wafer Degas (MWD) for low temperature, high productivity degas of epoxy mold compound.  Its SE-LTX etch module pre-cleans organic films with twice the mean wafers between cleans (MWBC) compared to competing systems.  For more information please see http://www.spts.com/tech-insights/advanced-packaging/fowlp.

    To learn more about SPTS’s Sigma fxP PVD solutions, and full range of industry leading etch, deposition, and inkjet  solutions for advanced packaging applications visit http://www.spts.com/Markets/Advanced-Packaging and the Resources library to access published papers and presentations.

    About NANIUM S.A.

    NANIUM is a world-class provider of semiconductor assembly, packaging, test, engineering and manufacturing services. The company started as Siemens Semiconductors back in 1996 and nowadays is a leader in 300mm Wafer-Level Packaging (WLP), both Fan-In/WLCSP and Fan-Out/WLFO. NANIUM offers in-house capabilities for the entire development chain, from design to multiple Wafer-Level Packaging technologies, and the flexibility to tailor and test solutions that respond to the most demanding customer requirements. The company is based near Porto, Portugal, and has offices in Dresden, Germany and Boston, USA. For more information visit www.nanium.com

    Company Contact: media@nanium.com

    About Orbotech Ltd.

    Orbotech Ltd. (NASDAQ:ORBK) is a global innovator of enabling technologies used to manufacture the world’s most sophisticated consumer and industrial electronic products. Orbotech is a leading provider of yield enhancement and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems (MEMS), RF devices, power semiconductors, and other electronic components. Orbotech’s solutions include automated optical inspection and shaping, direct imaging, laser drilling, Inkjet printing, array test and repair, yield management, and etch and deposition wafer process solutions. Today, virtually every electronic device in the world is produced using Orbotech systems. For more information, visit http://www.orbotech.com/ and www.spts.com

    COMPANY CONTACTS:

    Destanie Clarke

    Tally Kaplan Porat

    Senior Director, Marketing Communications

    Director of Corporate Marketing

    SPTS Technologies

    Orbotech Ltd.

    Tel: +44 7951 203278

    Tel: +972-8-942-3603

    destanie.clarke@orbotech.com

    Tally-Ka@orbotech.com

  • YAVNE, ISRAEL, July 11, 2017 | ORBOTECH LTD. (NASDAQ: ORBK), today announced that SPTS Technologies, an Orbotech company and supplier of advanced wafer processing solutions for the global semiconductor and related industries, has been named by imec, a world-leading nano-electronics research center, as a new supplier of physical vapor deposition (PVD) solutions for under bump metallization (UBM) and redistribution layer (RDL) processes for next generation fan-out packaging technologies. Imec has selected SPTS’s Sigma® fxP PVD solution as the new process tool of record (PTOR) for low temperature PVD for development of novel fan-out technologies such as flexible micro-bumps for chip scale packaging.

     

    “To meet the technical requirements of future micro- and nano-electronics, novel 3D integrated circuit (IC) architectures need to be developed to meet scaling challenges without compromising cost, performance, and power budgets,” stated Kevin Crofton, President of SPTS Technologies and Corporate Vice President at Orbotech. ”Imec works closely with leading semiconductor companies to develop innovative wafer-level packaging architectures that will meet the performance requirements of next generation devices such as application processors that drive virtual reality applications or enable high performance computing for artificial intelligence. We are proud that imec selected SPTS’ Sigma® for its 3D System Integration Program, reflecting our PVD solutions’ excellent results, particularly in low temperature RDL and copper pillar creation on low temperature tolerant polymers.  We look forward to working with imec and its partners in developing innovative interconnect and fan-out technologies.”

     

    Mr Crofton added,” SPTS specializes in UBM/RDL PVD for Flip Chip and fan-out applications, and our low temperature PVD capabilities will support the development of a range of new interconnect technologies at imec, including flexi bumps, to address the scaling and packaging needs of future generations of nano-electronics.”

     

    Dr Anthony Barker, PVD Product Manager at SPTS, will be giving an invited talk titled: “Fantastic Fan-out; Improving Interconnect Productivity for the Fastest Growing Packaging Platform” on Thursday 13 July, 14.00 – 14.30 at the Advanced Packaging Meet the Expert Session, at SEMICON West, in San Francisco.

     

    To learn more about SPTS’s Sigma fxP PVD solutions, and full range of industry leading etch, deposition, and inkjet solutions for advanced packaging applications visit SPTS Technologies on Booth No.7617 in West Hall at SEMICON West, 11 – 13 July, Moscone Center, San Francisco.

     

    ###

     

    About Sigma® fxP PVD

    The Sigma fxP is a cluster PVD system used by device manufacturers in various end markets including power management, MEMS and RF devices.  In semiconductor packaging, the Sigma fxP deposits RDL and under bump metals (UBM) for Cu micropillar and TSV’s, plus TSV liner/barrier for 3DWLP.  For FOWLP, the system carries a Multi Wafer Degas (MWD) for low temperature, high productivity degas of epoxy mold compound.  Its SE-LTX etch module pre-cleans organic films with twice the mean wafers between cleans (MWBC) compared to competing systems.

     

     

    About Orbotech Ltd.

    Orbotech Ltd. is a leading global supplier of yield-enhancing and process-enabling solutions for the manufacture of electronics products. Orbotech provides cutting-edge solutions for use in the manufacture of printed circuit boards (PCBs), flat panel displays (FPDs), and semiconductor devices, designed to enable the production of innovative, next generation electronic products and improve the cost effectiveness of existing and future electronics production processes. Orbotech’s core business lies in enabling electronic device manufacturers to inspect and understand PCBs and FPDs and to verify their quality, pattern the desired electronic circuitry on the relevant substrate and perform three dimensional shaping of metalized circuits on multiple surfaces, and utilize advanced vacuum deposition and etching processes in SD and semiconductor manufacturing. For further information, visit http://www.orbotech.com and www.spts.com

     

     

    Cautionary Statement Regarding Forward-Looking Statements

    Except for historical information, the matters discussed in this press release are forward-looking statements within the meaning of the U.S. Private Securities Litigation Reform Act of 1995.  These statements relate to, among other things, future prospects, developments and business strategies and involve certain risks and uncertainties.  The words “anticipate,” “believe,” “could,” “will,” “plan,” “expect” and “would” and similar terms and phrases, including references to assumptions, have been used in this press release to identify forward-looking statements.  These forward-looking statements are made based on management’s expectations and beliefs concerning future events affecting Orbotech and are subject to uncertainties and factors relating to Orbotech’s operations and business environment, all of which are difficult to predict and many of which are beyond the Company’s control.  Many factors could cause the actual results to differ materially from those projected including, without limitation, cyclicality in the industries in which the Company operates, the Company’s production capacity, timing and occurrence of product acceptance (the Company defines ‘bookings’ and ‘backlog’ as purchase arrangements with customers that are based on mutually agreed terms, which, in some cases for bookings and backlog, may still be subject to completion of written documentation and may be changed or cancelled by the customer, often without penalty), fluctuations in product mix, within and among divisions, worldwide economic conditions generally, especially in the industries in which the Company operates, the timing and strength of product and service offerings by the Company and its competitors, changes in business or pricing strategies, changes in the prevailing political and regulatory framework in which the relevant parties operate, including as a result of the Brexit process and administration change in the United States, or in economic or technological trends or conditions, including currency fluctuations, inflation and consumer confidence, on a global, regional or national basis, the level of consumer demand for sophisticated devices such as smartphones, tablets and other electronic devices as well as automobiles, the Company’s global operations and its ability to comply with varying legal, regulatory, exchange, tax and customs regimes, the timing and outcome of tax audits, including the ongoing process with respect to the $58 million tax assessment for the years 2012-2014 and associated criminal investigation by the Israel Tax Authority (any estimation of the potential outcome of an uncertain tax issue is a matter for judgment, which can be subjective and highly complex; however, the Company believes that it has provided adequately for any reasonably foreseeable outcomes related to the tax audit, but future results may include favorable or unfavorable material adjustments to estimated tax liabilities in the periods when the assessments and investigations are resolved or the audit and investigation are closed), harm to the Company’s reputation from ITA’s investigation and any adverse impact on its business and opportunities, the Company’s ability to achieve strategic initiatives, including related to its acquisition strategy, the Company’s debt and corporate financing activities; the final timing and outcome, and the impact, of the criminal matter and ongoing investigation in Korea, including any impact on existing or future business opportunities in Korea and elsewhere, any civil actions related to the Korean matter brought by third parties, including the Company’s customers, which may result in monetary judgments or settlements, expenses associated with the Korean matter, ongoing or increased hostilities in Israel and the surrounding areas, and other risks detailed in the Company’s SEC reports, including the Company’s Annual Report on Form 20-F for the year ended December 31, 2016, and subsequent SEC filings.  The Company assumes no obligation to update the information in this press release to reflect new information, future events or otherwise, except as required by law.


 Products

  • Delta® Deposition Systems
    SPTS's Delta PECVD systems are used for a wide range of applications within MEMS, compound semiconductors, and advanced packaging...

  • PECVD

    • Wafer sizes from 75mm to 300mm
    • Radially symmetrical gas flow for superior wafer-in-wafer (WIW) uniformity
    • Up to 10 gas lines and optional on-board liquid delivery system
    • Mixed frequency plasma capability for stress tuning
    • Active platen cooling for critical, low temperature [<175°C] packaging applications
    • Single and multi-wafer preheat chamber options for de-gassing sensitive substrates

    Markets Served

    MEMS applications demand a wide range of dielectric film types,SPTS’s PECVD module offers SiO, SiN and amorphous silicon films tailored to meet the needs of MEMS manufacturers

    Advanced 3D-IC applications, SPTS offers low temperature [<175°C] processes compatible with 300mm bonded substrates. Applications include via-last TSV liner and via-reveal passivation.

    SPTS is the only PECVD provider who can deposit electrically robust, stable nitride and oxide films at <200°C

    RF-IC semiconductor applications, SPTS develops processes and hardware for today’s production needs and Single wafer processing enables unrivalled repeatability and flexibility in a manufacturing environment

    Our handlers and process chambers are proven in high volume production, and are fully compatible with both transparent and carried wafers

  • Omega® Etch Systems
    SPTS offers advanced etch technologies for a wide range of applications within MEMS, Advanced Packaging, LEDs, high speed RF IC & power semiconductors...

  • Plasma Etch

    ICP Etch
    The Omega® ICP process module uses a patented
    high density plasma source incorporating a radial coil design. The SPTS ICP process module is highly flexible and etches a wide range of materials including oxides, nitrides, polymers, low aspect ratio Si and metals. The ICP module is the market leader for compound semiconductor applications.

    Dielectric Etch
    SPTS’s Omega® SynapseTM process module is an ICP-based
    high density plasma source, designed to etch materials which are difficult to etch using conventional RIE or ICP sources.

    The process chamber is of metallic construction and is heated to reduce the level of deposition on it, thereby increasing process stability and increasing the mean time between cleans by more than a factor of 10.

    Si DRIE
    Install base of over 1000 DRIE process modules, SPTS’s market-leading position is spearheaded by the Rapier module, which etches Si using Bosch switched processing as well as non-switched etching for tapered profiles, wafer thinning and via reveal.

  • Sigma® Deposition Systems
    The Sigma product range supports wafer sizes from 100mm to 300mm with deposition technologies covering conventional PVD through to MOCVD...

  • Sigma Metal Deposition Technologies

    Standard PVD – conventional sputter modules for low topography features

    Advanced Hi-Fill (AHF) PVD – ionized sputter source for deposition into high aspect ratio features

    C3M – Virtually conformal metal coverage using MOCVD technology for advanced liner/barrier

    Advantages

    Single wafer processing, improves yields and on-wafer performance, when compared to batch processing.

    Planar target with full face erosion,avoids re-sputtering, reduces particle contamination and improves target life

    Rapid target change (<5mins), with common magnetron increases uptime

    Reliable handling of fragile, thinned or bowed wafers

    "Super Uniformity" option available for specialist applications

    Multi-wafer degas to increase throughput for long (low temp) degas applications

    Common software for 200mm and 300mm systems - ease of use

    Markets Served

    MEMS, Advanced Packaging, Power Semiconductors, LED Manufacturing, RF-IC


 Additional Info

New Exhibitor:
No
New Products:
Yes
Displaying Equipment:
No
Product Demonstrations:
No

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