ClassOne Technology & Equipment

5302 Snapfinger Woods Drive
Atlanta,  GA  30035

United States
http://www.ClassOne.com
  • Booth: 7417


Welcome to ClassOne Technology and ClassOne Equipment!

ClassOne Technology provides innovative and affordable wet-chemical equipment solutions for users of 200mm and smaller substrates, who traditionally have been underserved by the larger equipment manufacturers. ClassOne’s products include electroplating for development and high-rate production as well as spin rinse drying, spray solvent tools and more. Based in Kalispell, Montana, ClassOne Technology is built upon decades of experience from industry veterans who continue the ClassOne tradition of delivering advanced performance tools at lower cost.

ClassOne Equipment is a leading supplier of high quality refurbished equipment to the semiconductor, MEMS, LED, wireless, and emerging technology markets. Our core product lines include Semitool™, SUSS Microtec™, EVG™, SPTS™, Oxford™, Plasmatherm™, and KLA-Tencor™ equipment. We provide a turn-key solution which includes refurbishment, 6 or 12 month warranty, installation by factory trained technicians, and full support including spare parts and field service.  


 Press Releases

  • Kalispell, Montana – ClassOne Technology (classone.com), manufacturer of budget-friendly Solstice®plating systems, announced it's new CopperMax chamber -- an innovative design that is demonstrating major copper plating cost reductions for users of ≤200mm wafers.

    ClassOne cited actual performance data from a CopperMax pilot installation on a Solstice tool at a Fortune 100 customer. Over a six-month period the customer tracked their actual production operating costs while using the new chamber for copper TSV, Damascene and high-rate copper plating. For the three processes with CopperMax they reported that operating costs were reduced between 95.8% and 98.4% compared with previously used conventional plating chambers.

    "Many of our emerging market customers are starting to do copper plating," said Kevin Witt, President of ClassOne Technology. "So we've spent a lot of time on the process, working to reduce customer costs and also increase performance. And the new CopperMax chamber is proving to do both."

    ClassOne pointed out that consumables are the largest cost factor in copper plating. Optimizing copper plating generally requires the use of expensive organic additives -- which are consumed very rapidly and need to be replenished frequently.

    “We learned, however, that over 97% of those expensive additives were not being consumed by the actual plating process," said Witt. "Most were being used up simply by contact with the anode throughout the process! So, we designed our new copper chamber specifically to keep additives away from the anode -- and the results are pretty dramatic. Significant savings can be realized by high- and medium-volume users with high throughputs as well as by lower-volume and R&D users that have long idle times."

    The company explained that the CopperMax chamber employs a cation-exchange semipermeable membrane to divide the copper bath into two sections. The upper section contains all of the additives, and it actively plates the wafer. The lower section of the bath contains the anode that supplies elemental copper -- which is able to travel through the membrane and into the upper section to ultimately plate the wafer. However, the membrane prevents additives from traveling down to the anode, where they would break down and form process-damaging waste products.

    As a result, the CopperMax bath remains much cleaner, and bath life is extended by over 20x. This increases uptime, enables higher-quality, higher-rate Cu plating, and it reduces cost of ownership very substantially.

    For example, a customer using a Solstice system with six CopperMax chambers and running TSV and high-rate copper plating will save over $300,000 per year just from additive use reductions.

    In addition, the CopperMax also reduces Cu anode expenses. The chamber is designed to use inexpensive bulk anode pellets instead of solid machined Cu material, which cuts anode costs by over 50%. And since the pellets have 10x greater surface area they also increase the allowable plating rates.

    "Like the rest of our equipment, this new chamber aims to serve all those smaller wafer users who have limited budgets," said Witt. "Simply stated, CopperMax is going to give them a lot more copper plating performance for a lot less."

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    About ClassOne Technology
    ClassOne Technology provides innovative and affordable wet-chemical equipment solutions for users of smaller substrates, 200mm and smaller, who traditionally have been underserved by the larger equipment manufacturers. ClassOne’s products include electroplating for development and high-rate production as well as spin rinse drying, spray solvent tools and more. Based in Kalispell, Montana, ClassOne Technology is built upon decades of experience from industry veterans who continue the ClassOne tradition of delivering advanced performance tools at lower cost. ClassOne Technology is a sister company to ClassOne Equipment (ClassOneEquipment.com), long respected as the industry’s premier provider of refurbished processing tools, with over 2,500 systems installed worldwide.

    For more information, contact:

    Byron Exarcos
    ClassOne Technology
    109 Cooperative Way, #101
    Kalispell, MT 59901

    tel: +1 (678) 772-9086
    email: pr@classone.com

  • ClassOne Technology (www.classone.com), manufacturer of cost-efficient wet processing equipment for ≤200mm substrates has just announced a new company-wide initiative to reduce costs of operation (CoO) in copper plating processes.

    “From the beginning, our mission has been to bring more advanced and lower priced plating capabilities to all the emerging markets who work with smaller wafers," said ClassOne Technology President, Kevin Witt. "Our Solstice® systems are already the industry's most affordable tools for ≤200mm plating. Now we want to enable economies on the cost of ownership side, as well — perhaps reducing those expenses by as much as 25 to 30%. And that's our goal in this initiative.”

    The company explained that it sees potential for shrinking Cu plating CoO by reducing chemical consumption, extending the life of consumables and equipment parts, increasing and optimizing throughput, and enhancing chamber performance, among other areas. Company representatives stated that they are working toward innovative ways to increase efficiencies, minimize waste, streamline operation and optimize performance in each of the copper plating processes.

    "Copper plating is an extremely hot area of interest right now in a great many emerging markets," said Witt. "That's why ClassOne focuses serious attention on it. We want to continue to be the go-to guys for absolutely everything having to do with copper plating on smaller wafers."

    "And that's why you'll be seeing more new copper-related announcements coming from ClassOne in the coming weeks and months," he added.

    ClassOne Technology offers a selection of new wet processing tools specifically designed for users of 75mm to 200mm wafers. These include three different models of Solstice electroplating systems for production and development as well as the Trident® families of Spin-Rinse-Dryers and Spray Solvent Tools. All are priced at less than half of what similarly configured systems from the larger manufacturers would cost — which is why the ClassOne lines are often described as delivering “Advanced Wet Processing for the Rest of Us.”

    For additional information about ClassOne Technology or any of its budget-friendly wet processing tools, visit www.classone.com.

    ###

    About ClassOne Technology
    ClassOne Technology (www.classone.com/) develops and delivers innovative new wet-chemical equipment solutions especially for the cost-conscious users of 200mm and smaller substrates, users who traditionally have been underserved by the larger equipment manufacturers. ClassOne’s products include electroplating, spin rinse drying and spray solvent tools. Based in Kalispell, Montana, ClassOne Technology is built upon decades of experience from industry veterans who continue the tradition of delivering first-class quality and performance at an affordable price. ClassOne Technology is a sister company to ClassOne Equipment (ClassOneEquipment.com), long respected as the industry’s premier provider of refurbished processing tools, with over 2,500 systems installed worldwide.

    For more information, contact:
    Byron Exarcos
    ClassOne Technology
    109 Cooperative Way
    Kalispell, MT 59901
    United States
    tel: +1 (678) 772-9086
    email: pr@classone.com

    Solstice® and Trident® are registered trademarks of ClassOne Technology.

  • Kalispell, Montana – ClassOne Technology (www.classone.com), manufacturer of wet processing equipment for 200mm and smaller wafers, announced that Scientech Corporation of Taipei, Taiwan, will become the company’s new representative for China, Taiwan and Southeast Asia, starting immediately.

    "Asia is an extremely active and important region for us," said Byron Exarcos, President of the ClassOne Group. "We wanted a respected and thoroughly experienced sales and support operation there, and Scientech filled the bill perfectly. They have all the necessary infrastructure and well-established field service teams, having served the industry for over three and a half decades — including many years representing Semitool. We’re proud and delighted to now have them on the ClassOne team."

    “We're very impressed by the rapid success ClassOne has been achieving, bringing high-performance wet processing solutions to the emerging markets — with more than 100 tools already installed across the U.S. and Europe," said M.T. Hsu, President of Scientech Corporation. “It's great to represent products that are in high demand, and we're looking forward to helping expand ClassOne's presence in Asia."

    Scientech Corporation (www.scientech.com) was established in 1979 and has headquarters in Taipei, Taiwan, with five additional offices across Taiwan and Shanghai. Scientech will provide full sales, installation, service, parts, process development assistance and technical support for all ClassOne Technology equipment — including the Solstice® family of electroplating systems and the Trident® families of Spin Rinse Dryers and Spray Solvent Tools.

    ClassOne stated that the company's mission is to provide advanced wet processing performance at an affordable price for users of 200mm and smaller substrates. Many of these users are in budget-limited emerging markets producing a range of devices such as MEMS, LEDs, RF, power and sensors. ClassOne's pricing is often less than half that of similarly configured 300mm systems outfitted for 200mm from the large manufacturers — which is why ClassOne tools have been described as delivering "Advanced wet processing for the rest of us."


 Products

  • Solstice™ Electroplating Tools
    Electroplating Systems for 75-200mm Substrates Three models: from development to volume production Solstice LT, S4, and S8 ...

  • Solstice™ S8 and LT Electroplating Tools

    Electroplating Systems for 75-200mm Substrates

    The cost-effective route to volume production for smaller-substrate applications...

    If you work on 200mm or smaller substrates you don’t need to buy a big, expensive 300mm plating tool from the Big Guys. Solstice® is a smarter and much more affordable solution.

    Specifically designed for the world of smaller substrates, Solstice systems are priced at less than half of what similarly configured plating systems from the larger manufacturers would cost. Solstice provides a new cost-effective way to replace wet benches or older plating systems — to gain significant improvements in uniformity, consistency, productivity and ROI! Solstice electroplating systems allow you to do more and do it better.

    Three models: from development to volume production

    For process development you may choose the manual-load Solstice LT with one or two chambers. For mid-level production, the Solstice S4 provides up to four chambers and full cassette-to-cassette automation. For higher-volume production and greater flexibility, the fully automated Solstice S8 offers up to eight chambers and up to 75wph throughput.

    All Solstice models share the same advanced-performance chambers, software controls, electronics and superior processing results. Each tool provides the same touch-screen control, GEM/SECSII interface, full reporting and a great deal more. As a result, you have a natural and easy upgrade path from development to full production.

    Solstice with Plating-Plus adds multiprocessing capability
    Because of its unique multi-chamber design, Solstice can allow additional processes — such as Metal Lift Off, Resist Strip and UBM Etch — to be integrated into a single tool. This ClassOne-proprietary capability is known as Plating-Plus™, and it can optimize Solstice utilization and give substantial net cost savings as well as significant process enhancements. Read more about Plating-Plus >

    Key Features

    • Use for plating, cleaning or etching
    • For 75mm to 200mm substrates
    • Simple diameter change
    • Faster plating rates, higher throughput
    • Superior control, higher uniformity
    • From 2 to 8 process chambers
    • For thin or bonded substrates
    • For transparent or opaque substrates
    • Powerful Windows-based software
    • Broad process flexibility

    Many Plating Applications

    • Cu, Au, Ni, Sn, Ti , alloys and more
    • Cu TSV
    • Cu Pillar
    • Cu Bump
    • Cu RDL and Pad
    • Cu Damascene
    • Wafer Level Packaging
    • Cyanida and non-cyanide Au
    • Low-stress Ni
    • Lead-free solder

    Why A Solstice Plating Tool?

    • Processing 200mm or smaller substrates
    • Non-uniformity of a wet bench is unacceptable
    • Plating rate of a wet bench is limiting capacity
    • Manually fixturing wafers results in unacceptable wafer-to-wafer variation
    • Manual Operations result in too much scrap (mis-processing, breakage)
    • Manual Operations are risky (chemical exposure)
    • Reproducibility is now the barrier to continuous improvement and yield
    • Better than 5% uniformity is needed
    • Price of the other system is unacceptably high
    • Want to pay the minimum for an advanced, automated production electroplating tool.
  • Trident™ SST Spray Solvent Tools
    The Trident Spray Solvent Tool (SST) is the next generation of batch-processing SSTs for Metal Lift-Off, Photoresist Strip, Polymer Removal and other demanding solvent based processes....

  • Trident™ SST Spray Solvent Tools

    Spray Solvent Tools for 75-200mm Substrates

    The Trident Spray Solvent Tool (SST) is the next generation of batch-processing SSTs for Metal Lift-Off, Photoresist Strip, Polymer Removal and other demanding solvent based processes. Trident Spray Solvent Tool models are available for 75 to 200mm substrates — with one or two process chambers; two, four, six or eight heated chemical tanks; and a wide range of rotors. These systems include the proven Windows® 7-based Solaris™ controller as well as remote login, data logging, GEM/SECSII communications and reliability reporting.

    Bottom line, Trident SSTs increase uptime and productivity while significantly reducing capital expense — with system pricing that is significantly lower than competitive spray solvent tools.

    Key Features

    • One or two process chambers
    • Available for 75-200mm substrates
    • 2-, 4-, or 6- tank models
    • Wide range of rotors
    • Windows®7-based Solaris controller
    • Remote login
    • Data logging
    • GEM/SECSII communications

    Major Benefits

    • Significantly lower operating expense
    • Reduced chemical consumption
    • Shorter process time
    • Fewer defects
    • Easier control and operation

    Processes for Spray Solvent Tools

    • Metal Lift-Off
    • Resist Strip
    • Polymer Removal
    • Substrate Cleaning
    • Resist Developing
  • Trident™ Spin Rinse Dryer (SRD)
    The Trident family of Spin Rinse Dryers (SRDs) provides the state of the art in cleaning, rinsing and drying wafers after wet processing....

  • Trident™ Spin Rinse Dryer

    Spin Rinse Dryer (SRD) for 75-200mm Substrates

    The Trident family of Spin Rinse Dryers (SRDs) provides the state of the art in cleaning, rinsing and drying wafers after wet processing. The systems' non-contact heating results in cleaner N2 because it places a filter after the heater and eliminates direct contact between N2 and heater.

    Trident SRDs also use ultra-pure valves and fittings throughout, and all systems include a comprehensive facility panel to precisely control all pressures and flows. These are typical of the design advances and efficiencies that give Trident Spin Rinse Dryer its uniquely attractive performance-to-price value.

    ClassOne Trident Spin Rinse Dryers are available in bench-top and roll-around single-stack units and in dual-stack configurations, for processing up to 50 substrates per batch in sizes of 75mm to 200mm, depending upon the model, bowl size and rotor used.

    Key Features

    • Stainless Steel Cabinetry
    • Negative-Pressure Motor Seal
    • Non-Contact Ultra-Pure N2 Heater
    • Uniform Water Spray
    • Full-Control Facility Panel
    • Door-top DC Ionizer
    • Full Wrap-Around Bowl Heater
    • PLC Control with Color Touch Screen

    Major Benefits

    • FM4910 compliance
    • Much cleaner seal, reduced particles
    • Cleaner N2
    • Uniform rinse, no nozzle replacement
    • Precise control of flows and pressures
    • Reduced particles
    • Optimum drying performance
    • All Spin Rinse Dryer components readily available

    Processes

    • Spin, Rinse, and Dry semiconductor wafers without leaving water spots and films after a wet process
    • Chemical or residue removal
    • Cleaning up to 200mm wafers utilizing DI Water Rinse, followed by heated N2 dry

 Additional Info

New Exhibitor:
No
New Products:
Yes
Displaying Equipment:
Yes
Product Demonstrations:
No

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