Semiconductor Equipment Corporation

5154 Goldman Ave
Moorpark,  CA  93021

United States
http://www.semicorp.com
  • Booth: 5958


Welcome and explore our new website: semicorp.com

SEMICONDUCTOR EQUIPMENT CORP. Manufacturer and distributor of manual, semiautomatic, and automatic equipment for the Photonics, Semiconductor, MEMS, SMT and Hybrid Industries. Back end products include flip-chip bonders, ultrasonic die bonders, laser diode bonders, eutectic die bonders, manual pick & place, epoxy die bonders, die rework, dicing tape, manual and automatic dicing tape applicators, UV tape curing system, backgrinding tape, backgrinding tape applicators, backgrinding tape peelers, and die ejectors. Front end products include semiautomatic and fully automatic cassette, SMIF, RSP, FOSB, FOUP, and EUV pod cleaning systems and cleaning wafers for vacuum and e-chucks.


 Press Releases


 Products

  • Model 865 Flip Chip Bonder
    The New Model 865 Flip Chip Bonder is a multi-use semiautomatic system ideal for R & D and low volume production. Applications include solder and gold bumped flip chip, eutectic bonding and epoxy bonding....

  • Specifications

    •  +/- 1 um placement accuracy depending on application
    • Die sizes from 0.006" square to 1.00"
    • Four 2"X2" or 4"X4" waffle pack pick-up stage.
    • Workstage options include 4"X4" heated and unheated and  1" and 2" rapid heat stage.
    • Bond load ranges from 5 grams to 10 kilograms.
    • Throughput - up to 200 placements per hour.
  • Model 365 UV Curing System
    Introducing the Model 365 UV Curing System for Dicing and Back Grinding Tape.The Model 365 features long light source life and simple operation. New features include much higher watt density (70 mW/cm2), most dicing tapes are cured in about 5 seconds....

  • Standard features of the Model 365

    • 10.000 hour LED life

    • Instant on, no warm-up

    • Nitrogen purge capability

    • Touch screen display

    • Self diagnostics

    • Modular LED board design

    • No external ventilation needed

    • Works with all wafers and film frames up to 300 mm

  • Hugle Model SC-8 Cassette and Box Cleaning System
    The Model SC-8 washes and dries all types of wafer carriers up to eight inch. Multiple carriers are loaded into a wire tray that is conveyed through a high velocity water jet chamber and a high velocity hot air drying chamber....

  • SC-8 Features:

    • Energy saving measures
    • Small footprint
    • High performance cleaning by high velocity water jet
    • Fast drying by heated CDA
    • Surfactant wash with DI water rinse available

 Additional Info

New Exhibitor:
No
New Products:
Yes
Displaying Equipment:
Yes
Product Demonstrations:
Yes

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