3D-Micromac AG

Technologie-Campus 8
Chemnitz,  D-09126

Germany
http://www.3d-micromac.com
  • Booth: 7717

3D-Micromac AG - Micromachining Excellence
3D-Micromac is the leading specialist in laser micromachining. Our team of experts develop processes, machinery and complete systems at the highest technical and technological level. 3D-Micromac systems and services have been successfully implemented in various high-tech industries worldwide including photovoltaic, semiconductor, glass and display industries, micro diagnostics, and medical technology. Our target is to completely satisfy customer demands even on the most complex projects.


3D-Micromac adheres to high-performance and future-oriented processes at high production efficiency. Our technologies have set international standards for true innovation.

3D-Micromac America, LLC
2151- 40 O’Toole Ave
San Jose, CA 95131
USA
Email: sales@3d-micromac.com


 Press Releases

  • 3D-Micromac AG will present its microDICE laser dicing system and further innovative solutions for processing of semiconductors at Semicon West 2017

    3D-Micromac, the leading specialist for laser micromachining, will present its high-performance microDICE laser dicing system which brings TLS-Dicing-Technology (Thermal-Laser-Separation) to semiconductor‘s back-end. The microDICE separates wafer into dies with minimal cost per wafer, an outstanding edge quality while increasing the yield and the throughput. Reasoned by the outstanding advantages in terms of cost, throughput und quality microDICE is the first choice to separate SiC wafer.

    TLS-Dicing uses thermal induced stress, to separate brittle material in one pass. The cleaving-process doesn’t ablate or melt any material – no particles are generated. TLS-Dicing separates back side metal very smooth and without delamination. Furthermore, TLS-Dicing reduces dicing costs per wafer significantly.

    The microDICE™ laser micromachining system from 3D-Micromac supports volume production of high-power diodes.

    About 3D-Micromac AG

    Founded in 2002, 3D-Micromac AG is the industry leader in laser micromachining, delivering powerful, user-friendly and leading edge processes with superior production efficiency. The company develops processes, machines and turnkey solutions at the highest technical and technological level. 3D-Micromac systems and services have been successfully implemented in various high-tech industries worldwide including photovoltaic, semiconductor, glass and display industries, micro diagnostics, and medical technology.

    Company Contact:

    Mandy Gebhardt
    Manager, Marketing and Public Relations
    3D-Micromac AG
    Tel: +49 371 40043-26
    E-mail: gebhardt@3d-micromac.com

    PDF Download: 3D-Micromac presents enabling dicing technology at Semicon West 2017


 Products

  • microDICE™
    TLS-Dicing™ System for Separation of SiC and Si Wafers ...

  • 3D-Micromac’s high-performance microDICE™ laser dicing system separates wafers into dies using TLS-Dicing™ technology (Thermal-Laser-Separation). microDICE™ significantly reduces the dicing cost per wafer compared to traditional separation technologies. At the same time, cleaving with microDICE™ provides outstanding edge quality while increasing yield and process throughput. This is particularly true for silicon carbide (SiC) substrates, which are hard and brittle.

    microDICE™ offers:

    • Significantly higher throughput, with dicing speeds up to 300 mm/s
    • Minimal cost of ownership
    • The ability to produce more dies per wafer by reducing street width

    TLS-Dicing™ (Thermal Laser Separation) is a unique technology for separating wafers into single chips in semiconductor back-end processing. TLS-Dicing™ uses thermally induced mechanical stress to separate brittle semiconductor materials, like silicon (Si) and silicon carbide (SiC) wafers.

    TLS-Dicing™ is an ideal solution for wafer dicing that has many advantages compared to competing technologies, such as the currently established method of mechanical sawing as well as laser ablation. These include:

    • High separation speed (e.g., 200 mm/s for SiC or 300 mm/s for Si)
    • Very smooth edges (reduces leakage current of diodes)
    • Clean and nearly dry process
    • Nearly no chipping and micro cracks for less breakage
    • Thin back side metal can be separated without damage
    • No tool wear
    • Lower cost of ownership due to no tool wear and nearly no consumables
    • Zero Kerf cleaving process for reduced street width, enabling more die per wafer
    • Applicable to larger diameter substrates (e.g., 300 mm)
  • microCELL™ OTF
    On-the-Fly Laser Processing System for Silicon Solar Cells, e.g. PERC...

  • 3D-Micromac‘s microCELL™ OTF is a highly productive laser system for processing of mono- and polycrystalline silicon solar cells. The microCELL™ OTF meets cell manufacturers‘ demands for increasing the efficiency, e.g. of PERC solar cells, by precise surface structuring, low operating costs, and highest availability.

    Laser processing on-the-fly and an innovative handling concept enable maximum throughput and yield in the mass production of crystalline solar cells. The contactless cell handling enables processing without surface defects and microcracks.

    microCELL™ OTF offers:

    • On-the-fly laser processing with unbeatable
      cost-benefit ratio
    • Contactless wafer handling
    • High throughput and efficiency (> 3,800 wph)
    • Low cost of ownership and CAPEX
    • Upgrade for existing production lines or expansion
  • microCELL™ TLS
    On-the-Fly Cell Cutting System using Thermal Laser Separation...

  • 3D-Micromac‘s microCELL™ TLS is a highly productive laser system for separation of standard silicon solar cells into half cells. The microCELL™ TLS meets cell manufacturers‘ demands by retaining the mechanical strength of the cut cells.

    The ablation free process guarantees an outstanding edge quality. Laser processing on-the-fly and an innovative handling concept enable maximum throughput and yield in the full-scale manufacturing of crystalline half cells.

    microCELL™ TLS offers:

    • On-the-fly laser processing with unbeatable
      cost-benefit ratio
    • One-pass contactless dicing process
    • High throughput > 3,800 wph on single lane
    • Dicing speed up to 300 mm/sec
    • Low cost of ownership and CAPEX
    • Inline integration into existing production lines

 Additional Info

New Exhibitor:
No
New Products:
Yes
Displaying Equipment:
No
Product Demonstrations:
No

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