Unity Semiconductor SAS

611 rue Aristide Bergès
Z.A. de Pré Millet
MONTBONNOT-SAINT-MARTIN,  38330

France
http://www.unity-sc.com
  • Booth: 6468

UnitySC is recognized worldwide as a key player in inspection and metrology, combining advanced technologies in automated optical inspection and 3D imaging with microscopy, temporal-mode interferometry, and spectrometry, which enables customers to achieve higher yields and faster time to market. Customers include the largest foundries, integrated device manufacturers, outsourced semiconductor assembly and test service providers, and R&D centers. We provide standard and customized solutions adapted to specific industrial needs and constraints, enabling a new era in process control. Headquartered in Grenoble, France, the company maintains offices in Taiwan and is supported by a network of representatives and distributors. Learn more at unity-sc.com.


 Press Releases

  • Leading IDM Selects New 4See Series Automated Defect Inspection Platform for Power Semiconductor Automotive Applications

    Grenoble, France, May 9, 2017UnitySC, a leader in advanced inspection and metrology solutions, today announced multiple orders from a leading integrated device manufacturer (IDM) for its modular 4See Series automated defect inspection platform. The systems were selected because they deliver optimal wafer backside surface and edge defect inspection post thinning and metallization. The 4See Series will be used for automotive applications by a market leader in power semiconductor manufacturing to improve the reliability and performance of its products.

    “Being selected by a market leader validates the strength of our solutions and confirms our strategy to address new markets with our advanced process control solutions,” said Gilles Fresquet, CEO, UnitySC. “This win expands our reach beyond the traditional substrate control market to include wafer thinning for power semiconductors.”

    IHS Markit predicts USD $3 billion in global market growth for the power semiconductors used in cars and light passenger vehicles, over the next six years. Increasing electronic content is a key driver, particularly in hybrid and electric cars, due to consumer demand for constant connectivity. The automotive industry’s push to deliver autonomous, green vehicles in the next decade is also driving growth. These technologies rely on the latest power semiconductor devices, enabled by advanced wafer manufacturing processes like wafer thinning.

    “As the wafers used in power semiconductor manufacturing become thinner, controlling wafer quality through the backside thinning and metallization process steps becomes more critical to end-device performance and reliability,” noted Fresquet. “For years, manufacturers have considered our Deflector module be the best-in-class solution for silicon and silicon-on-insulator wafer slip line detection. Combined with the Edge module, this 4See Series configuration delivers industry-leading inspection capabilities that meet semiconductor market needs.”

    UnitySC’s new 4See Series for all-surface inspection of semiconductor wafers is a modular system with up to three module offerings: Deflector, Edge and LineScan. The platform can be configured according to application needs, such as wafer thinning, µbumping, MEMS, and more, and can include any number of the modules in desired configurations.

    • Based on phase shift deflectometry technology, the Deflector module is a wafer surface inspection solution that achieves high throughput and very high vertical sensitivity in the nanometer range. It can detect slip lines, grinding marks, failures, cracks, comets, embedded particles, residues, and stains. The Deflector module is well suited to frontside and backside inspection, even under highly warped conditions.
    • The Edge module is a high throughput and versatile solution based on confocal chromatic technology, which is used to inspect the full wafer edge: top, top bevel, apex, bottom bevel and bottom. It has a high depth of focus and does not require a backside contact chuck.

    Combining the Deflector and Edge modules in one system offers full wafer characterization compliant with 8” or 12’’ wafer high-volume manufacturing requirements. The 4See Series is scheduled to ship in Q3 2017 to fab locations around the world.

    High-Res Image Downloads for Editorial Use

    4See Series images can be downloaded here: https://impresspr.egnyte.com/fl/Fk4vwjQzK3/UnitySC_4See-Series_Photos_

    About UnitySC

    UnitySC is recognized worldwide as a key player in inspection and metrology, combining advanced technologies in automated optical inspection and 3D imaging with microscopy, temporal-mode interferometry, and spectrometry, which enables customers to achieve higher yields and faster time to market. Customers include the largest foundries, integrated device manufacturers, outsourced semiconductor assembly and test service providers, and R&D centers. We provide standard and customized solutions adapted to specific industrial needs and constraints, enabling a new era in process control. Headquartered in Grenoble, France, the company maintains offices in Taiwan and is supported by a network of representatives and distributors. Learn more at unity-sc.com.

    Corporate Contact

    Yann Guillou
    UnitySC
    Tel: +33 456 526 800
    y.guillou@unity-sc.com

    Press Contact
    Eric Lawson
    Impress Labs
    Tel: +1 480-276-9572
    eric@impresslabs.com

  • NST Series Provides Non-Contact Full Field Profilometry to 0.1nm Resolution; Delivers Unique Overlay Solution for Hybrid Bonding

    Grenoble, France, March 14, 2017 – UnitySC, a wholly owned subsidiary of FOGALE Nanotech Group and a leader in inspection and metrology solutions for advanced semiconductor packaging, today introduced its new NST Series at SEMICON China in Shanghai. The NST Series is the world’s first non-contact metrology solution for accurately measuring the nanoscale surface topography of semiconductor wafers in high-volume manufacturing.The new platform enables higher wafer yields and throughputs, and targets advanced processes being implemented for next-generation image sensor and memory technologies.

    The ever-increasing performance requirements of today’s advanced semiconductor devices are driving the need for accurate, high-throughput inline metrology. This is true for Cu CMP processes, pre- and post-Cu-to-Cu wafer hybrid bonding processes, as well as any type of front-end CMP and etch processes, all of which are necessary to enable the semiconductor industry’s move toward more efficient manufacturing.

    “We developed the NST Series in response to the needs expressed by the industry and our customers,” said Gilles Fresquet, CEO, UnitySC. “The first tool was delivered in late 2016 to a key customer and partner, and is in operation. We foresee significant shipments of this series this year. We believe it is a game changer in process control capabilities that will impact throughput and yield for all semiconductor profiling applications, and particularly advanced CMOS image sensors and 3D memory stacks.”

    “The CIS industry was the first to directly leverage the development of 3D hybrid bonding techniques. According to our latest technology and market analyses, the significance of this hybrid bonding technology will exceed $1 billion USD in 2017 and will double the CIS market CAGR at an expected 20% until 2022,” said Pierre Cambou, Activity Leader, Imaging at Yole Développement. “With its new NST Series nanotopography metrology platform, UnitySC is directly addressing this growing market.” (1)

    UnitySC’s NST Series semiconductor measurement equipment surpasses conventional optical interferometry by not being impacted by transparent layers. The NST Series extends beyond contact profilometry into the atomic-force-microscope-level performance. Contactless full-field profilometry at resolutions down to 0.1nm captures artifact-free area scans to deliver critical information much faster than existing solutions. A streamlined preparation process eliminates the metal deposition step after Cu chemical mechanical planarization (CMP) that is required by competing platforms to control wafer surface quality before the hybrid bonding process, thereby reducing wafer scrap and delivering higher yields. Additionally, NST is the only metrology platform that offers overlay capabilities for post-bond metrology in Cu-to-Cu hybrid bonding applications.

    The NST Platform is now available in two configurations:

    • The NST XP system provides versatile, high-speed and high-precision non-contact, full-field profilometry for single-die or multi-die surface topologies. It can perform a wide array of measurements, such as dishing, erosion, CD, step height, deep trench, and roughness.
    • The NST Bond platform is a complete metrology solution for hybrid bonding, combining the NST XP’s capabilities with additional features for high-resolution measurement after the Cu CMP and Cu-to-Cu bonding processes, including in-plane and out-of-plane overlay.

    UnitySC is exhibiting at SEMICON China, March 14-16, 2017 at the Shanghai New International Expo Centre in Shanghai. Please stop by booth #5375 in Hall W5 to learn more, or email Yann Guillou to arrange a meeting.

    High-res Image Downloads for Editorial Use

    Journalists, NST Platform images can be downloaded here: https://impresspr.egnyte.com/fl/07V9wNuoHo/UnitySC_NST_Platform_Images_

    (1)    Source: Status of the CMOS Image Sensor Industry 2016: New Market and Technology Dynamics report, Yole Développement, 2016.

    About UnitySC

    UnitySC is recognized worldwide as a key player in inspection and metrology, combining advanced technologies in automated optical inspection and 3D imaging with microscopy, temporal-mode interferometry, and spectrometry, which enables customers to deliver higher yields and faster time to market. Customers include the largest foundries, integrated device manufacturers, outsourced semiconductor assembly and test service providers, and R&D centers. The company provides standard and customized solutions adapted to specific industrial needs and constraints, enabling a new era in process control. Headquartered in Grenoble, France, the company maintains offices in Taiwan and is supported by a network of representatives and distributors. Learn more at unity-sc.com.

    Corporate Contact

    Yann Guillou

    UnitySC

    Tel: +33 456 526 800

    y.guillou@unity-sc.com

    Press Contact

    Eric Lawson

    Impress Labs

    Tel: +1 480-276-9572

    eric@impresslabs.com

  • Grenoble, France, Jan. 23, 2017 – UnitySC, a wholly owned subsidiary of FOGALE Nanotech Group and a leader in inspection and metrology solutions for advanced semiconductor packaging, today announced the opening of its global headquarters in Grenoble, France, the heart of the French Silicon Valley.

    This location strategically positions the company in one of Europe’s key semiconductor research and manufacturing hubs. Officially launched in July 2016, UnitySC now occupies 20,000 sq ft., half of which is cleanroom space, and is ready to continue its rapid growth.

    “Executing this phase of our vision for UnitySC is a major milestone for the company,” said Gilles Fresquet, CEO, UnitySC. “Our journey began when we combined the complementary core capabilities of Altatech’s full wafer inspection with FOGALE Semicon’s robust metrology solutions. Basing our operations in Grenoble allows us to support our intensive technology development and tool manufacturing while providing additional capabilities to run customers’ demonstrations.”

    UnitySC’s complete portfolio for advanced process control allow all-around and through wafer metrology and inspection for 3D TSV, fan-out wafer-level packaging, wafer thinning, micro bumping, and MEMS, as well as substrate applications. Tools developed by UnitySC combine multiple optical techniques from UV to IR based on microscopy, interferometry, spectrometry, full-field profilometry, line scan 2D and 3D confocal chromatic, phase-shift deflectometry, and darkfield Doppler velocimetry. UnitySC customers include the largest foundries, integrated device manufacturers, outsourced semiconductor assembly and test service providers, and R&D centers.

    UnitySC will be exhibiting at the SEMI European 3D Summit, Jan. 23-25, 2017 at the Minatec Campus in Grenoble. Please stop by to learn more, or email Yann Guillou to arrange a meeting.

    About Unity SC

    UnitySC is recognized worldwide as a key player in inspection and metrology, combining advanced technologies in automated optical inspection and 3D imaging with microscopy, temporal-mode interferometry, and spectrometry, which enables customers to deliver higher yields and faster time to market. We provide standard and customized solutions adapted to specific industrial needs and constraints, enabling a new era in process control. Headquartered in Grenoble (France), the company maintains offices in Taiwan and is supported by a network of representatives and distributors. Learn more at unity-sc.com.

    About FOGALE NANOTECH GROUP

    At FOGALE Nanotech, we deliver visionary technologies that foster progress for people. Created in 1983 by a group of high-profile engineers, we are passionate about inventing innovative technologies that facilitate tomorrow’s life. Through collaboration with major players across industries, FOGALE Nanotech has quickly expanded into a diversified industrial group and is now known as the worldwide reference in the field of high-accuracy dimensional metrology. Our cutting-edge products and engineering know-how are acknowledged in the most demanding industries, such as automotive, defense, aeronautics, telecommunications and nuclear energy in Europe, the United States, and Asia. For more information, visit: http://www.fogale.fr/.

    Corporate Contact
    Yann Guillou
    UnitySC
    Tel: +33 456 526 800
    y.guillou@unity-sc.com

    Press Contact
    Eric Lawson
    Impress Labs
    Tel: +1 480-276-9572
    eric@impresslabs.com


 Products

  • TMap Series
    TMap Series is a versatile metrology solution. TMap Series provides highly accurate and repeatable wafer geometry measurements such as thickness, TTV, shape and flatness on mono and multilayer substrates for all kind of materials....

  • TMap Series is a versatile metrology solution. TMap Series provides highly accurate and repeatable wafer geometry measurements such as thickness, TTV, shape and flatness on mono and multilayer substrates for all kind of materials. TMap Series was designed to enable the easiest and fastest measurement for the user. TMap Series is available in manual, semi-automatic or full automatic configurations for wafers up to 300mm.
  • NST Series
    NST Series – A Game Changer in Nanotopography The NST Series is a non contact full field metrology solution based on optical microscopy enabling surface topography measurements at the nano scale....

  • NST Series – A Game Changer in Nanotopography

    The NST Series is a non contact full field metrology solution based on optical microscopy enabling surface topography measurements at the nano scale. The NST Series is pushing the boundaries of conventional microscopy with performances that stretch beyond contact profilometry and into the AFM space.

    Key benefits

    • Cu CMP
    • Hybrid Cu bonding
    • Front-end CMP
    • Front-end etch

    Technologies

    • Phase Shifting Interferometry (PSI)
    • Vertical Scanning Interferometry (VSI)
    • Time domain IR spectroscopy
    • IR microscopy

    Examples of measurements

    Post CMP Nanotopography and Wafer Edge Roll Off

    µbump and PI over RDL

    Wafer to wafer bonding overlay

  • 4See Series
    Modular Platform for All Surface Inspection : Top, Bottom, Edge The 4See Series ensures wafer front side, backside and edge quality by detecting, counting, and binning particles and defects during the wafer manufacturing process....

  • 4See Series – Modular Platform for All Surface Inspection : Top, Bottom, Edge

    The 4See Series ensures wafer front side, backside and edge quality by detecting, counting, and binning particles and defects during the wafer manufacturing process.

    Applications

    • Wafer Thinning
    • Substrates Control
    • Micro-bumping
    • Interconnect
    • MEMS

    Technologies

    • Phase Shift Deflectometry
    • Line Scan Confocal Chromatic

    The 4See Series is built on a modular approach allowing to combine several modules depending on the customer needs.

    LineScan module

    • High depth of focus
    • High resolution
    • Multi line scan

    • Strong topography can be inspected
    • Low sensitivity to bow/warp
    • Passive autofocus by design

    Deflector module

    • Nanometer topographical sensitivity with full field of view
    • High Throughput
    • Simultaneous double side inspection
     

    Edge module

    • Full wafer edge surface inspection at high speed
    • Top surface, top bevel, APEX, bottom bevel, Bottom surface
    • Near edge inspection possible

    4SeeSeries features an Automatic Defect Classification software that automatically classifies defects on the wafer and generates reports.

    Automatic Classification Software (ADC)

    A Global Solution for Defect Detection, Analysis, Classification and Review.


 Additional Info

New Exhibitor:
No
New Products:
Yes
Displaying Equipment:
No
Product Demonstrations:
No

Send Email

Type your information and click "Send Email" to send an email to this exhibitor. To return to the previous screen without saving, click "Reset".