Siltectra GmbH

Manfred-von-Ardenne-Ring 20
Dresden,  01099

Germany
http://www.siltectra.com
  • Booth: 6367


 Press Releases

  • Dresden, June 7, 2017 – Since June 1, 2017, SILTECTRA GmbH, a technology specialist for kerf-less wafering, has a new CEO. Dr. Harald Binder is known as an expert in the semiconductor industry. His strategic goal is to prepare the company for entering the commercialization phase. He will work closely with Dr. Jan Richter, CTO, who has been responsible for technology and process development since 2011 and collaborated on more than 25 new patents since that time. Former CEO, Dr. Wolfram Drescher, will join the Advisory Board and will continue to shape the company in his new role. “Harald Binder is the industry expert we have been looking for. He brings many years of experience in strategic development and production optimization. It is precisely this experience that we need in order to take advantage of the imminent demand for power semiconductors and provide manufacturers with cost-effective wafering solutions,” said Dr. Axel Thierauf, Partner of MIG Verwaltungs AG, whose MIG-Funds hold a majority stake in SILTECTRA GmbH. Dr. Harald Binder started his career in the atom physics sector in 1977. He then entered the semiconductor industry at Siemens Semiconductor, where he was involved in the DRAM activities for several years. He continued his career in different management roles at M+W Zander, a leading construction company for semiconductor manufacturing sites. From 2006 to 2008, he was CEO of centrotherm thermal solution AG. Afterwards he joined the world leading equipment manufacturer Applied Materials as Vice President and General Manager. In the last five years, he supported the business and strategy development of several companies in the semiconductor sector as an independent consultant. SILTECTRA processes high-quality semiconducting material to create wafers for the chip industry without loss of material. The special laser process, which SILTECTRA has pioneered, is based on a chemical-physical process where thermal stress generates force that splits the material along the desired plane. Compared to conventional methods such as sawing, the process cuts material loss by more than 90%. SILTECTRA’s technology is therefore particularly advantageous when very cost-intensive semiconductor materials such as silicon carbide are used. ”Depending on the material, the substrate allocates between 5 and 50% of the cost of a single device. Our COLD SPLIT technology makes the new chip generation for power electronics up to 15 to 20% less expensive. Those cost benefits will accelerate the market penetration of future applications like 5G, wireless charging or electro mobility”, said the SILTECTRA CEO Dr. Harald Binder. Since September 2016, SILTECRA has been operating a pilot process for cleaving semiconductor materials in Dresden. The company is currently developing a system and a relating process to meet high volume manufacturing requirements. That is expected to be available by Q3 2017 in the new SILTECTRA building.
  • SILTECTRA GmbH, a technology specialist for kerf- less wafering, is pleased to introduce a new addition to it’s top-ranked advisory board.

    The board delivers outstanding strategic and technology expertise, supporting the new CEO Dr. Harald Binder to elevate the company to the next level of commercialization.

    Semiconductor veteran Joe Bronson, who is highly acknowledged in the semiconductor industry, supports the strategy process. Joe holds many board seats with leading players in the industry in Europe, the US and China. In addition, he provides more than 40 years of semiconductor industry experience based on C-level positions at key players like AMAT, SVTC, Form Factor, etc.

    Joe is a certified public accountant who holds a Bachelor of Science degree in accounting from Fairfield University, as well as a Master of Business Administration from the University of Connecticut. 

    Technology development also benefits from the long-lasting expertise of Dr. Bernhard Stapp. Bernhard was the CTO of OSRAM Opto Semiconductor prior to taking over the GM position in Business Unit Solid State Lighting at OSRAM. He held several different R&D positions at Siemens, working with optical fiber, electronic materials and the medical engineering group. He also holds a PhD in organometallic chemistry from the University of Ulm.

    Johannes Froehling supports, in his role as an advisory board member, the new CEO in positioning SILTECTRA in the semiconductor market. Johannes held several strategy and business development VP positions at semiconductor market leaders like AMAT, AIXTRON and Grace Semiconductor in China. He has 15 years of semiconductor industry experience and holds an Engineering degree in Semiconductor Process Technology as well as a Master of Business Administration (MBA).

    The advisory board is completed by the former CEO, Dr. Wolfram Drescher, who has developed SILTECRA’s unique technology position significantly. He continues to support the company, based on his market and technology know-how.

    “By establishing such a high-ranked advisory board, the owner MIG AG clearly focuses on positioning COLD SPLIT TECHNOLOGY in the semiconductor market with successful commercialization,” said Dr. Harald Binder (CEO). 

  • SILTECTRA GmbH, a technology specialist for kerf- less wafering, continues to work on high volume manufacturing qualification and optimization of their unique wafering technology called COLD SPLIT.

    Volume manufacturing process capability for manufacturing SiC substrates, enables the penetration of SiC for power semiconductor applications. One of the key goals of SILTECTRA’s COLD SPLIT TECHNOLOGY is to prove the material savings of up to 90% compared with conventional technologies like wire sawing. These material savings have a direct impact on the substrate cost which allocates about 50% of the total cost of a final SiC device. So far, this cost dependency has been the main bottle-neck to the successful market penetration of the SiC material.

    One of the key enabling parameters is the kerf reduction. Recently, SILTECTRA has been able to establish a kerf-loss far below 100μm. The market standard is between 200 to 250μm or more for an optimized and well-established wafering technology. In order to realize this outstanding and for the industry, significant achievement, SILTECRA engineers have developed a laser process, enabling a premium homogeneity by dynamic control of the light source parameters.

    “With a kerf-loss of below 100μm, chip and substrate manufacturers are able to significantly increase throughput and yield as well as reduce costs, based on material savings,” said Dr. Jan Richter (CTO). 

    SILTECTRA is currently working on further optimization of their LASER process by building a new generation of LASER, ensuring an automated process contr 


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