Mi Equipment (M) Sdn. Bhd.

Plot 13, Bayan Lepas Technoplex, MK12, Industrial Zone Phase 4,
Bayan Lepas
Penang,  11900

Malaysia
http://www.mi-eq.com
  • Booth: 6340


MiE welcomes all to experience our latest packaging machine.

Mi EQUIPMENT (M) SDN BHD is an engineering company, located in Malaysia, with key activities in developing advance machines for the wafer and die processing industry. Mi EQUIPMENT provides reliable and affordable total solution to customers with  core competency in automation and R&D.  Mi EQUIPMENT will go one step further by introducing value added features that will position Mi EQUIPMENT as leading Solutions Provider of packaging equipment in key niche market.


 Press Releases

  • Mi30 series is the next generation die sorting machine with higher UPH and throughput which target for better ROI. Mi30 can also be configured to have side wall inspection (5S) and soft docking test function.

    - Maximum 12”wafer
    - Unique mechanical design provide high throughput
    - up to 30K UPH with flipping and inspection.
    - Ideal tool for sorting application form wafer to carrier tape for bare die, bumped/flip chips and WLCSP.
    - Full inspection for die back and front active area with minimum 6 cameras vision system.
    - Vision system with Side wall inspection.
    - Laser marking option
    - Cable docking test capability
    - IR inspection capability
  • State of art Die Sorting machine for WLCSP product, wafer to reel with the option of side wall inspection, laser marking and cable docking test function

    - Maximum 12”wafer
    - Unique mechanical design provide high throughput
    - up to 25K UPH with flipping and inspection.
    - Ideal tool for sorting application form wafer to carrier tape for bare die, bumped/flip chips and WLCSP.
    - Full inspection for die back and front active area with minimum 6 cameras vision system.
    - Vision system with Side wall inspection.
    - Laser marking option
    - Cable docking test capability
  • Si10 was designed for WLCSP post sawn test application in singulated die format. Die was picked from Sawn wafer for direct docking test and 5S-AOI follow by tape and reel process.

    - Maximum 12” wafer handling capability
    - Reel input with De-taping module
    - Direct docking test capability with multiple sites
    - Full inspection for die back and front active area with minimum 6 cameras vision system.
    - Vision system with Side wall inspection.
    - Ideal tool for post sawn test application
    - Enhance Post seal inspection.
    - Reject bad die to wafer pack.
    - Optional input/output: Jedec tray and Waffle pack.

 Products

  • Si10 Final Test handler
    Si10 was designed for WLCSP post sawn test application in singulated die format. Die was picked from Sawn wafer for direct docking test and 5S-AOI follow by tape and reel process....

  • - Maximum 12” wafer handling capability
    - Reel input with De-taping module
    - Direct docking test capability with multiple sites
    - Full inspection for die back and front active area with minimum 6 cameras vision system.
    - Vision system with Side wall inspection.
    - Ideal tool for post sawn test application
    - Enhance Post seal inspection.
    - Reject bad die to wafer pack.
    - Optional input/output: Jedec tray and Waffle pack.
  • Mi20 Tape & Reel Map Sorter
    State of art Die Sorting machine for WLCSP product, wafer to reel with the option of side wall inspection, laser marking and cable docking test function...

  • - Maximum 12”wafer

    - Unique mechanical design provide high throughput
    - up to 25K UPH with flipping and inspection.
    - Ideal tool for sorting application form wafer to carrier tape for bare die, bumped/flip chips and WLCSP.
    - Full inspection for die back and front active area with minimum 6 cameras vision system.
    - Vision system with Side wall inspection.
    - Laser marking option
    - Cable docking test capability
  • Mi30 Tape & Reel Map Sorter
    Mi30 series is the next generation die sorting machine with higher UPH and throughput which target for better ROI. Mi30 can also be configured to have side wall inspection (5S) and soft docking test function....

  • - Maximum 12”wafer
    - Unique mechanical design provide high throughput
    - up to 30K UPH with flipping and inspection.
    - Ideal tool for sorting application form wafer to carrier tape for bare die, bumped/flip chips and WLCSP.
    - Full inspection for die back and front active area with minimum 6 cameras vision system.
    - Vision system with Side wall inspection.
    - Laser marking option
    - Cable docking test capability
    - IR inspection capability

 Additional Info

New Exhibitor:
Yes
New Products:
Yes
Displaying Equipment:
No
Product Demonstrations:
Yes

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