YINCAE Advanced Materials, LLC

19 Walker Way
Albany,  NY  12205

United States
http://www.yincae.com/
  • Booth: 5269


Find us in the NORTH HALL! Booth # 5248

Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.   Products:

  • Solder Joint Encapsulants
  • Underfill Materials
  • Die Attach Adhesives
  • Conformal Coatings
  • TIM
  • Optical Adhesive
  • Board Level Assembly
  • Anti-Warpage Materials
  • Nanofilm


 Press Releases

  • BP 256 Ball Attach Adhesive

    (Albany, NY) – BP 256 is YINCAE’s new ball attach adhesive product. BP 256 has been designed to enhance solder joint reliability and eliminate cleaning processes for LEAD-FREE ball bumping procedures on CSP, BGA, Flip chip, and PoP devices. It is compatible with current SMT assembly processes. BP 256 is generally applied via printing or pin transfer methods and can replace traditional solder paste, flux, and underfill. During reflow, BP 256 encapsulates individual solder joints improving both reliability and drop test performance. This product also has the benefit of being 100% reworkable. BP 256 is commercially available and is currently being used for ball bumping applications.

    Additional information on the BP 256 is available by contacting YINCAE at info@yincae.com.

    If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

    * * * * * * * * * *

    Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

     ###

    The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

  • YINCAE Advanced Materials, LLC

    19 Walker Way, Albany, NY 12205

    (518) 452-2880

    FOR IMMEDIATE RELEASE                                                                                www.yincae.com


     

    DA 90 Low Temperature Die Attach Adhesive Series Materials

    (Albany, NY) – The DA 90 series materials are YINCAE’s new low temperature die attach adhesives. The DA 90 series offers conductive and insulating options to suit a large variety of applications. These products can be cured at low temperatures (82 – 90°C) and can be used for high temperature applications (215°C for 15 years). In addition to low temperature curing, these products also offer no delamination, high reliability, and high thermal and electrical conductivity. DA 90 series die attach adhesive materials are commercially available and are currently being used for insulating and conductive die attach applications.

    Additional information regarding DA 90 products is available by contacting YINCAE at info@yincae.com.

    If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

    * * * * * * * * * *

    Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

     ###

    The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

  • (Albany, NY)  – YINCAE Advanced Materials has recently developed a unique amine based high purity liquid epoxy encapsulant: SMT 158HA. SMT 158HA is a slow cure underfill particularly designed for large components with small bumps and for applications with strict environmental regulations.

    SMT 158HA has been particularly designed to be used for large component applications as it is highly viscous and allows air to easily escape from the gap during the underfilling process. The slow cure process allows air bubbles to migrate to the edge and escape. Though these processes generally do not significantly impact most components, they require more time to complete for large chips, and the design of SMT 158HA creates the conditions to lead to a void free underfill. As a result, components will exhibit lower thermal stress, and thus improved reliability for devices.

    In additional to numerous processing benefits, SMT 158HA also offers many material benefits. SMT 158HA has a low CTE (20 ppm/K), a high glass transition temperature (156°C), is fast flowing, and offers a high adhesion strength.

    For more information on YINCAE’s SMT 158HA underfill, or to learn more about what YINCAE offers, please email us at: info@yincae.com. You can also find more information by visiting our website at: www.yincae.com

    * * * * * * * * * *

     Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

     ###

    The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.


 Products

  • Reflowable Underfill Material: SMT 160
    Reflowable Underfill Material:...

  • This product is designed to eliminate capillary underfills, simplify the assembly process, combine soldering and underfilling in SMT processes, increase throughput, and reduce costs. 

    Reflowable underfills are dispensed or printed onto the board before component placement occurs. The design of these materials allow it to stay in place and not flow away from the designated areas, allowing component placement to occur in a subsequent step. 

    YINCAE offers one unfilled reflowable underfill material: SMT 160. This underfill provides high reliability, has a built-in flux function, and can eliminate voids. This material has also been designed to be applied through dipping, dispense, or printing methods, giving the design engineer greater flexibility.

  • Solder Joint Encapsulant Paste: SMT 256EP
    Innovative Solder Joint Encapsulant Paste...

  • (Albany, NY)  – YINCAE has developed a new innovative solder joint encapsulant paste. Designed to be used for mass production via dispensing or printing, SMT 256EP replaces traditional solder paste, flux, and underfill. SMT 256EP enhances solder joint strength by 5 to 10 times and has demonstrated high pull strength at both room and high temperatures (280°C). At 280°C, SMT 256EP has a pull strength up to 180g. Thus, SMT 256EP eliminates the RTV or red glue that is typically used to hold components during double reflow, and reduces manufacturing costs. This product is commercially available and used by companies for package level applications. SMT 256EP is an innovative product that demonstrates outstanding thermocycling performance, cost efficiency, and the ability to be reflowed at 230°C, used for high temperature applications (300°C). These results point to SMT 256EP being the next generation adhesive for the Microelectronics industry.

                Additional information on the SMT 256EP is available by contacting YINCAE at info@yincae.com.

    If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

    * * * * * * * * * *

    Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

  • SMT 158UL Highly Filled Room Temperature Underfill
    SMT 158UL Highly Filled Room Temperature Underfill...

  • (Albany, NY) – YINCAE has developed a new, innovative, highly filled, room temperature flow, capillary underfill: SMT 158UL. SMT 158UL is a highly filled capillary underfill designed to flow into gaps as small as 10µm at room temperature without pre-heating a substrate. As a result, SMT 158UL eliminates additional steps required for traditional capillary underfills, thus reducing process time and costs. In addition to costs savings, SMT 158UL offers excellent reworkability, very good drop test and thermal cycling performance, as well as easy storage conditions. These results point to SMT 158UL being the next generation board level underfill for the Microelectronics industry.

                Additional information regarding SMT 158UL is available by contacting YINCAE at info@yincae.com.

    If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

    * * * * * * * * * *

    Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

     ###

    The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.


 Additional Info

New Exhibitor:
No
New Products:
Yes
Displaying Equipment:
No
Product Demonstrations:
No
Please indicate which industries/technologies your company serves
LED/solid state lighting, MEMS, Other, Power Semiconductors, Semiconductor

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