YINCAE Advanced Materials, LLC

19 Walker Way
Albany,  NY  12205

United States
http://www.yincae.com/
  • Booth: 5269


Find us in the NORTH HALL! Booth # 5248

Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.   Products:

  • Solder Joint Encapsulants
  • Underfill Materials
  • Die Attach Adhesives
  • Conformal Coatings
  • TIM
  • Optical Adhesive
  • Board Level Assembly
  • Anti-Warpage Materials
  • Nanofilm


 Press Releases

  • Press Release YINCAE’S New Highly Conductive Thermal Underfill: SMT 158D 
     
    (Albany, NY) May 11, 2018 YINCAE Advanced Materials is proud to introduce SMT 158D, the world’s first (and only) diamond filled underfill!  
     
    SMT 158D was developed in response to the need for underfill materials with a higher thermal conductivity. The thermal conductivity of SMT 158D is 6W/mK, compared to the thermal conductivity of traditional silicon dioxide filled underfill which has a thermal conductivity of less than 1W/mK. Increased thermal conductivity improves reliability in a variety of devices, and is ideal for packages where heat build up is a concern. 
     
    SMT 158D is a diamond filled, rapid curing, fast flowing and easily reworked liquid epoxy that can be used for flip chips, chip scale packages, ball grid array devices, package and land grid array applications.  It is also suitable for bare chip protection in a variety of advanced packages such as memory cards, chip carriers, hybrid circuits and multi-chip modules.   
     
    SMT 158D has been designed for a high production environment where process speed, thermal issues, and reliability are the key concerns.  This material is easily dispensed, minimizes induced stresses and provides outstanding reliability performance (e.g., temperature cycling performance) and excellent mechanical resistance.  
     
    For more information on YINCAE’s SMT 158D underfill, or to learn more about the YINCAE product range, please email us at: info@yincae.com. You can also find more information by visiting our website at: www.yincae.com  
     
    * * * * * * * * * *  Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.  ### 
    The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC. 
  • SMT 158UL Highly Filled Room Temperature Underfill

    (Albany, NY) July 2018 – YINCAE has developed a new, innovative, highly filled, room temperature flow, capillary underfill: SMT 158UL. SMT 158UL is a highly filled capillary underfill designed to flow into gaps as small as 10µm at room temperature without pre-heating a substrate. As a result, SMT 158UL eliminates additional steps required for traditional capillary underfills, thus reducing process time and costs. In addition to costs savings, SMT 158UL offers excellent re-workability, very good drop test and thermal cycling performance, as well as easy storage conditions. These results point to SMT 158UL being the next generation board level underfill for the Microelectronics industry.

    Additional information regarding SMT 158UL is available by contacting YINCAE at info@yincae.com.

    If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us at Yincae.com

    * * * * * * * * * *

    Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

    ###

    The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

  • (Albany, NY) July 2018 – YINCAE has developed a new innovative solder joint encapsulant paste. Designed to be used for mass production via dispensing or printing, SMT 256EP replaces traditional solder paste, flux, and underfill. SMT 256EP enhances solder joint strength by 5 to 10 times and has demonstrated high pull strength at both room and high temperatures (280°C). At 280°C, SMT 256EP has a pull strength up to 180g. Thus, SMT 256EP eliminates the RTV or red glue that is typically used to hold components during double reflow, and reduces manufacturing costs. This product is commercially available and used by companies for package level applications. SMT 256EP is an innovative product that demonstrates outstanding thermocycling performance, cost efficiency, and the ability to be reflowed at 230°C, used for high temperature applications (300°C). These results point to SMT 256EP being the next generation adhesive for the Microelectronics industry.

    Additional information regarding SMT 256EP is available by contacting YINCAE at info@yincae.com.

    If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us at Yincae.com

    * * * * * * * * * *

    Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

    ###

    The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.


 Products

  • Reflowable Underfill Material: SMT 160
    Reflowable Underfill Material:...

  • This product is designed to eliminate capillary underfills, simplify the assembly process, combine soldering and underfilling in SMT processes, increase throughput, and reduce costs. 

    Reflowable underfills are dispensed or printed onto the board before component placement occurs. The design of these materials allow it to stay in place and not flow away from the designated areas, allowing component placement to occur in a subsequent step. 

    YINCAE offers one unfilled reflowable underfill material: SMT 160. This underfill provides high reliability, has a built-in flux function, and can eliminate voids. This material has also been designed to be applied through dipping, dispense, or printing methods, giving the design engineer greater flexibility.

  • Solder Joint Encapsulant Paste: SMT 256EP
    Innovative Solder Joint Encapsulant Paste...

  • (Albany, NY)  – YINCAE has developed a new innovative solder joint encapsulant paste. Designed to be used for mass production via dispensing or printing, SMT 256EP replaces traditional solder paste, flux, and underfill. SMT 256EP enhances solder joint strength by 5 to 10 times and has demonstrated high pull strength at both room and high temperatures (280°C). At 280°C, SMT 256EP has a pull strength up to 180g. Thus, SMT 256EP eliminates the RTV or red glue that is typically used to hold components during double reflow, and reduces manufacturing costs. This product is commercially available and used by companies for package level applications. SMT 256EP is an innovative product that demonstrates outstanding thermocycling performance, cost efficiency, and the ability to be reflowed at 230°C, used for high temperature applications (300°C). These results point to SMT 256EP being the next generation adhesive for the Microelectronics industry.

                Additional information on the SMT 256EP is available by contacting YINCAE at info@yincae.com.

    If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

    * * * * * * * * * *

    Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

  • SMT 158UL Highly Filled Room Temperature Underfill
    SMT 158UL Highly Filled Room Temperature Underfill...

  • (Albany, NY) – YINCAE has developed a new, innovative, highly filled, room temperature flow, capillary underfill: SMT 158UL. SMT 158UL is a highly filled capillary underfill designed to flow into gaps as small as 10µm at room temperature without pre-heating a substrate. As a result, SMT 158UL eliminates additional steps required for traditional capillary underfills, thus reducing process time and costs. In addition to costs savings, SMT 158UL offers excellent reworkability, very good drop test and thermal cycling performance, as well as easy storage conditions. These results point to SMT 158UL being the next generation board level underfill for the Microelectronics industry.

                Additional information regarding SMT 158UL is available by contacting YINCAE at info@yincae.com.

    If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

    * * * * * * * * * *

    Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

     ###

    The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.


 Additional Info

New Exhibitor:
No
New Products:
Yes
Displaying Equipment:
No
Product Demonstrations:
No
Please indicate which industries/technologies your company serves
LED/solid state lighting, MEMS, Other, Power Semiconductors, Semiconductor

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