Delphon Industries

31398 Huntwood Ave
Hayward,  CA  94544-7818

United States
  • Booth: 6057

Stop by Delphon's booth 6057 to see Gel-Pak and UltraTape

Delphon specializes in customized polymer and adhesive films for companies in the medical device and electronics industries. We work closely with companies in the Flexible Hybrid Electronics space to develop stretchable films for use in today’s wearable technologies.  The company’s breakthrough products Gel-Pak and UltraTape are trusted by high-technology companies throughout the world.

 Press Releases

  • HaYward, CA April 19, 2018 Delphon an industry leader in polymer and adhesive products for the electronics and medical industries, will be showcasing its custom films, Gel-Pak device carriers and UltraTape cleanroom tape and label products at the upcoming Semicon West Show in San Francisco, CA.   

    Delphon’s newly introduced E-Film™ is a line of polymer films that offer high optical clarity, low hysteresis and can be customized with properties to meet the needs of electronics and medical device applications. 

    Delphon’s Gel-Pak products protect fragile components during shipping handling and processing.  These Gel-coated carriers and films securely hold devices in place to prevent damage and help companies increase product yield. 

    UltraTape offers cleanroom tape and labels for semiconductor processes including masking, product marking, cleanroom construction, ESD and high temperature applications.  The company’s tapes are particle and residue free and are low outgassing to protect critical environments.

    About Delphon:   

    Delphon provides innovative polymer and adhesive solutions to high-technology industries.  For over 35 years, the company has developed breakthrough products that provide solutions for manufacturing processes in a wide range of markets.  The company operates three divisions that are recognized worldwide for their high-quality brands like Gel-Pak, UltraTape, and TouchMark. Customers from around the globe know that they can trust these brands even in the most critical environments.

    For more information, please contact Jennifer Nunes, Director of Marketing, at or visit


    UltraTape’s Wafer Box Sealing Tapes are ideal for packaging and transporting wafer boxes....

  •  These low-density polyethylene tapes are low in halogens and leachable chlorides. Polyethylene film and acrylic adhesive minimize outgassing and offer good “clean peel” properties. The tapes also offer excellent chemical resistance and good conformability.

    UltraTape’s Wafer Box Sealing Tapes are available in two adhesion levels:

    UltraTape 1110 is designed specifically for sealing wafer shipping boxes as well as cleanroom packaging and bag sealing. It's specially formulated medium-high adhesive leaves no residue or ghosting on plastic boxes, even after prolonged storage. The tape contains extremely low levels of metals, halogens, and outgassing.

    Colors: White (WH), Red (RE), Yellow (YE), Blue (BL), Orange (OR), Green (GR), Clear (CL)

    UltraTape 1112 is similar to the 1110 product. It is for applications where a medium adhesion tape is preferred. The 1112 tape has the same adhesive system (but different ratio of ingredients) as the 1110 tape, and a medium density as opposed to a low density polyethylene backing. These properties make it suitable for general use in the cleanroom environment.

    Colors: White (WH), Red (RE), Yellow (YE), Green (GR), Clear (CL).

  • Gel-Pak Vacuum Release™ (VR) Trays
    This extremely versatile "pocketless" tray securely holds fragile devices including bare die during shipping, handling and processing....

    • Gel retention levels of XT, XL, X4 (X8 available in 16 & 33 mesh only) available to accommodate variations of device size, weight and surface roughness.
    • Mesh sizes 16, 33, 76, 103, 137, and 195 available based on device size. White, or Yellow color available based on mesh size.
    • VR Trays are manufactured using special Process B Gel material.
    • VR Trays available in black conductive polycarbonate (C) or transparent styrene (T).
    • 2" VR Trays are configured either in a hinged box (-02 style) or with lid and outer clip (-00B style). Hinged boxes available is various bottom/top configurations using transparent styrene (T), conductive black (C), and transparent antistatic (AS) materials. 2" Lid available in clear styrene (T), conductive black (C), and transparent antistatic (AS) materials.
    • A wide assortment of optional printed grid patterns readily available. Custom prints artwork (grids, company name, logo, etc) can be created upon request.
    • 4" VR Trays (VR-44) available only in the lid and clip configuration (-00B). 2" Lid available in clear styrene (T), conductive black (C), and transparent antistatic (AS) materials.
    • (-00B) style boxes require clip to secure the lid and tray combination.
  • Special Waffle Pack Lid for Thin Die Handling
    UltraTape offers an entire line of irradiated tapes that are specifically designed to be used in sterile and critical environments....

  • Shipping thin die in waffle packs presents a challenge for many companies. Thin devices packed in these chip trays have a tendency to move around within their pockets and can "escape" from their pockets during transport. The GPL-22C/93CB Lid prevents die from escaping by creating a seal over each waffle pack pocket during shipping and handling.

    To provide the ultimate protection for your device during shipping, handling and processing, use the Gel-Pak VR product line.

    Gel-Pak Vacuum Release (VR) carriers are extremely versatile "pocketless" trays that securely hold fragile devices in place during transport. VR carriers immobilize devices so that there is no edge or top surface contact.

    VR Trays are ideal for:

    • Extremely fragile or thin devices
    • No Contact with edges or top surface of device
    • High-volume automated device Pick and Place applications

 Additional Info

New Exhibitor:
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Please indicate which industries/technologies your company serves
LED/solid state lighting, MEMS, Photovoltaic, Plastic/organic/flexible electronics, Power Semiconductors, Semiconductor

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