MRSI Systems

101 Billerica Ave
Building #3
North Billerica,  MA  01862

United States
https://www.mrsisystems.com/
  • Booth: 6364


MRSI Systems Die Bonding and Epoxy Dispensing Systems

MRSI Systems is a leading manufacturer of fully automated, high-precision, high-speed die bonding and epoxy dispensing systems. We enable customers to optimize the performance of their process including yield, throughput, and uptime by building systems that use our unique expertise. In summary, this includes our proprietary software, proven hardware, deep process knowledge, state-of-the-art manufacturing, and a world-class customer service team. MRSI’s systems are built on common platforms that can be configured to meet specific customer requirements. These platforms are designed to be scalable for R&D prototyping, pilot production and high volume manufacturing. Our solutions deliver the best financial returns in the industry while integrating seamlessly into our customer’s production. Markets include Telecom/Datacom (Data Center), Aerospace & Defense, Medical Devices, Computers and Peripherals, and Industrial. Since 1984, we have been recognized as the standard of the industry, delivering our solutions to leading optoelectronic and microelectronic customers worldwide. 


 Press Releases

  • MRSI Systems, a leading provider of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems is pleased to announce that our new MRSI-HVM3 system has entered a volume production phase, using advanced Demand Flow Technology (DFT) to satisfy worldwide customer demand. Our ability to deliver the new product with short lead times is crucial to our customer’s success.

    Launched at the China International Optoelectronics Exposition (CIOE) Sept. 6-9, 2017, the new system has clearly met a need in the market. The first wave of configured machines have been focused on Chip-on-Submount (CoS), Chip-on-Carrier (CoC), and Chip-on-Baseplate (CoB) and have been successfully installed in North America, Europe and Asia.

    As Dr. Yi Qian, Vice President of Product Management, states, “Our new 3µm high speed die bonder MRSI-HVM3 is exactly the solution the photonics market was looking for to address one of the most critical manufacturing bottlenecks. We listened to our customers and prospects and geared the roadmap towards the direction of high speed without sacrificing high accuracy, or high flexibility, to handle multi-chip multi-process production in one machine. As a result, the system is able to generate a great return on investment for our customers.”

    Our value proposition helps photonic device companies execute their strategy to have a fast response high volume manufacturing capability alongside the ability to maintain low manufacturing costs for the high demand driven by data center applications. We also predicted the new system would need to allow the production of multiple products passing through the same production line without sacrificing throughput. Our assumptions have been validated by this first wave of customers with their test results on their facility floors.

    “MRSI is pleased to meet these specific requirements to scale efficiently in today’s fast-paced market with the MRSI-HVM3, high speed die bonder for high volume manufacturing. MRSI Systems has been serving optoelectronic and microelectronic customers for the past 34 years and continues to be a leader in die bonding and epoxy dispensing systems,” said Mr. Michael Chalsen, President.

    Visit MRSI Systems at Booth #4444, OFC March 13-15, 2018.

    About MRSI Systems

    MRSI Systems is a leading manufacturer of fully automated, high-precision, high-speed die bonding and epoxy dispensing systems. We enable customers to optimize the performance of their process including yield, throughput, and uptime by building systems that use our unique expertise. In summary, this includes our proprietary software, proven hardware, deep process knowledge, state-of-the-art manufacturing, and a world-class customer service team. MRSI’s systems are built on common platforms that can be configured to meet specific customer requirements. These platforms are designed to be scalable for R&D prototyping, pilot production and high-volume manufacturing. Our solutions deliver the best financial returns in the industry while integrating seamlessly into our customer’s production. Markets include Telecom/Datacom (Data Center), Aerospace & Defense, Medical Devices, Computers and Peripherals, and Industrial. Since 1984, we have been recognized as the standard of the industry, delivering our solutions to leading optoelectronic and microelectronic customers worldwide. We are headquartered in Billerica, Massachusetts in the greater Boston area. Our sales are supported by a global network of direct service and support professionals, located in China, Taiwan, Singapore, Korea, Malaysia, the Philippines, Israel, the Netherlands, Switzerland, and the United States. For more information visit: www.mrsisystems.com.

    MRSI Systems Media Contact
    +1 (978) 667-9449
    marketing@mrsisystems.com


 Products

  • MRSI-HVM3 High Speed, Flexible, Die Bonder
    3-Micron Die Bonder for high volume manufacturing. Equipped with ultrafast-ramp eutectic stations, it deploys multiple levels of parallel processing utilizing dual gantries, dual heads, dual bonding stages, and “on-the-fly” tool changes....

  • Our customers need to scale up manufacturing capacity quickly to meet increasing business demands, recently driven by data center applications, telecommunication upgrades to 100G+, 5G wireless, and advanced optical sensors. Our new MRSI-HVM3 high speed, high precision, flexible, 3 micron die bonder, has been built to target this challenge. Today, high volume manufacturing of photonic, sensor, and semiconductor devices demands an automatic die bonding system that can deliver industry leading throughput without sacrificing high precision and superior flexibility.

    MRSI-HVM3 leverages a well-defined set of MRSI core competencies, built up over 30 years, in system design, software development, machine vision, motion control, and industrial automation. Equipped with ultrafast-ramp eutectic stations, it deploys multiple levels of parallel processing utilizing dual gantries, dual heads, dual bonding stages, and “on-the-fly” tool changes.  Used across all products, MRSI’s software platform makes it easy for users to change process settings on their own for new parts, new processes, and new products. These features provide our customers with best-in-class throughput for capacity expansion; high accuracy for high-density packaging; and unmatched flexibility for multi-chip multi-process production in one machine and manufacturing line optimization. Ultimately this system will enable customers to generate a great return on investment.

  • MRSI M-Series, 1-3 Micron Die Bonders
    The MRSI M-Series, 1-3-Micron Die Bonders set the industry standard for ultra-precision, high-complexity die attach in high volume production environments....

  • The MRSI-M3 3-Micron Die Bonder sets the industry standard for ultra-precision, high-complexity die attach in high volume production environments. With features such as force control, ultra precise placements, and 360° die orientation, the MRSI-M3 die bonder  ensures high yields, high quality and high reliability in advanced packaging.

    The highly configurable, MRSI-M3 platform ensures optimum asset protection. The system delivers an unmatched combination of 3-micron accuracy, automation, speed and reliability; in-situ assembly processes such as eutectic die bonding, UV epoxy die attach and flip chip assembly are all possible. The MRSI-M3 3-Micron die bonder is ideally suited for manufacturers of microwave modules, IR sensors, MEMS, multi-chip modules, stacked assemblies, hybrid devices and photonic packages.

    From small dies to large sensors, the MRSI-M3 3-micron die bonder provides all the capability and flexibility to assemble the most advanced packages, without compromising on manufacturing efficiency, quality and reliability.

  • MRSI-705 5-Micron Die Bonder
    The MRSI-705 5-Micron Die Bonder sets the mark for high-precision, high-speed component assembly. Engineered for manufacturing robustness, the MRSI-705 is a flexible configurable platform....

  • The MRSI-705 5-Micron Die Bonder sets the mark for high-precision, high-speed component assembly. Engineered for manufacturing robustness, the MRSI-705 is a flexible configurable platform, with the largest installed base in the industry in advanced packaging. Applications are found across a wide range of market segments, such as life & health sciences, aerospace, defense, automotive, lighting, communications, and more.

    The MRSI-705 is built to meet the highest standards of reliability and dependability. It starts with an award-winning, industry standard platform with a day-in/day-out accuracy of 5 microns; achieved by leveraging the platform’s signature design features:

    A solid granite platform supports the placement head from above, so that no mechanisms are cantilevered. All of this makes the MRSI-705 thermally and mechanically stable with extremely fast settling times and +/- 5 microns or better placement accuracy, a requirement for critical applications.
    Minimized number of moving mechanical parts.
    The major system X Y axes use zero force, ironless, actively cooled linear motors with 
    high resolution linear encoders. Encoder scales have 0.1-micron resolution for fast, precise, closed-loop positioning. The linear motors deliver faster speeds (acceleration, deceleration and velocity), with better settling times and overall smoother motion.
    Reliability is enhanced through the use of advanced air-bearing technology in the Z axis.

    Benefits:

    The MRSI-705 produces the following compelling business outcomes for customers:

    • Strongest ROIs in the industry – A well-established platform with an unmatched Cost of Ownership. Lifts up overall production efficiency.
    • Extended Machine Lifetime – Exceptional performance over time. Upgrade paths as new features are introduced.
    • Proven Manufacturing Readiness – A work horse with minimum downtime. Compelling reliability.
    • Configurable Asset – The MRSI-705 is an open platform that adapts to changing portfolios. Can handle complex multi-chip modules and other advanced assembly challenges with ease.

 Additional Info

New Exhibitor:
No
New Products:
No
Displaying Equipment:
No
Product Demonstrations:
No
Please indicate which industries/technologies your company serves
MEMS, Other, Power Semiconductors, Semiconductor
If you checked Other, please indicate your Company Industry
Photonics, Medical Devices, Telecom/Datacom (Data Center), Aerospace & Defense, Medical Devices, Computers and Peripherals, and Industrial

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