RENA Technologies GmbH

Hoehenweg 1
Guetenbach,  D-78148

Germany
http://www.rena.com
  • Booth: 2017


RENA Technologies GmbH "THE WET PROCESSING COMPANY"

“THE WET PROCESSING COMPANY” RENA Technologies is one of the world's leading suppliers of production equipment for wet chemical surface treatment. RENA products are used in areas
such as Microelectronics,  Solar and Medical Technology, which help to meet the vital needs of people living in today's industrial society.
RENA equipment is used to treat the surfaces of semiconductor wafers, like etching, plating, cleaning and drying with standardised machines and guaranteed processes or entirely customised equipment.
Furthermore, the equipment is used to treat the surfaces of solar cells, cannulas, optical substrates, dental implants and other high-tech products using wet chemicals or ultra-pure water. RENA produces standardised machines with guaranteed processes as well as systems tailored to specific customer reuirements.

For more information, visit www.rena.com


 Press Releases

  • (20180618)

    RENA Batch S equipment is designed with one ore more front handling for all semiconductor wet chemical application. Batch S is used to treat the surfaces of semiconductor wafers, like etching, plating, cleaning and drying with standardised machines and guaranteed processes or entirely customised equipment.

  • (20180618)
    RENA Batch C equipment is designed with one central handling for small footprint application. Batch C is used to treat the surfaces of semiconductor wafers, like etching, plating, cleaning and drying with standardised machines and guaranteed processes or entirely customised euipment.
  • (20180618)
    RENA EPM is designed for all plating applications with manual or fully automated handling system. Pure metal and alloy deposition as Au, Ag, Cu, Sn, Ni, SnAg for different applications in semiconductor and microsystem technologies. Enhanced liquid flow and electrical field control ensure a homogenous deposition at highest plating rates.

 Products

  • EPM
    RENA EPM is designed for all plating applications with manual or automated handling system. Pure metal and alloy deposition as Au, Ag, Cu, Sn, Ni, SnAg for different semiconductor and microsystem technologies....

  • Benefits:

    • Enhanced liquid flow and electrical field control ensure a homogenous deposition at highest plating rates

    • Modular design allows maximum flexibility

    • Flexible small footprint

    • Convertible for 2”, 3”, 4”, 5”, 6”, 8” and 12” substrates

    • Additional process modules for pre-treatment, etching, rinsing and drying

    • Various options available: pH-control, automatic dosage , forward/reverse pulse plating

    • Applications like functional metal layers for MEMS, micro forming & molding, optoelectronics, bumping for WLP

  • Batch C
    RENA Batch C equipment is designed with a central handling for small footprint application. Batch C is used for surfaces treatment of semiconductor wafers, like etching, cleaning and drying with guaranteed processes or entirely customised application....

  • Benefits:

    • High process flexibility and process analysis and control

    • Applications Semiconductors, MEMS, LED, OLED, Optoelectronics, Plastic Electronics

    • All wet process applications in FEOL and BEOL

    • Wafer handling system for standard carrier

    • Flexible input / output

    • Advanced scheduling and throughput simulation

    • Modular design allows maximum flexibility

    • All kind of substrates from 4” up to 12”

    • Clean room class up to ISO class 3

    • Minimized footprint and quick start up

    • Manufactured according to SEMI standards

  • Batch S
    RENA Batch S equipment is designed with a front handling for all semiconductor wet chemical applications. Batch S is used for surface treatment of wafers like etching, cleaning, drying with guaranteed processes or entirely customised application....

  • Benefits:

    • High process flexibility and process analysis and control

    • Applications Semiconductors, MEMS, LED, OLED, Optoelectronics, Plastic Electronics

    • All wet process applications in FEOL and BEOL

    • Wafer handling system for standard carrier, low mass carrier and Carrierless

    • Flexible input / output

    • Advanced scheduling and throughput simulation

    • Modular design allows maximum flexibility

    • All kind of substrates from 4” up to 12”

    • Clean room class up to ISO class 3

    • Minimized footprint and quick start up

    • Manufactured according to SEMI standards


 Additional Info

New Exhibitor:
No
New Products:
Yes
Displaying Equipment:
No
Product Demonstrations:
No
Please indicate which industries/technologies your company serves
MEMS, Photovoltaic, Power Semiconductors, Semiconductor

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