QES Mechatronic Sdn. Bhd.

No. 9, Jalan Juruukur U1/19
Hicom Glenmarie Industrial Park, Seksyen U1
Shah Alam, Selangor,  Selangor DE  40150

Malaysia
http://www.qesnet.com
  • Booth: 5258


Welcome to QES Mechatronic

QES Mechatronic Sdn Bhd was founded in June 1999 and started operating in year 2000. Strong R&D and technology partnerships allowed us to be a global manufacturer of inspection and handling equipments. QES Mechatronic Sdn Bhd is a member of QES Group of Companies.

Headquartered in Hicom-Glenmarie (Malaysia) and ISO BS EN ISO9001:2008 certified. With a staff strength of 50 people providing sales and services support together with our sales channel partners and distributors covering primarily markets in Asia and Europe. We currently have more than 500 machines installed globally.


 Press Releases

  • https://www.nst.com.my/business/2018/03/342763/qes-ride-semiconductor-growth-wave

    KUALA LUMPUR: ACE Market debutant QES Group Bhd sees growing demand for semiconductors particularly its automatic vision inspection and automated handling equipment.

    Managing director/president Chew Ne Weng said the company is optimistic about the semiconductor industry outlook as more big multinational customers increased their investments in automated handling equipment.

    “We believe the semiconductor industry is still riding on the upcycle. Hence, we do not foresee any letdown in global semiconductor sales in the immediate term,” he said in a statement.

    QES’ core business is involved in the distribution of inspection, test and measurement equipment, materials and engineering solutions.

    QES also manufactures optical inspection equipment, automated handling equipment and advanced wafer measurement system.

    Chew said QES intends to develop three key products, expand its recurring income segment by implementing a customer relationship management software as well as diversify its market segments and products to penetrate the higher education, petrochemical and pharmaceutical industries.

    Of its total listing proceeds, RM10.72 million (37%) will be used mainly for capital expenditure (capex) to purchase demonstration equipment for its distribution division, increase its production capacity and upgrade its information technology equipment for operational use.

    It will further utilise RM7 million (24%) to repay bank borrowings; RM4.85 million (17%) for development of three key products under its manufacturing division; RM3.25 million (11%) for general working capital requirements while the remaining RM3 million (11%) to be used to defray listing expenses.

  • High Speed and high resolution of vision inspection system, PWB2000V is automated, reliable and effective solution for post die attach and post wire bond inspection. The system comes with the area scanning camera that capable to capture defects by using 2D vision system. Integrated with programmable dual XY stage and on-the-fly scanning method, the system capable to achieve high throughput demand in semiconductor industry. Moreover, the system can accommodate multiple input and output magazines at one time operation and eliminate the waiting time.

    Key Feature

    1. Programmable XY Linear Stage and integrated encoder interface with the resolution of 1 micron.

    2. On the fly area scanning with stroboscopic control

    3. High resolution camera up to 8.9MP

    4. 2D vision system capability

    5. Multiple magazine loader & dual scanning track mechanism

    6. Defect classification based on 5 vision tools

    7. Strip-mapping capability, 2D matrix code and SECS/GEM interface

    8. Various type of reject identification module such as puncher, laser, wire breaker and scriber

  • WHS3800 is designed to handle 8” and 12” wafer size for packing and unpacking process. The system equipped with Hirata wafer pre-aligner for wafer positioning and orientation check. It’s also comes with IOSS WID120 OCR reader for OCR and 2D matrix code reading. Inclusive of 4-axis robotic arm (radius-theta-height-flip axis) and 2-axis Cartesian robot with pick and place mechanism for wafer handling from/to wafer jar. Equipped with height sensor for picking up and placing accuracy of the wafers and vision sensor to differentiate the material type such as wafer, interleaf paper and spacer.

     

    Key Feature

    1.       Designed for 8” & 12” Wafer

    2.       Comes with 2 x Hirata FOUP ports that can accommodate FOUP/FOSB and 12” Open Cassette, Hirata adapter for 8” open cassette

    3.       1 x Wafer Canister Station (universal for 8” & 12 canister from various makers)

    4.       1 x Wafer Jar Station (universal for 8” & 12” wafer jar from various makers)

    5.       1x Interleaf paper Station (auto-conversion between 8” & 12” paper)

    6.       Hirata 4 axis ATM Robot (Radius-Theta-Height-Flip Axes)

    7.       Hirata Wafer Pre-Aligner (8 & 12” wafers)

    8.       IOSS WID120 OCR Reader

    9.       2 axis Cartesian Robot with Pick & Place mechanism for wafer handling from/to Wafer Jar

    10.   Built-in vision sensor for wafer, interleave paper or spacer detection

    11.   Built-in height sensor for accurate robotic handling

    12.   TCP-IP & RS232 Data Interfaces


 Products

  • PWB2000V
    POST WIRE BOND VISION INSPECTION SYSTEM...

  • High Speed and high resolution of vision inspection system, PWB2000V is automated, reliable and effective solution for post die attach and post wire bond inspection. The system comes with the area scanning camera that capable to capture defects by using 2D vision system. Integrated with programmable dual XY stage and on-the-fly scanning method, the system capable to achieve high throughput demand in semiconductor industry. Moreover, the system can accommodate multiple input and output magazines at one time operation and eliminate the waiting time.

    Key Feature

    1. Programmable XY Linear Stage and integrated encoder interface with the resolution of 1 micron.

    2. On the fly area scanning with stroboscopic control

    3. High resolution camera up to 8.9MP

    4. 2D vision system capability

    5. Multiple magazine loader & dual scanning track mechanism

    6. Defect classification based on 5 vision tools

    7. Strip-mapping capability, 2D matrix code and SECS/GEM interface

    8. Various type of reject identification module such as puncher, laser, wire breaker and scriber

  • WHS3800
    WAFER PACKING AND UNPACKING SYSTEM...

  • WHS3800 is designed to handle 8” and 12” wafer size for packing and unpacking process. The system equipped with Hirata wafer pre-aligner for wafer positioning and orientation check. It’s also comes with IOSS WID120 OCR reader for OCR and 2D matrix code reading. Inclusive of 4-axis robotic arm (radius-theta-height-flip axis) and 2-axis Cartesian robot with pick and place mechanism for wafer handling from/to wafer jar. Equipped with height sensor for picking up and placing accuracy of the wafers and vision sensor to differentiate the material type such as wafer, interleaf paper and spacer.

     

    Key Feature

    1.       Designed for 8” & 12” Wafer

    2.       Comes with 2 x Hirata FOUP ports that can accommodate FOUP/FOSB and 12” Open Cassette, Hirata adapter for 8” open cassette.

    3.       1 x Wafer Canister Station (universal for 8” & 12 canister from various makers)

    4.       1 x Wafer Jar Station (universal for 8” & 12” wafer jar from various makers)

    5.       1x Interleaf paper Station (auto-conversion between 8” & 12” paper)

    6.       Hirata 4 axis ATM Robot (Radius-Theta-Height-Flip Axes)

    7.       Hirata Wafer Pre-Aligner (8 & 12” wafers)

    8.       IOSS WID120 OCR Reader

    9.       2 axis Cartesian Robot with Pick & Place mechanism for wafer handling from/to Wafer Jar

    10.   Built-in vision sensor for wafer, interleave paper or spacer detection

    11.   Built-in height sensor for accurate robotic handling

    12.   TCP-IP & RS232 Data Interfaces

  • WHS100R
    BATCH WAFER ID READER...

  • WHS100R is mainly designed to handle 4” wafer size for wafer ID reading and store the ID information. The system suitable for SEMI standard 4” wafer with 25 slots of open cassette. It comes with wafer mapping system and programmable wafer orientation flat alignment to align the orientation of the wafer. The system is equipped with multi-touch panel PC and graphic user interface (GUI).

     

    Key Feature

    1. Designed to handle 4” wafer

    2. 1x open cassette station

    3. Cassette orientation sensors (detect reverse placement of cassette)

    4. Cassette “present” and “tilt” sensor

    5. In-cassette wafer slot mapping function

    6. Wafer orientation flat alignment mechanism integrated

    7. Programmable wafer rotation for various wafer ID locations

    8. Batch wafer ID reading (front & back wafer ID on orientation flat area)

    9. Recipe controlled mapping, alignment & wafer ID reading

    10. IOSS OCR reader

    11. Tower light for operation (red, yellow, green and blue)

    12. Cassette map file with XML format

    13. Multi touch panel PC & Windows 7 base GUI

    14. Optional SECS/GEM interfaces

    15. Optional RFID function


 Additional Info

New Exhibitor:
Yes
New Products:
Yes
Displaying Equipment:
No
Product Demonstrations:
No
Please indicate which industries/technologies your company serves
Power Semiconductors, Semiconductor

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